Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Substrates for Organic Field Effect Transistors (OFETs)
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Learn more:
ipms.fraunhofer.de
  • Industry News
  • 2024-03-27

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion. Customized designs enable the optimal measurement of semiconductors and conductors. Organic semiconductors are key components in organic electronics and photovoltaics. They are used to make flexible electronic devices and printed solar cells. Typical for this class of materials are low temperature processes as well as large area deposition and patterning using various coating and printing techniques. The active semiconductor materials significantly determine the performance of the entire system. Therefore, an easy to handle and reliable electronic characterization of conductivity, carrier mobility, contact resistance and on/off current ratio of these semiconductors is an essential requirement for material and process developers. Fraunhofer IPMS develops and manufactures silicon substrates with single transistor structures in bottom-gate architecture, which are used for the fabrication of organic field-effect transistors (OFETs) or for the characterization of electrical material parameters of conductive materials, e.g. for organic photovoltaics. Substrates for organic field-effect transistors (OFET) for the development of high-tech materials.

Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries
  • Event News
  • 2024-03-26

Thermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials. No other event provides the opportunity for professionals working across sectors like Automotive, Aerospace & Defense, Electronics, Energy, Telecoms/5G, and Medical to delve into the latest thermal innovations and solutions. Attendees can tap into the advantages of cross-sector networking and in-person engagements with the latest thermal materials, components, and technologies available in the market. Co-located with Ceramics Expo, this event is scheduled for April 29 – May 1, 2024 at Suburban Collection Showplace, Novi, Michigan, USA. Thermal Management Expo promises to showcase the latest systems, materials, and technologies to address thermal management challenges across several high-tech industries. Global market leading suppliers and manufacturers including Alloy Enterprises, Burger Group, Henkel, Huber, Linseis, Parker Hannifin, TCLAD, Thermtest and Stirweld, will be showcasing their innovative solutions. In addition to the exhibition, the free-to-attend conference will feature sessions led by technical experts from prominent companies like Intergalatic, Heraeus, Blueshift, Diabatix, Neural Concept, ZF Group and more. These sessions will provide insights into thermal management systems and design, covering topics such as supply chain optimization, EV thermal management, data center cooling, thermal design and AI, thermal simulation, microelectronics and semiconductors.

Digital WE Days: Expert Knowledge Online
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Learn more:
we-online.com
  • Event News
  • 2024-03-26

The transfer of expertise is a fundamental element of Würth Elektronik's service concept. This includes in-depth expert presentations in digital format. As part of Digital WE Days, experts from Würth Elektronik and its partner companies will be presenting on important topics like intelligent power and control systems, EMC, electromechanics, wireless power, optoelectronics, and PCBs. "Last year, more than 4,300 participants took advantage of our online service offerings," says Alexander Gerfer, CTO at Würth Elektronik eiSos. "This shows that we are in touch with the times with our Digital WE Days. We are continuing this successful concept this year." From April 22 to 25, 2024, experts from Würth Elektronik, Rohde & Schwarz, onsemi, Infineon, Texas Instruments, Cambridge GaN Devices, Silent Solutions, as well as Wired & Wireless Technologies, will provide for a varied and high-caliber presentation program. A 30-minute presentation is followed by an interactive Q&A session lasting around a quarter of an hour, which further deepens the knowledge imparted in the expert presentation. "We know the current market and technology trends as well as our customers," Gerfer continues. "On this basis, we've once again put together an interesting and contemporary presentation program this year – from practitioners for practitioners." Digital WE Days 2024 is a free service from Würth Elektronik. All presentations can be booked individually. Registration for the virtual conference is now open. 

Exhibition spreading from Coil-Winding to e-Mobility
  • Event News
  • 2024-03-25

Taking place from May 14-16 2024, this CWIEME Berlin exhibition will see leading professionals come together to discuss and showcase innovative products from the coil winding, transformer, generator, electric motor manufacturing and e-mobility sectors. For 2024, the event has secured many industry professionals to participate in sessions and talks that will discuss latest innovations, technologies and key issues in the electrical engineering industry. Confirmed speakers include representatives from The International Copper Association, Syensqo, S&P Global Mobility, Siemens Energy, Thyssenkrupp Steel Europe, Hitachi Energy, SGB-SMIT GmbH, STILRIDE, Mckinsey Center for Future Mobility and Ford Europe. The central stage will cover a host of topics such as innovation in transformers oils, driving sustainability in the manufacturing and energy sectors with a deep dive into eco-friendly practices in the steel industry, and a panel discussion on what the future holds for rare earth materials. The e-mobility stage will host talks including a keynote speech on decarbonisation in the automotive sector, a session on the importance of reliability for electric vehicle (EV) infrastructure, a panel discussion on the emerging trends, a talk on innovations and advancements in new motor technologies, and a session on how the automotive industry can remain competitive in the age of electrification.

Successful Funding of GaN Technology Company
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Learn more:
q-p-t.com
  • Industry News
  • 2024-03-25

Cambridge/UK-based QPT, a company which is active in developing highly efficient GaN-based electric motor controls, has announced that its Crowdcube funding round has just passed the one million pound milestone. Rupert Baines, QPT's new CEO, said, "QPT has a … combination of an amazing technology that can cut the power consumption of electric motors by 10% thereby providing a way to actively help reduce climate change and a management team of veterans of the GaN industry." QPT's qGaN technology is a solution for the issues of overheating and RF interference that currently limit the speeds that GaN can be driven at. "Now GaN transistors can be run at much higher speeds than any other rival technology – 20 times faster than SiC for example", Rupert Baines adds. "Our solution is smaller with a significantly lower system cost and saves more energy than rivals according to our studies. I am really excited to be heading a company with a real roadmap to make the world a better place."

Polyimide Coated Magnet Wires for >800 V
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Learn more:
bieglo.com
  • Product Release
  • 2024-03-21

Electrical breakdown of high-temperature insulation materials can be prevented by using thermoplastic Polyimide, TPI. This polymer can be extrusion-coated as other polymers, but AURUM®, TPI reduces electrical and magnetic losses. With 245 °C AURUM claims to have the highest Tg of any commercially available Thermoplastic, and its insulation performance especially at temperatures above 150 °C is stated to beat any other know insulation. AURUM reduces electrical and magnetic losses with a comparative tracking index (CTI) of > 600 volts. Thermoplastic Polyimide (TPI) produced by Mitsui Chemicals of Japan, and sold by BEIGLO GmbH is known for its thermal stability, high-temperature resistance, and electrical insulation properties. TPI coated magnet wires are a suitable choice for high-voltage applications (800 V and above).

Automotive N-Channel MOSFETs for 48 V Applications
  • Product Release
  • 2024-03-21

Toshiba has launched two automotive N-channel power MOSFET devices to meet the growing demand for 48 V batteries and systems within automotive applications including inverters, semiconductor relays, load switches, motor drives and more. The 80V XPQR8308QB and 100V XPQ1R00AQB are based upon Toshiba's U-MOS X-H process. This gives low levels of on-resistance with the XPQR8308QB measuring less than 0,83 mΩ while the XPQ1R00AQB does not exceed 1,03 mΩ. The devices are rated for ID values of 350 A (XPQR8308QB) and 300 A (XPQ1R00AQB) continuously with pulsed values (IDP) of 1050 A and 900 A respectively. Supporting these values, the L-TOGL™ package adopts a thick copper clip-based leadframe structure that thermally and electrically connects the MOSFET die to the package leads. This reduces the package resistance by approximately 70% and channel-to-case thermal impedance by 50% compared with the TO-220SM(W) package. Together, the process and clip reduce losses and heat generation while creating a very thermally efficient solution. Furthermore, the L-TOGL package uses compliant gull-wing leads which reduce mounting stress and improve the reliability of solder joints. Both devices are AEC-Q101 qualified for automotive applications. Toshiba offers to ship devices grouped to within 0.4V based upon their gate threshold voltage.

Reference Design for Qi2 Wireless Charging Implementation
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Learn more:
microchip.com
  • Product Release
  • 2024-03-21

As major charger manufacturers, including those in the automotive industry, are working to implement Qi® v2.0 (Qi2) standards, Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) with support for magnetic alignment between the transmitter and the receiver. The DSC's flexible software architecture enables the support of a combination of MPP and Extended Power Profile (EPP) of Qi 2.0 with one controller. Utilizing the Qi2 reference design helps minimize customer risk in certifying their final product, which is required to pass through the Qi certification process. As it integrates several of Microchip's automotive-qualified parts, the dual-pad charger also meets automotive standards for reliability and safety and supports Autosar. An integrated CryptoAuthentication™ IC provides security to meet the stringent authentication requirement of Qi standards. The reference design is hardware reconfigurable and capable of supporting most transmitter topologies.

DC/DC Converter for 500 W with High Reliability
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Learn more:
gaia-converter.com
  • Product Release
  • 2024-03-21

The MGDS-500 Series from Gaia feature a full range of high density, wide input range DC/DC power modules designed for aerospace, military and high-end industrial applications. With 500 W output power, the MGDM-500 Series is particularly suitable for ultra compact power supply design. Standard models are available with wide input voltage ranges of 9-36VDC and 16-80VDC, and provide output voltages of 12, 15, 24, 28, and 48 VDC. Over the entire 500 W output power range the MGDM-500, which is integrated into a half-brick package, operates with an efficiency of up to 91%. Its Galvanic isolation is 1500 VDC, while the switching frequency is 300 kHz. Trim adjustment is possible from 90% to 110%, and the external synchronization range is specified 270 to 330 kHz. The synchronization function allows more than one converter to operate with an external source frequency. All modules incorporate LC network filters to minimize reflected input current ripple and output voltage ripple. The modules have totally independent functions including input under voltage lock-out, output overvoltage protection, output current limitation protection, and temperature protection. Additionally, a soft-start function allows current limitation and eliminates inrush current during start-up.

Akquisition of Industrial Drive Technology Company
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Learn more:
siemens.com
  • Industry News
  • 2024-03-21

Siemens has signed an agreement to acquire the industrial drive technology (IDT) business of ebm-papst. The business, which employs around 650 people, includes intelligent, integrated mechatronic systems in the protective extra-low voltage range and innovative motion control systems. These systems are used in free-range driverless transport systems. The transaction is to be completed by mid-2025, subject to the necessary foreign trade and merger control approvals. The IDT business of ebm-papst is located in St. Georgen, Germany and Lauf an der Pegnitz, Germany, as well as in Oradea, Romania.

Industrial AC/DC Power Supplies
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Learn more:
lambda.tdk.com
  • Product Release
  • 2024-03-21

TDK Corporation introduced its ZWS-C series of 10, 15, 30 and 50 W rated industrial AC/DC power supplies. The products meet EN55011/EN55032-B conducted and radiated EMI in either a Class I or Class II (double insulated) construction, without the need for external filtering or shielding. With electrolytic capacitor lifetimes of up to 15 years, the ZWS-C can be used in factory automation, robotics, semiconductor fabrication manufacturing and test and measurement equipment. Available output voltages are 5 V, 12 V, 15 V, 24 V as well as 48 V for the ZWS50-C model only. The ZWS10-C and the ZWS15-C models measure 63.5 x 45.7 x 22.1 mm3 (L x W x H), the ZWS30-C 76.2 x 50.8 x 24.2mm3, and the ZWS50-C 76.2 x 50.8 x 26.7 mm3. The operating temperature with convection cooling and standard mounting is -10 oC to 70 oC derating linearly to 50% load above 50 to 70 oC. With an external airflow of 0.8 m/s, the power supplies can operate at full load. No load power consumption is typically less than 0.3 W. The power supplies have a 3 kVac input to output, 2 kVac input to ground and 750 Vac output to ground (Class I) isolation. All models are certified to the IEC/UL/CSA/EN62368-1 for AV, information and communication equipment standard and EN60335-1 for household electrical equipment.

Paving the Way to use Diamonds in UWBG Semiconductors
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Learn more:
heraeus-group.com
  • Industry News
  • 2024-03-20

Heraeus is making a multi-million-euro investment in Compound Semiconductor (Xiamen) Technology Co. (CSMH), a China-headquartered material supplier of premium industrial diamond. This strategic partnership aims to drive innovations in the semiconductor industry by leveraging diamond's unique thermal conductivity and electrical insulation properties. Heraeus signed an investment agreement with CSMH, and the deal is expected to close in several weeks. As part of the agreement, Heraeus will hold a stake in the company and receive a seat on the board of directors. Single-crystal diamond is ultra-wideband gap (UWBG) semiconductor material with the highest known thermal conductivity, surpassing existing thermal solutions such as copper by several times. Typical silicon has a thermal conductivity around 140 W/(m-K), copper is about 400 W/(m-K), and diamond has a much higher thermal conductivity up to 2200 W/(m-K). This allows heat to be dissipated more efficiently, enabling high-performance components to endure with maximum efficiency. In addition to its superior heat dissipation properties, diamond also withstands extremely high voltages without causing an electric breakdown. This is critical for advancing miniaturization, efficiency, and robustness in power electronics. CSMH's core business includes the production of polycrystalline and large-sized monocrystalline diamonds, which are particularly important for high-end applications in the semiconductor industry.

Conference on Topics around Electric Drives Production
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Learn more:
edpc.eu
  • Event News
  • 2024-03-19

The Electric Drives Production Conference (E|DPC) 2024 is a platform for the exchange of developers, researchers and users of electric drives. Now the call for papers is open to present the latest technical expertise in front of professionals from science and industry. The E|DPC will take place as a hybrid event from November 26 to 27, 2024 at the marinaforum Regensburg and online. Key topics include electric machine design, power electronics and control methods, new materials and semi-finished products, magnet materials and processing, manufacturing technologies for soft magnetic materials, winding technologies, insulation technologies, assembly and handling technologies, electric drive production systems, production of electrical actuators, industry 4.0 applications in electric drives production, sustainability in product lifecycle, new applications for electric drives, electromobility, electric drive specific testing, accompanying economic research, additive manufacturing, energy transfer for electric vehicles and interconnecting technologies.

GaN for Low-cost E-Bikes, Drones, and Robotics
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Learn more:
epc-co.com
  • Product Release
  • 2024-03-19

EPC now offers the EPC9193, a 3-phase BLDC motor drive inverter using the EPC2619 eGaN FET. The EPC9193 operates with a input DC voltage ranging from 14 V and 65 V and has two configurations – a standard unit and a high current version: While the EPC9193 standard reference design uses a single FET for each switch position for delivering up to 30 Arms maximum output current, a high current configuration version of the reference design, the EPC9193HC, uses two paralleled FETs per switch position with the ability to deliver up to 60 Apk (42 Arms) maximum output current. Both versions of the EPC9193 contain all the necessary critical function circuits to support a complete motor drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions. The EPC9193 boards measure 130 mm x 100 mm (including connector). Major benefits of a GaN-based motor drive are exhibited with these reference design boards, including lower distortion for lower acoustic noise, lower current ripple for reduced magnetic loss, and lower torque ripple for improved precision. The extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight. EPC provides full demonstration kits, which include interface boards that connect the inverter board to the controller board development tool for fast prototyping that reduce design cycle times.

Trade Show in Kuala Lumpur, Malaysia: Doubling Participation
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Learn more:
semiconsea.org
  • Event News
  • 2024-03-19

With the Southeast Asia semiconductor sector attracting growing worldwide investments as more regions diversify their supply chains, the stage is set for SEMICON Southeast Asia 2024 as visionaries and experts gather May 28-30, 2024 at MITEC in Kuala Lumpur, Malaysia for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development. Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 will feature more than 500 exhibiting companies and more than 1,000 booths, doubling participation from last year's exhibition and conference. The exponential expansion underscores the rising interest in Southeast Asia's semiconductor sector and the increasing importance of SEMICON Southeast Asia, the region's premier global electronics manufacturing and supply chain event, in bringing industry stakeholders together to pursue new innovation and growth opportunities. For example, there will regional pavilions from semiconductor regions such as China, Europe, Malaysia, Netherlands, Korea, Singapore, Taiwan and Southeast Asia. Several forums will focus on market and industry trends, sustainability, chiplet and heterogeneous integration, advanced product testing and more. In industry gala night will enable the attendees to connect and to expand their business network.

Primary LDO Family for Automotive Applications
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Learn more:
rohm.com
  • Product Release
  • 2024-03-14

ROHM has developed 45 V rated 500 mA output primary LDO regulators, the BD9xxM5-C series. These devices are suitable for supplying power to automotive electronic components such as ECUs that operate from vehicle batteries. The BD9xxM5-C incorporates original QuiCur™ high-speed load response technology that is stated to deliver excellent response characteristics to load current fluctuations. For example, the LDO can maintain output to within 100 mV of set voltage even as the load changes between 0 and 500 mA in 1 µs (Rise time/Fall time). Furthermore, low 9.5 µA (typ.) current consumption contributes to lower power consumption in automotive applications. These products will be available in four packages, ranging from the compact HTSOP-J8 to the high heat dissipation TO252 (TO252-3/TO252-5) and HRP5 types. This allows users to select the most suitable package for each use case. The BD9xxM5-C meets the basic requirements for automotive products, including 150 °C operation and qualification under the AEC-Q100 automotive reliability standard. The lineup will be expanded to comprise a total of 18 models, (including the TO252-3, TO252-5, and HRP5 packages) by FY2024.

Trade Show about EMC Components, Testing and Shielding
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Learn more:
emv.mesago.com
  • Event News
  • 2024-03-14

The EMV achieved an impressive response in Cologne from March 12 - 14, 2024. The trade fair, accompanied by a scientific conference with workshops, featured 111 national and international exhibitors from 20 countries. Key players such as Rohde & Schwarz, Frankonia and EMC Test NRW as well as 21 companies, taking part in the EMV for the first time, were also present. More than 2,500 trade visitors – including the editorial team of Bodo's Power Systems – took the opportunity to find out about the industry's entire range of topics: from filters and filter components to EMC testing and shielding including its latest developments. A lively exchange of specialist knowledge was also high on the agenda in Cologne. Current trends this time around included EMC in electromobility, smart technologies, power electronics and the use of artificial intelligence in EMC. Parallel to the trade fair, the EMV Conference offered an extensive program with 49 conference lectures, 24 workshops and poster presentations held for the first time. The event demonstrated the growing importance of EMC in an increasingly networked world. In view of the growing number of potential sources of interference and even more complex systems, it has become clear that awareness of EMC issues is steadily rising. More than 700 conference bookings illustrated the high level of interest in the event. The next EMV event will take place from 25 - 27.3.2025 in Stuttgart.

Oscilloscope Days Event
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Learn more:
rohde-schwarz.com
  • Event News
  • 2024-03-13

Rohde & Schwarz has announced that its Oscilloscope Days educational event will return for two days, April 17 to 18, 2024. Experts from Rohde & Schwarz and partner companies will present the latest updates on fundamentals and test features for engineers using next-generation oscilloscopes, covering topics such as power electronics and EMC, as well as signal and power integrity. The Oscilloscope Days event will be hosted online over two days and will deliver insights into the accurate measurement of digital signals and power electronics for purposes including product design, development, debugging and compliance testing. Rohde & Schwarz application engineers, together with experts from long-time event partners Würth Elektronik and PE-Systems, will present measurement challenges and techniques. There will be eight online sessions of up to 30 minutes each over the two mornings, with time for questions and answers after each session. Each session will be presented in English and will include cases based on real applications. Registrants can select the sessions they wish to attend.

200 V MOSFETs stated to set a new Industry Benchmark
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Learn more:
infineon.com
  • Product Release
  • 2024-03-13

Infineon claims that motor drive applications are taking a leap forward with the launch of the company's OptiMOS™ 6 200 V MOSFET product family. The new portfolio is designed to deliver high performance in applications such as e-scooters, micro-EVs, and E-forklifts. The improved conduction losses and switching behavior for these MOSFETs reduce the electromagnetic interference (EMI) and switching losses e. g. in applications like servers, telecom, energy storage systems, audio and solar. Additionally, the combination of a wide safe operating area (SOA) and "industry-leading R DSon" fits to static switching applications such as  battery management systems. With the introduction of the OptiMOS 6 200 V product family, Infineon claims to set "a new industry benchmark with increased power density, efficiency, and system reliability". Compared to its predecessor, OptiMOS 3, OptiMOS 6 200 V features a 42 percent lower R DSon and a diode behaviour softness, which is more than three times that of the OptiMOS 3. Combined with up to 89 percent reduction in Q RRtyp, the switching and EMI behaviors are significantly improved. The technology also features improvements in parasitic capacitance linearity (C oss and C rss), which reduces oscillation during switching and lowers voltage overshoot. A tighter V GSth spread and lower transconductance aid in MOSFET paralleling and current sharing, leading to more uniform temperatures and reducing the number of paralleled MOSFETs.

Resettable Thermal Cutoff Devices
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Learn more:
bourns.com
  • Product Release
  • 2024-03-12

Bourns announced some miniature resettable thermal cutoff (TCO) device series, also known as mini-breakers, that are designed to control abnormal, excessive current virtually instantaneously, up to rated limits. The Model NX Series offers higher current-carrying capabilities combined with a very low-profile package at a height of 0.94 mm and body width of 2.8 mm. These features make this series an ideal overtemperature and overcurrent protection solution for lithium polymer and prismatic cells in high energy density, smaller batteries such as next-generation notebook PC and tablet battery cells, as well as handheld and wearable electronics. With the same footprint as the company's model NR series the model NX series can carry 40 percent more current. The new Model NX Series has current capabilities from 12 A to 20 A at 60 °C and is available with or without welding projections. These TCO devices are available with four trip temperature options of 77 °C, 82 °C, 85 °C and 90 °C - all of which operate within a ±5 °C tolerance. The Model NX Series also is designed with a high-rated corrosion resistant bimetal mechanism that delivers enhanced endurance in humid environments compared to standard TCO devices.

Automotive-grade Super-Junction MOSFETs
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Learn more:
st.com
  • Product Release
  • 2024-03-11

Automotive-grade 600 V/650 V super-junction MOSFETs in STPOWER MDmesh DM9 AG series are claimed to deliver superior efficiency and ruggedness for on-board chargers (OBCs) and DC/DC converter applications in both hard- and soft-switching topologies. Compared to the previous generation, the latest MDmesh DM9 technology ensures a tighter gate-source threshold voltage (VGSth) spread that results in sharper switching for lower turn-on and turn-off losses. In addition, body-diode reverse recovery is improved, leveraging a new optimized process that also increases the MOSFETs' overall ruggedness. The diode's low reverse-recovery charge (Qrr) and fast recovery time (trr) make the MDmesh DM9 AG series well-suited for phase-shift zero-voltage switching topologies that demanding high efficiency. The first device in the STPOWER MDmesh DM9 AG series from STMicroelectronics is the STH60N099DM9-2AG, a 27A AEC-Q101 qualified N-channel 600 V device in H2PAK-2, with 76 mΩ typical RDSon. ST will expand the family to provide a full range of devices, covering a broad range of current ratings and RDSon from 23 mΩ to 150 mΩ.

GaN and SiC Technologies to Enable Next-Gen AI Power Delivery
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Learn more:
navitassemi.com
  • Product Release
  • 2024-03-11

Navitas Semiconductor has announced their AI data center technology roadmap for up to 3x power increase to support similar exponential growth in AI power demands expected in just the next 12-18 months. To meet this exponential power increase, Navitas is developing server power platforms which rapidly increase from 3kW to up to 10kW. In August 2023, Navitas introduced a 3.2kW data center power platform utilizing latest GaN technology enabling over 1638.7W/cm3 and over 96.5% efficiency. Now, Navitas is releasing a 4.5kW platform enabled by a combination of GaN and SiC to push densities over 2131.1W/cm3 and efficiencies over 97%. Navitas also announces its plans to introduce an 8-10kW power platform by the end of 2024 to support 2025 AI power requirements. The platform will utilize newer GaN and SiC technologies and further advances in architecture to set all-new industry standards in power density, efficiency and time-to-market. Navitas is already engaged with major data-center customers, with full platform launch anticipated in Q4 ’24, completing this 3x increase in power demands in only 12-18 months.

1200-V IGBTs on 300 mm Wafers
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Learn more:
hitachienergy.com
  • Industry News
  • 2024-03-06

Hitachi Energy increases its power semiconductor capacity by introducing the 300 mm wafer. The development enables more complex structures in 1200 V insulated gate bipolar transistors. Applications for IGBT include variable frequency drives (VFD), uninterruptible power supply (UPS) systems, electric cars, trains and air conditioners, among others. The larger wafer offers numerous benefits, including the potential to yield over double (2.4 times) the number of functioning integrated circuits per wafer as compared to the existing 200 mm wafer, leading to significant cost savings. It utilizes the latest fine pattern trench IGBT design, resulting in energy-efficient power conversion and control and minimizing power losses during operations. Semiconductor experts at Hitachi Energy achieved this milestone through close collaboration with a cross-functional team, including Product Management, Business Development, Research & Development, and a chip foundry partner.

Silicon Carbide Technology drives Decarbonization
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Learn more:
infineon.com
  • Product Release
  • 2024-03-05

The Infineon CoolSiC™ MOSFET 650 V and 1200 V Generation 2 improve MOSFET key performance figures such as stored energies and charges by up to 20 percent compared to the previous generation without compromising quality and reliability levels leading to higher overall energy efficiency and further contributing to decarbonization. CoolSiC MOSFET Generation 2 (G2) technology continues to leverage performance capabilities of silicon carbide by enabling lower energy loss that turns into higher efficiency during power conversion. This provides strong benefits to customers for various power semiconductor applications such as photovoltaics, energy storage, DC EV charging, motor drives and industrial power supplies. A DC fast charging station for electric vehicles which is equipped with CoolSiC G2 allows for up to 10 percent less power loss compared to previous generations, while enabling higher charging capacity without compromising form factors. Traction inverters based on CoolSiC G2 devices can further increase electric vehicle ranges. In the area of renewable energies, solar inverters designed with CoolSiC G2 make smaller sizes possible while maintaining a high power output, resulting in a lower cost per watt.

Energy Harvesting Workshop in Italy
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Learn more:
enerharv.com
  • Event News
  • 2024-03-05

A Workshop named EnerHarv 2024 is said “to bring together experts from around the world working on all technical areas relevant to energy harvesting, power management and its IoT applications”. This non-profit workshop, organized and sponsored by the Power Sources Manufacturers Association (PSMA), will be held in Perugia, Italy from June 26 to 28, 2024. The event will be hosted by the Noise in Physical Systems (NiPS Lab), Dept. of Physics & Geology of the University of Perugia (UNIPG). EnerHarv’s vision is “to create a focal point for experts and users of energy harvesting and related technologies to share knowledge, best practices, roadmaps, experiences and provide opportunities for collaboration to increase the uptake of such technologies”. The workshop is targeted at a broad audience from industry and academia working on materials and devices for energy harvesting and storage, low-power sensors and circuits, micro power management, and their applications in powering IoT devices for health and environmental monitoring, assisted living, and monitoring of equipment and buildings. It will comprise presentations (by invitation only), demos, poster, panels sessions and time for networking activities. There is an open call for demonstrations and posters.

Going for Mass Production: Funding Round to Support Growth for GaN Solutions
  • Industry News
  • 2024-03-01

Wise-integration, a French company active in digital control of gallium nitride and GaN ICs for power supplies, has secure financing of 15 million Euros. The Series B round was led by imec.xpand with participation from other investors. The round will fuel mass production and commercial deployment of the company’s flagship products, WiseGan and WiseWare, its “disruptive digital-control technology”, and its support for clients globally as they adopt these solutions. It included the five investors from the previous funding and three new investors. Since its launch in 2020, the fabless company has been known as an innovator in the power electronics industry, building a portfolio of more than 10 patent families. WiseGan encompasses GaN power integrated circuits designed to maximize the benefits of GaN technology. WiseWare is a 32-bit, MCU- based, AC/DC digital controller optimized for GaN-based power supply architectures, which is said to offer simplified system design, a lower bill of materials and improved power density and efficiency. This combination enables the development of technologies facilitating chargers that are up to 3x smaller, 3x more efficient, and 3x lighter, catering to power requirements from 30 W to 7 kW. The company’s target markets include consumer electronics to industrial applications to electric vehicles.

PoE ASFETs and EMC-optimized MOSFETs
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Learn more:
nexperia.com
  • Product Release
  • 2024-02-27

Nexperia announced the release of several MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets. This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance. PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging. A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in RDS(on).  These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example. EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower RDS(on) (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count. Nexperia has optimized its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.

Collaboration to Accelerate Automotive Electrification
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Learn more:
fiveyearsout.com
  • Industry News
  • 2024-02-26

Arrow Electronics and its engineering services company, eInfochips, are working with Infineon Technologies to help eInfochip’s customers accelerate the development of electric vehicle (EV) chargers. Development of EV chargers, especially DC “fast chargers,” is becoming increasingly challenging to equipment manufacturers due to several factors, such as lack of prior experience, stringent functional safety and reliability requirements, and a fledgling support network. The collaboration between Arrow and Infineon aims to help innovators navigate these challenges while accelerating time-to-market. As part of the collaboration, Arrow’s High Power Center of Excellence has developed a 30 kW DC fast charger reference platform. This includes Infineon’s 1200V CoolSiC easy power modules and also hardware design, embedded firmware, bi-directional charging support and energy metering functionality.

Joint Solution for BLDC Motors
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Learn more:
ambersi.com
  • Industry News
  • 2024-02-26

AmberSemi and ST Microelectronics have jointly developed a reference design for brushless motors by using AmberSemi’s AC Direct DC Enabler Power Conversion Technology and ST’s STM32 MCU devices. The reference design takes a direct AC input through AmberSemi’s patented AC Direct DC Enabler technology and powers the ST microcontroller, gate drivers and Hall sensors for brushless motor applications. Compared to typical brushless DC motor-control design, AmberSemi’s off-line solution provides up to 5 W of regulated output, which is enough to drive today's requirement of control logic and sensors, with additional headroom for expanded intelligent functionality. The Enabler offers selectable output voltages determined by internal, configurable register settings or with a simple external voltage-divider feedback circuit. Through the integrated SPI communication port and coupled with an SPI-equipped MCU the designer can set alarm bits, protection thresholds, monitor status bits for over-current, over/under voltage, over-temperature and interrupt signals on the Enabler.

IGBT based Intelligent Power Modules
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Learn more:
onsemi.com
  • Product Release
  • 2024-02-26

onsemi announced the availability of its 1200V SPM31 Intelligent Power Modules (IPMs) featuring the latest generation Field Stop 7 (FS7) Insulated Gate Bipolar Transistor (IGBT) technology. The SPM31 IPMs deliver higher efficiency, smaller footprint and higher power density resulting in lower total system cost. Given the greater efficiency realized using optimized IGBTs, these IPMs are ideal for three-phase inverter drive applications such as heat pumps, commercial HVAC systems, servo motors, and industrial pumps and fans. The SPM31 IPMs control the power flow to the inverter compressor and fans in heat pumps and air conditioning systems by adjusting the frequency and voltage of the power supplied to three-phase motors for maximum efficiency. For example, onsemi’s 25A-rated SPM31 using FS7 IGBT technology can decrease power losses by up to 10% and increase in power density up to 9%, compared to our previous generation products. With the transition to electrification and heightened efficiency mandates, these modules help manufacturers drastically improve system design while increasing efficiency in heating and cooling applications. With the improved performance, our SPM31 IPM family featuring FS7 enables high efficiency with reduced energy losses, further reducing harmful emissions globally.

Series of Supercapacitor Modules
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Learn more:
rutronik24.com
  • Product Release
  • 2024-02-22

With the Supercapacitor modules of the SCM series from KYOCERA AVX, Rutronik offers robust components for industrial applications that require high peak performance. The SCM series is suitable for high-current or industrial applications, including renewable energy generation, grid-connected storage, or the buffering of power peaks. Thanks to active balancing, the capacitor modules have a stable voltage level in the individual cells installed in the module. They operate individually or in combination with batteries or accumulators. Either they supply energy as a backup or support providing power peaks together with batteries or accumulators. In this case, they often have a positive effect on the service life of the battery or accumulator. Due to the convincing characteristics of the individual capacitors used, the SCM modules achieve their special pulse load capacity. The combination of very high capacitance and very low internal resistance (ESR) enables a high power density and high efficiency. The modules are also characterized by a high mechanical load capacity and can withstand high currents, frequent charging and discharging cycles, and strong vibrations. They are designed for operating temperatures from -40 °C to +65 °C and can handle several million cycles, depending on the application. In addition, the modules are lead-free, RoHS-compliant, and meet the UL 810A standard.

Additional Manufacturing Capacity for wBMS Semiconductors
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Learn more:
analog.com
  • Industry News
  • 2024-02-22

Analog Devices (ADI) has made a special arrangement with TSMC to supply long-term wafer capacity through Japan Advanced Semiconductor Manufacturing (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. Building on ADI’s more than 30-year partnership with TSMC, this adds another option for ADI to secure additional capacity of fine-pitch technology nodes to serve critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL) applications.

PWM Control, 700V GaN FET, X-Cap discharge, ACF Driver and UHV Start-up Regulator in Single Chip
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Learn more:
powerdensity.com
  • Product Release
  • 2024-02-22

Silanna Semiconductor has expanded its CO2 Smart Power Family™ of AC/DC and DC/DC converter technologies with the launch of an active clamp flyback (ACF) controller that integrates adaptive digital PWM control with ultra-high-voltage (UHV) components comprising a 700 V primary GaN FET, X capacitor (X-Cap) discharge circuit, active clamp driver and start-up regulator. Silanna’s CO2 Smart Power technologies help engineers by simplifying design and improving performance while addressing environmental sustainability goals through more efficient energy use. Well-suited for high-efficiency and high-power-density power supplies, USB-PD/QC AC/DC power adapters and battery charging applications, the SZ1200 integrated ACF controller combines the ease of design of a simple flyback controller with all the benefits of ACF. These include recycling of the leakage inductance energy of the flyback transformer and limiting primary FET drain voltage spikes during turn-off events. Delivering above 93% efficiency at low line, the SZ1200 offers consistent efficiency across the universal input voltage range (90 - 265 Vac) and various loading conditions of up to 150W single-port and multi-port USB-PD applications. Silanna’s OptiMode™ digital control architecture adjusts operation mode on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation and other key power supply parameters as line voltage and load vary. Very low no-load power consumption for the most stringent USB-PD applications further minimizes energy use during system stand-by.

Start-Ups present Energy and Mobility Solutions
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Learn more:
thesmartere.de
  • Event News
  • 2024-02-22

In order to demonstrate the impact of start-ups, The smarter E Europe, Europe’s largest alliance of exhibitions for the energy industry, provides them a platform of their own: the start-up area. In hall C5, across 2,500 square meters, around 150 start-ups will have the opportunity to present their pioneering energy and mobility solutions to a wide expert audience, and to connect with established companies. The smarter E Europe and its four exhibitions (Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe) will take place from June 19–21, 2024, at the Messe München fairgrounds. More than 2,800 exhibitors and over 115,000 visitors from all around the world are expected to attend. The event will take place across 19 exhibition halls and an outdoor exhibition area.

Two Backend Fabs sold – one in the Philippines, one in Korea
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Learn more:
infineon.com
  • Industry News
  • 2024-02-22

Infineon Technologies will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE Technology, a provider of independent semiconductor manufacturing services in assembly and test. The plants currently run under the entity names Infineon Technologies Manufacturing Ltd. – Philippine Branch (Cavite) and Infineon Technologies Power Semitech Co., Ltd. (Cheonan) and will be acquired by ASE Inc. and ASE Korea Inc. respectively. Post the transaction, ASE will assume operations with current employees, and further develop both sites to support multiple customers. As such, ASE and Infineon have also concluded long-term supply agreements under which Infineon will continue to receive previously established services as well as services for new products to support its customers and fulfill existing commitments. Infineon Technologies Power Semitech is a backend manufacturing site with around 300 employees. The fab is located in Cheonan, South Korea, about 60 miles south of Seoul. Infineon Technologies Cavite, is a backend manufacturing site with more than 900 employees. It is located in one of the fastest growing and most industrialized provinces in the Philippines. The transaction is expected to close towards the end of the second calendar quarter of 2024, when all pending closing conditions will have been fulfilled.

Magnetically Shielded Flat Wire Power Inductors
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Learn more:
sumida.com
  • Product Release
  • 2024-02-21

Sumida introduced two series of AEC-Q200 qualified power inductors, the DPQ3535/T150 and DPQ5050/T150. These inductors are magnetically shielded and have a pin-type base for surface mounting on printed circuit boards. High surface area flat-wire windings minimize internal resistance at high frequencies and allow space savings and higher current ratings. The DPQ3535/T150 series offers a range of inductance values from 3.3 µH to 22 µH. Maximum saturation current ranges from 28 to 152 amps at 150°C. The larger DPQ5050/T150 is of similar design, with an inductance value of 10 µH and a saturation current of 112 amps at 20 °C. The absolute maximum voltage across the inductor is 500Vdc for each. Operating temperature is -40 °C to +150 °C (including the device’s self-temperature rise). The flat-wire inductor is encased in ferrite and mounted on an insulating base. Circuit connectivity is by two robust flat, tinned copper pins. Two additional pins provide additional mounting stability. Size for the DPQ3535/T150 is (HWD) 33x38.7x38.2 mm. The DPQ5050/T150 measures 44x53.5x53.3 mm. Applications include use as a buck/boost inductor for Onboard Chargers (OBC) in electric vehicles (xEV), DC-DC converters, point-of-load converters, LED drivers, class D audio amplifiers, and other general high-performance power applications.

The Battery Show Europe
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Learn more:
thebatteryshow.eu
  • Event News
  • 2024-02-21

The Battery Show Europe and Electric & Hybrid Vehicle Technology Expo return to the Messe Stuttgart, Germany on 18-20 June, 2024. Bringing together 19,000 + engineers, executives, managers, R&D experts, manufacturing professionals, quality control experts, buyers, thought leaders and professionals from across the advanced battery and H/EV supply chain, this is an event that you can't miss! Explore 800+ advanced battery and EV manufacturing suppliers representing the entire supply chain from raw materials through end of life, featuring some stellar industry names such as Donaldson Filtration Solutions, Keyence, Siemens and Lyric Germany. Expand new ideas on increasing efficiencies and lowering costs at The Battery Show Europe Conference and Open Tech Forum. With 37+ hours of educational content, exploring the latest hot topics such as next-gen materials, advances in battery tech and sustainability, recycling and end of life options, this is the place to place to broaden your understanding of the advanced battery and H/EV industry. That's not all, we're also giving you the opportunity to learn about the latest market innovations and cutting-edge solutions during live product showcases from top-industry suppliers on the expo floor, as well as the chance to network with thousands of industry peers and form new relationships over drinks and light bites at our free-to-attend hosted networking receptions. Register today to attend the leading advanced battery and H/EV technology tradeshow and conference in Europe!

Higher Power Density with 100 V GaN Power Stages
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Learn more:
ti.com
  • Product Release
  • 2024-02-20

Texas Instruments introduced two power conversion device portfolios to help engineers achieve more power in smaller spaces. According to TI these devices are "providing the highest power density at a lower cost". TI's 100 V integrated GaN power stages, LMG2100R044 and LMG3100R017, feature thermally enhanced dual-side cooled package technology to simplify thermal designs and "achieve the highest power density in mid-voltage applications at more than 1.5 kW/in3", which equals about 91,5 W/cm3. TI claims that its 1.5 W isolated DC/DC modules with integrated transformers are "the industry's smallest and most power-dense, helping engineers shrink the isolated bias power-supply size in automotive and industrial systems by over 89 %". The devices allow designers to accomplish a system efficiency of 98% or higher given the lower output capacitance and lower gate-drive losses. A key enabler of the thermal performance in the 100 V GaN portfolio is the thermally enhanced dual-side cooled package. There is also an automotive-qualified solution available in this small package.

Seminars about Sensor and Measurement Topics
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Learn more:
ama-sensorik.de
  • Event News
  • 2024-02-20

The AMA Association for Sensors and Measurement (AMA) has published its seminar program for 2024, which includes a variety of seminars in German language on various topics, including ultrasonic measurement technology, optical spectroscopy, displacement measurement, industrial image processing and the discussion on "Chat-GPT - hype or hysteria". The seminars are offered online or as face-to-face events and are under scientific direction. They offer in-depth knowledge about sensors, sensor systems, their functions and possible applications. Participants are given the opportunity to choose the right sensors for their application and evaluate their advantages and disadvantages. The seminars are said to offer deep insights into specialist topics in sensor and measurement technology. The AMA seminars aim to provide participants with manufacturer-independent knowledge and to inform them about the current state of sensor and measurement technology. They are aimed at experts from the fields of design/development, research, production and sales.

Battery Exhibition and Conference
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Learn more:
ees-europe.com
  • Event News
  • 2024-02-20

The cooperation between ees Europe, an exhibition for batteries and energy storage systems and InterBattery, a battery exhibition in South Korea, enters its second round this year. The InterBattery Europe Showcase will once again provide visitors of ees Europe with an additional exhibition area where they can network with companies from South Korea. The Battery Day Europe conference complements the presentations in the exhibition area. This year, the conference will provide comprehensive insights into the world of EV batteries, covering everything from the latest legislation, how to secure battery materials as well as groundbreaking technologies and business trends. Special attention will be given to the German-Korean cooperation in the ReLioS network for innovative approaches to battery recycling. The conference will also shine a light on EV battery production technologies. ees Europe takes place from June 19–21, 2024 as part of The smarter E Europe, Europe's largest alliance of exhibitions for the energy industry, at Messe München in Munich. More than 115,000 visitors from all over the world and over 2,800 exhibitors – more than 1,000 of whom are battery and energy storage system suppliers – are expected to attend. The InterBattery Europe Showcase exhibition area is expected to host around 200 companies – including companies such as Samsung SDI, LG Energy Solution and SK On. Last year, this additional exhibition space presented 72 companies, 62 of which were South Korean.

Power Converters run on Vibrational Energy
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Learn more:
leti-cea.com
  • Industry News
  • 2024-02-20

University of California San Diego and CEA-Leti (located in Grenoble/France) scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density. This power topology, which extends beyond existing topologies, blends the advantages of piezoelectric converters with capacitive-based DC/DC converters. The power converters developed by the team are much smaller than the huge, bulky inductors currently used for this role. The devices could eventually be used for any type of DC/DC conversation, in everything from smart phones, to computers, to server farms and AR/VR headsets. The results were presented in the paper, "An Integrated Dual-side Series/Parallel Piezoelectric Resonator-based 20-to-2.2V DC/DC Converter Achieving a 310% Loss Reduction", at ISSCC 2024. The paper explains that a hybrid DSPPR converter exploits integrated circuits' ability to offer sophisticated power stages in a small area compared to discrete designs, and enables efficient device operation at voltage conversion ratios (VCR) of less than 0.1.

Plug-and-Play Gate Driver for High-Voltage SiC Power Modules
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Learn more:
microchip.com
  • Product Release
  • 2024-02-20

To help developers implement SiC solutions and fast-track the development process, Microchip Technology has developed the 3.3 kV XIFM plug-and-play mSiC gate driver with patented Augmented Switching technology, which is designed to work out-of-the-box with preconfigured module settings. To speed time to market, the complex development work of designing, testing and qualifying a gate driver circuit design is already completed with this plug-and-play solution. The XIFM digital gate driver is a compact solution that features digital control, an integrated power supply and a robust fiber-optic interface that improves noise immunity. This gate driver has preconfigured "turn-on/off" gate drive profiles that are tailored to optimize module performance. It incorporates 10.2 kV primary-to-secondary reinforced isolation with built-in monitoring and protection functions including temperature and DC link monitoring, Undervoltage Lockout (UVLO), Overvoltage Lockout (OVLO), short-circuit/overcurrent protection (DESAT) and Negative Temperature Coefficient (NTC). This gate driver also complies with EN 50155, a key specification for railway applications.

New EMEA Headquarters for Distributor
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Learn more:
eu.mouser.com
  • Industry News
  • 2024-02-20

Mouser Electronics has opened its new EMEA headquarters in Munich. The opening took place in the presence of distinguished guests from customers, manufacturers, members of the media, TTI and local support companies. The new office, which is located relatively close to the Olympic stadium and directly above a subway station, is already in operation: People from 23 nations work there. Mark Burr-Lonnon, Senior Vice President Global Service provided a look at the company history from $ 21 million of sales in 2008 to far more than $ 1 billion in 2023 – and all of this just in Europe. While Europe participated less than 10 % to Mouser's worldwide sales in 2008 it contributed almost exactly one third to Mouser's worldwide turnover in 2023. And this is why Mark Burr-Lonnon invited all guests to participate in an office tour after enjoying a piece of a Mouser celebration cake, that he cut in person.

Compact MOSFET Modules for Efficiencies of up to 98%
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Learn more:
semiq.com
  • Product Release
  • 2024-02-19

SemiQ added a product to its QSiC family. The QSiC 1200 V SiC MOSFET modules in full-bridge configurations deliver near zero switching loss, significantly improving efficiency, reducing heat dissipation, and allowing the use of smaller heatsinks. With a high breakdown voltage exceeding 1400 V, the QSiC modules in full-bridge configurations withstand high-temperature operation at Tj = 175 °C with minimal RDS(on) shift across the entire temperature spectrum. Using high-performance ceramics, SemiQ's modules are well-suited for demanding applications that require bidirectional power flow or a broader range of control, such as solar inverters, drives and chargers for Electric Vehicles DC/DC converters and power supplies. In solar inverter applications, SemiQ's technology allows reaching an efficiency of up to 98 % - as well as more compact designs. It helps reduce heat loss, improve thermal stability, and enhance reliability, backed by over 54 million hours of HTRB/H3TRB testing. The 1200 V MOSFETs also maximize efficiency gains in DC/DC converters while enhancing reliability and minimizing power dissipation. To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level, and all parts have undergone testing surpassing 1400V.

Distribution Agreement expanded to USA, Australia & New Zealand
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Learn more:
pulsiv.co.uk
  • Industry News
  • 2024-02-16

Pulsiv of Cambridge (UK) and Astute Electronics of Stevenage (UK) have expanded their distribution agreement to include USA, Australia and New Zealand. Astute Electronics was founded 35 years ago "to bridge the gap between broadline and independent distribution in the European supply chain". Still privately owned, the business now operates across five continents. Using a patented switching technique, Pulsiv has developed an special method for converting AC to DC that delivers a combination of benefits in power electronics designs. This technology has extended the range of conventional flyback topologies to replace expensive LLC solutions, while achieving "an unrivalled efficiency profile". Pulsiv offers Osmium microcontrollers which implement these switching techniques, AC/DC front-end circuit configurations that include a Pulsiv OSMIUM microcontroller and supporting components for a complete AC/DC front-end design as well as evaluation boards and reference designs.

Automotive-Grade 3-Phase SiC MOSFET Power Modules
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Learn more:
inventchip.com
  • Product Release
  • 2024-02-15

Inventchip announced the release of an automotive-grade 3-phase SiC MOSFET transfer-molded power module IVTM12080TA2Z. The module is 1200V 80mΩ in a compact, topside-cooling through-hole package with a plastic surface size of 23mm x 42mm. Compared with a discrete TO-247 solution, the module saves about 30% PCB space, and the more important thing is that the SiC MOSFET dies are arranged in a much more compact way, which reduces over all stray-inductance of power loops. The reduction of the stray inductance reduces MOSFET Vds overshoot, Vgs ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with the TO-247 solution with external electrical isolation assembly, the module with high performance ceramic lowers junction-to-heatsink thermal resistance by over 50% for the same 80m 1200V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The package has a minimum 5mm creepage from terminals to the package’s heatsink mounting surface, which can safely work for both 400V and 800V systems without isolation reinforce. For production, with isolated top-side cooling, the module solution eliminates any external isolation process and reduces system assembly time and cost. It also minimizes human assembly errors and improves product reliability.

Distributor stocks MOSFET Family with now higher Power Efficiency
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Learn more:
rutronik24.com
  • Product Release
  • 2024-02-15

Rutronik integrates the StrongIRFET™ 2 MOSFETs from Infineon into its product portfolio. This generation provides a higher power efficiency, which leads to improved overall system performance. Due to a higher current load tolerance, several parallel connected components are no longer necessary. That saves space on the PCB and reduces costs. The transistors are in stock and available in different housing variants such as TO-220; TO-220 FullPAK, D2PAK, D2PAK 7-pin, DPAK, and TOLL. Compared to the previous StrongIRFET components in the 40 V to 100 V range, the technology offers up to 40 percent better on-resistance and up to 60 percent lower nominal gate charge. In addition, higher rated currents enable improved current carrying capacity and the new generation is suitable for both high and low switching frequencies. Standard pinouts enable simple drop-in replacement. The MOSFETs are 100 percent safety-tested, RoHS-compliant, halogen-free following IEC61249-2-21 product validation, and meet the JEDEC standard. They can be used in a wide range of applications, e.g. for UPS, battery management, or motor drives.

Semiconductor Company to buy PCB Design Company
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Learn more:
renesas.com
  • Industry News
  • 2024-02-15

Renesas intends to acquire Altium by way of a Scheme of Arrangement. The acquisition is said to enable "two industry leaders to join forces and establish an integrated and open electronics system design and lifecycle management platform that allows for collaboration across component, subsystem, and system-level design".  Together, Renesas and Altium, aim to build an integrated and open electronics system design and lifecycle management platform that unifies the steps from component selection and evaluation to simulation and PCB physical design at a system level. The acquisition brings together Altium's cloud platform capabilities with Renesas' semiconductor portfolio. The combination will also enable integration with third-party vendors across the ecosystem to execute all electronic design steps seamlessly on the cloud. The electronics system design and lifecycle management platform will deliver integration and standardization of various electronic design data and functions and enhanced component lifecycle management, while enabling seamless digital iteration of design processes to increase overall productivity. This is said to bring "significantly faster innovation" and to "lower barriers to entry for system designers by reducing development resources and inefficiencies". Altium's history began in 1985 from Australia as one of the world's first printed-circuit board (PCB) design tool providers. The transaction has been unanimously approved by the boards of directors of both companies and is expected to close in the second half of 2024. Altium will continue to be led by CEO Aram Mirkazemi as a wholly-owned subsidiary of Renesas.

Schottky Barrier Diodes with short Reverse Recovery Time
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Learn more:
rohm.com
  • Product Release
  • 2024-02-15

ROHM has developed 100 V breakdown Schottky barrier diodes (SBDs) that deliver a short reverse recovery time (trr) of 15ns for power supply and protection circuits in automotive, industrial, and consumer applications. Although numerous types of diodes exist, highly efficient SBDs are increasingly being used inside a variety of applications. Particularly SBDs with a trench MOS structure that provide lower VF than planar types enable higher efficiency in rectification applications. One drawback of trench MOS structures, however, is that they typically feature worse trr than planar topologies – resulting in higher power loss when used for switching. In response, ROHM developed a series utilizing a proprietary trench MOS structure that simultaneously reduces both VF and IR (which are in a trade-off relationship) while also achieving a short trr. Expanding on the four existing conventional SBD lineups optimized for a variety of requirements, the YQ series is ROHM's first to adopt a trench MOS structure. The design reduces trr losses by approximately 37 % and overall switching losses by around 26 % over general trench-type MOS products. As such, the devices are are well-suited for sets requiring high-speed switching, such as drive circuits for automotive LED headlamps and DC-DC converters in xEVs that are prone to generate heat.

Power Supplies for Industrial Applications
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Learn more:
coseleurope.eu
  • Product Release
  • 2024-02-15

COSEL has announced the launch of the PDA series of AC/DC power supplies with further enhanced reliability for industrial applications. The PDA series uses a quasi-resonant topology with a limited number of components, resulting in higher reliability. It is 100% form, fit and function backwards compatible with the PBA series, which is retiring after 20 years of powering high volume applications worldwide. The first models introduced are the 15W PDA15F, the 30W PDA30F and the 50W PDA50F, with other versions to follow. The PDA series is designed for use in a wide range of applications and can operate over a wide temperature range from -20 to +70 degrees C. The power supplies are UL/EN62368-1 certified. Designed for worldwide applications, the PDA series has an input voltage range of 85VAC to 264VAC single phase and meets safety standards with an input voltage range of 100-240VAC (50/60Hz). The 15W PDA15F, the 30W PDA30F and the 50W PDA50F are available in three output voltages, 5V, 12V and 24V with corresponding output currents. The output voltage can be adjusted by a built-in potentiometer.

DC-DC Converter Designed for the ‘NewSpace’ Market
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Learn more:
vptpower.com
  • Product Release
  • 2024-02-14

VPT announces the addition of the VSC100-2800S to the VSC Series of space COTS DC-DC converters. Designed for the “NewSpace” market, the VSC Series complements VPT’s hermetic hybrid SV / SVL Series of rad hard products available on DLA SMDs. The VSC Series is intended for use in commercial rad tolerant satellite applications and NASA Class D missions where the balance of cost and guaranteed performance is critical. The VSC100-2800S features output voltages of +3.3 V / 66W, +5 V / 100W, +12 V / 100W, and +15 V / 100W, as well as a wide input voltage range. Sensitive semiconductors are RLAT to 40 krad (Si) per MIL-STD-883 Method 1019 and guaranteed to 30 krad (Si) TID. Converters are characterized to LET > 42 MeV/mg/cm2 for catastrophic events and LET > to 30 MeV/mg/cmysup>2 for SET and SEFI. Our proprietary packaging creates a dual-side heatsinking option with very low outgassing. VPT’s Vice President of Engineering, Leonard Leslie, stated, “We are pleased to introduce the VSC100-2800S as the newest addition to our VSC Series. Drawing on VPT’s extensive expertise in the development of radiation-hardened DC-DC converters, the VSC Series ensures the optimal level of radiation performance for low Earth orbit (LEO) applications, all while maintaining an exceptionally competitive cost.”

Electrolytic Polymer Hybrid Performance
  • Product Release
  • 2024-02-14

Panasonic introduces the ZV Series Electrolytic Polymer Hybrid capacitor. Achieving a maximum Ripple Current (3.3~4.6 Arms) approximately 50% higher than comparable case-sizes from competitors, the ZV Series ensures performance in demanding applications. While comparable capacitors usually come up with a ESR of around 16 m&ohm, at 35V, the ZV series has a significantly lower ESR of 12 mΩ at this voltage – and thus enhances efficiency and reliability in electronic systems. This capacitor is AEC-Q200 compliant, enforcing stringent quality control standards, particularly crucial for the automotive industry. It boasts high-temperature endurance, one of the industry's highest ratings at 4000 hours at 135°C and 125°C. With a focus on durability, the ZV Series offers vibration-proof variants capable of withstanding shocks up to 30G, making it a reliable choice. The ZV Series finds its applications in various "under the hood" scenarios, including water pumps, oil pumps, cooling fans, high-current DC to DC converters, and ADAS applications. It is also suitable for use in inverter power supplies for robotics, cooling fans, solar power systems, and more, covering the DC side of both inverter and rectifier circuits.

How to Design the Compensation Circuit for a Flyback Converter
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Learn more:
we-online.com
  • Product Release
  • 2024-02-13

Würth Elektronik has published its Application Note "Compensating the feedback loop of a current-controlled flyback converter with optocoupler". The guide is aimed at developers looking to use a DC/DC flyback converter to achieve greater stability and reliability in power supply design. It might also be useful for those who use optocouplers for galvanic isolation of the feedback path. Applications include primary and auxiliary power supplies for home appliances, battery chargers for smartphones and tablets, as well as LED lighting. This Application Note also provides assistance with power supplies for desktop and laptop computers, industrial power supplies and auxiliary supplies in motor drives, or for Power-over-Ethernet (PoE). AppNote ANP113 explains in detail how the feedback loop can be compensated using a current-controlled flyback converter with optocoupler, and which aspects require special attention. The CTR (current transfer ratio) influences the control loop of the compensation circuit and therefore must be carefully considered in the design stage. ANP113 places particular emphasis on design constraints imposed by the optocoupler parameters and on the related solutions. The validation results of a 30 W flyback converter prototype are also included in the AppNote.

Automotive-Grade SiC MOSFET Half Bridge SMPD Modules
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Learn more:
inventchip.com
  • Product Release
  • 2024-02-13

Inventchip Technology has added two automotive-grade SiC MOSFET half bridge SMPD modules named IVSM12080HA2Z and IVSM06025HA2Z. The modules are specified 1200 V/80 mΩ and 650 V/25 mΩ. SMPD is a compact, topside-cooling surface-mounted package with a plastic surface size of 25 mm x 23 mm. Compared with TO-247, the SMPD saves over 25 % PCB space, and the more important thing is that the SMPD reduces the half-bridge stray-inductance of power loop by around 40 %. The reduction of the stray inductance reduces MOSFET VDS overshoot, VGS ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with TO-247 with external electrical isolation assembly, SMPD with traditional AL2O3 and SiN lowers junction-to-heatsink thermal resistance by over 20 % and 50 % respectively for the same 25 mΩ/1200 V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the SMPD package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The SMPD package has a minimum 4 mm creepage from terminals to the package's heatsink mounting surface, which can safely work for both 400 V and 800 V systems without isolation reinforce. Both modules are AEC Q101 and AQG 324 certified.

Joint Efforts for Magnetic Component Solutions
  • Product Release
  • 2024-02-12

ITG Electronics has collaborated with STMicroelectronics (ST) in developing magnetic component solutions for 54 V/48 V to 12 V converter applications. ST's patented 54 V/48 V to 12 V stacked buck converter features an on-board solution with a quarter brick space using the PM6780 dual digital multiphase controller, the STPRDC02A high-voltage full-bridge driver, and ITG's L101353A-3R6MHF non-coupling dual inductors. This magnetics design collaboration is named Stacked buck converter with unified coupled inductor. Combined with ST's PM6780 and STPRDC02A, ITG's L101456A-1R4MHF can elevate the overall power rating of ST's 48 V solution to 1500 W. This product combination is claimed to "provide the industry's highest power density rating for 48 V solutions". The on-board stacked buck converter 48 V conversion system offers cost savings, form factor flexibility, and a customizable design compared to power-module designs.

100 V bi-directional GaN IC for 48 V/60 V BMS Applications
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Learn more:
innoscience.com
  • Product Release
  • 2024-02-12

Innoscience Technology has launched another 100 V bi-directional member of the company's VGaN IC family. The first family of VGaN devices rated 40 V with an on-resistance range between 1.2 mOhm and 12 mOhm have been successfully deployed in the USB OVP of several mobile phones. The 100 V VGaN (INV100FQ030A) can be employed to achieve high efficiency in 48 V or 60 V battery management systems (BMS), as well as for high-side load switch applications in bidirectional converters, switching circuits in power systems, and other fields. Such device it is usable in applications such as home batteries, portable charging stations, e-scooters, e-bikes etc. One VGaN replaces two back-to-back Si MOSFETs; they are connected with a common drain to achieve bidirectional switching of battery charging and discharging, further reducing on-resistance and loss significantly with respect to traditional Silicon solution. BOM count, PCB space and costs are also reduced accordingly. The INV100FQ030A 100V VGaN IC supports two-way pass-through, two-way cut-off and no-reverse-recovery modes of operation. Devices feature a low gate charge of 90 nC, a dynamic on-resistance of 3.2 mOhm and a package size of 4 mm x 6 mm. These 100 V GaN series products are in mass production in En-FCQFN (exposed top side cooling) and FCQFN packaging.

Miniature Inductor in C0402 Package for all Market Applications
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Learn more:
delevan.com
  • Product Release
  • 2024-02-09

Delevan's C0402 miniature RF inductor is integrated in a package which is claimed to be "ultra-small". A high reliability 0402 version of the C0402, for use in critical applications, is also available. The C0402 is manufactured and tested in the USA by an AS9100D certified company. It's offered in inductance ranges of 1.0nH to 120nH and features Self Resonant Frequencies, which provide stable inductor performance into the multi GHz range. Designed with a high-temperature ceramic core and magnet wire the C0402 inductor is rated for an operating temperature range of - 40°C to +125°C and is AEC-Q200 Grade 1 compliant. The C0402 is available with Gold terminations for use with epoxy bonded or solderable applications.

Energy Balance Calculator for enhanced battery life optimization
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Learn more:
nexperia.com
  • Product Release
  • 2024-02-08

Nexperia announced the release of the Energy Balance Calculator, which is a web-based tool designed to assist battery management engineers in maximizing the battery life of their applications. The calculator facilitates the integration of Nexperia's Energy Harvesting PMICs into their systems by providing engineers with precise data for informed decision-making. At the core of Nexperia's Energy Harvesting PMICs is the Maximum Power Point Tracking (MPPT) algorithm, enabling efficient energy harvest from the environment for various consumer electronics and IoT devices. To utilize these PMICs at their full potential, the calculator works with real-world technical parameters. It calculates the energy delivered to the load and the energy compensation. Thus, offering insights into potential battery life extension or achieving energy autonomy. Engineers can furthermore visualize system efficiency and precision through an efficiency curve provided by the tool.

Isolated Power Module with 84 % Efficiency and Protection
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Learn more:
we-online.com
  • Product Release
  • 2024-02-07

The MagI3C-FISM power modules from Würth Elektronik are now complemented by the WPME-FISM 'Fixed Isolated SIP/SMT Module' SMT-8 with 3.3V to 5V, rated for 1W POUT. The DC/DC voltage converter with fixed output voltage and integrated switching power stage, transformer, as well as input and output capacitance, is 100% pin-to-pin compatible with the previous MagI3C-FISM, however, it offers improved properties – the efficiency goes up to 84 percent, the ambient temperature range is now specified with 105°C and the isolation voltage is 3kV (for 60 seconds). Like some of its predecessors, this power module has continuous short-circuit protection. The MagI3C FISM power modules do not require any external components for operation. Applications for the module include supplying voltages for interfaces and microcontrollers in test and measurement technology or industrial electronics. It serves as simple functional isolation for overvoltage protection. For example, it prevents ground loops and shifts as well as interference in the signal path or sensor systems. The entire product range is UL 62368-1 recognized. The low level of conducted and radiated electromagnetic interference complies with the EN55032 Class B / CISPR-32 standard.

Cooperation for sustainable SiC Production
  • Industry News
  • 2024-02-06

ESK-SIC, a company which is active in silicon carbide (SiC) materials, and Kyocera have started a strategic partnership with the goal to develop "innovative solutions for the sustainable production of silicon carbide and the associated end products". By-products and end-of-life ceramics will be recycled using RECOSiC technology in order to produce raw materials that are specifically tailored to various end applications. Compared to currently available SiC raw materials on the market in terms of material science aspects, while minimising the carbon footprint of the process, the RECOSiC recycling technology is said to bring a technological upgrade. The partnership between ESK-SIC and Kyocera aims to improve the efficiency and sustainability of the entire silicon carbide value chain. This will involve developing new manufacturing technologies, optimising production processes, researching innovative applications and establishing circular economy principles for the recycling of SiC materials.

Automotive qualified -60V P-channel MOSFETs
  • Product Release
  • 2024-02-05

Toshiba Electronics announces the availability of XPH8R316MC and XPH13016MC, two more -60V P-channel MOSFETs based upon their U-MOS VI process. The devices are tailored for use in automotive applications such as load switches, semiconductor relays and motor drives. The AEC-Q101 qualified components are housed in an SOP Advance (WF) package - a surface mount style with a wettable flank terminal structure facilitating automated optical inspection (AOI) of the solder joints. The copper connectivity within the package reduces package resistance, improves efficiency and reduces heat build-up. The XPH8R316MC is rated for -90A continuous drain current (ID) and the XPH13016MC is rated for an ID of -60A. The pulsed drain current (IDP) is double these values, -180A and -120A, respectively. Both devices are rated for a drain-source voltage (VDSS) of -60V and are capable of operating at channel temperatures (Tch) up to 175ºC. The maximum drain-source on-resistance (RDS(ON)) of the XPH8R316MC is 8.3mΩ. For the XPH13016MC, the value is 12.9mΩ.

Call for Papers
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2024-02-05

PCIM Asia is calling for papers. The event will take place from 28–30.8.2024 in Shenzhen, China. As a platform connecting the academia and industry, the speakers can gain direct feedback from both sides. Within this framework the organizer encourage people to present their research. The organizer, Messe Frankfurt, expects "over 600 qualified audiences, mainly R&D engineers" for PCIM Asia. Three special awards (the Best Paper Award, the Young Engineer Award and the University Scientist Award) will be given out to some presenters. In parallel to the conference there will be an exhibition with more than 200 exhibitors. The official deadline for abstract submissions is the 4th of March, 2024.

Acquisition: Electronic Inks added to Advanced Materials Portfolio
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Learn more:
heraeus.com
  • Industry News
  • 2024-02-01

Heraeus Electronics has acquired the PriElex electronics inks business line from Kayaku Advanced Materials. PriElex is known for its expertise in electronics inks. By joining forces with Heraeus Electronics the acquisition is expected to enhance Heraeus' position and provide customers with an even broader range of solutions for thick film applications. Partners and customers of both Heraeus Electronics and PriElex can expect a smooth transition and ongoing support throughout the integration process. Furthermore, customers can be assured of uninterrupted service and access to a broader portfolio of advanced solutions.

Surface-Mount Resettable Fuse Rated to 240VAC
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Learn more:
belfuse.com
  • Product Release
  • 2024-01-31

Bel Fuse announced "the industry's only surface mount, PPTC resettable fuse, line-volt-rated to 240VAC". Designed to protect against electrical overloads and short circuits, Bel 0ZAF resettable fuses provide circuit protection for a variety of applications in the IoT, industrial, and medical sectors. These fuses are crucial for use in safeguarding industrial controls, test and measurement equipment, robotics, and safety systems, and deliver the reliability and durability required by these advanced technologies. Their soldered surface mount design not only offers cost efficiency for PC mount assembly, but also accelerates design and production timelines by eliminating the need for through-hole mounting. Bel 0ZAF fuses are UL recognized components and IEC certified.

Low Power High Voltage Diodes
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Learn more:
deantechnology.com
  • Product Release
  • 2024-01-31

Dean Technology (DTI) has introduced a series of high voltage diodes. This so-called VDRM Series is an axial-leaded, high voltage diode line that offers industry standard performance and high reliability. VDRM units range from 2.5 to 16 kV, 50 to 125 mA, and have a maximum reverse recovery time of 200 ns. These diodes are best suited for low to medium power, small form-factor applications. Further, VDRM diodes offer a miniature package size and are compliant to the RoHS directive. In addition to the new VDRM Series, DTI also offers a large catalog of diodes for many different high voltage needs.

Offline Flyback Switcher IC with Zero-Voltage Switching (ZVS) for 95 % Efficiency
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Learn more:
power.com
  • Product Release
  • 2024-01-30

Power Integrations has released the InnoSwitch5-Pro family of high-efficiency, programmable flyback switcher ICs. The single-chip switcher achieves over 95 percent efficiency with a novel secondary-side control scheme which achieves zero-voltage switching (ZVS) without a dedicated and costly additional high-voltage switch. The IC, which features a 750V or a 900V PowiGaN primary switch, primary-side controller, FluxLink isolated feedback and secondary controller with an I2C interface, is intended for single- or multi-port USB PD adapters. Applications are notebooks, high-end cellphones and other portable consumer products, including designs that require the USB PD EPR (Extended Power Range) protocol. For example, the company has demonstrated 140W / 28V USB PD adapters in 68,8 cm3 using 106 components. InnoSwitch5-Pro flyback switcher ICs feature lossless input line voltage sensing on the secondary side for adaptive DCM/CCM and ZVS control to maximize efficiency and simplify design across line and load. The ICs also feature a post-production tolerance offset to facilitate accurate output constant-current (CC) control of better than two percent to support the UFCS protocol. An efficiency of more than 95 percent allows designers to eliminate heat sinks, spreaders and potting materials for thermal management.

Over-voltage protection: SMD Varistors with high Surge Current Capability
  • Product Release
  • 2024-01-30

TDK presents two varistor series in SMD design. The types of both series are available for a wide range of operating voltages from 175VRMS to 460VRMS, corresponding to 225VDC to 615VDC. While the B72210M series of surge devices, which are equivalent to S14 leaded disk varistors, offers a surge current capability of 6000A, the B72214M series types, which are equivalent to S20 leaded disk varistors, have a high surge current capability of 10,000A. All types are designed for a high operating temperature of a maximum of +125 °C and extremely damp heat environment (85% relative humidity at +85 °C). The SMD high surge series is qualified to AEC-Q200. In terms of designs, all types are available in a horizontal as well as vertical version. The horizontal version of the B72210M series has dimensions of 22 x 15 x 11 mm3, while the B72214M series has dimensions of 27 x 18 x 11 mm3, (L x W x H). The vertical types have dimensions of 15 x 10 x 20 mm3 and 18 x 10 x 25.5 mm3, respectively. Typical applications of SMD surge protection components are on-board chargers, power supplies, frequency converters, photovoltaic systems and household appliances.

Dual-Channel High-Side Switches with Protection for Automotive Applications
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Learn more:
diodes.com
  • Product Release
  • 2024-01-30

Diodes has introduced its first automotive-compliant (according to AEC-Q100), dual-channel, high-side power switches - the ZXMS82090S14PQ, ZXMS82120S14PQ, and ZXMS82180S14PQ - as an expansion of its IntelliFET self-protected MOSFET portfolio. These intelligent switches are said to "deliver high power within a compact footprint while also providing robust protection and diagnostic capabilities". The series is designed for driving 12V automotive loads, such as LEDs, bulbs, actuators, and motors in automotive body control and lighting systems. The trio all feature a dual 41V-rated n-channel MOSFET array with onboard circuitry that protects against short circuits, manages inrush currents, and safeguards against overvoltage conditions including load dumps. In addition, the switches provide overtemperature protection with auto-restart, plus protection against electrostatic discharge damage. Loss of ground and reverse polarity protection can also be implemented with the aid of a few external components. A dedicated current sense pin provides analog current monitoring of the outputs and fault indication for short-to-battery, short-to-ground, and open-load detection. These devices provide smaller footprint alternatives to relays, fuses, and discrete circuits. Supplied in a SO-14EP package they are also form, fit, and functional equivalents for existing power switch devices, where customers need improved product supply.

Dedicated Website: Alternative Energy Resource Hub with Trusted Products for Design Engineers
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Learn more:
mouser.com
  • Product Release
  • 2024-01-30

On a dedicated website Mouser Electronics now provides engineers with key information to solve today's design challenges through its dedicated alternative energy resource centre, featuring a comprehensive selection of content, products and solutions. Readers will discover uses of renewable power, insights into commercial and industrial electric vehicles, and learn how energy storage systems will be key for the transition to renewable energy. The content offers perspectives on the alternative energy landscape, providing a deeper look into policy changes, energy harvesting practices and energy storage installation parameters. The resource centre is a collection of articles, blogs, and videos.

More Discrete Semiconductors on the Linecard
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Learn more:
ttieurope.com
  • Industry News
  • 2024-01-29

TTI Europe has become an authorized distributor of Panjit semiconductors. Doing so TTI adds a range of diodes, MOSFETs, protection devices, IGBTs, SiC devices, and ICs to its linecard. Panjit has manufactured semiconductor discrete components, including diodes, Transient Voltage Suppressors (TVS) and transistors for more than 30 years. The company has a wide range of MOSFET, IGBT, FRED, Schottky, ESD Array and SiC devices, bipolar junction transistors, bridges and more, which are suited for markets such as data centres, industrial control, automotive, electric vehicles and 5G. On the picture you see – from left to right: Markus Walz, Business Development Manager TTI Europe; Alla Zoubar-Bloch, Sales Manager Central and Northern Europe, Panjit; Karen Lee, Managing Director Europe, Panjit; Joerg Frodl, Director Product Marketing Europe Passives & Discretes TTI Europe.

Joint Lab for NEV Developments with GaN and SiC Technology
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Learn more:
navitassemi.com
  • Industry News
  • 2024-01-25

Navitas Semiconductor and SHINRY announced the opening of a joint R&D power laboratory to accelerate the development of New-Energy Vehicle (NEV) power systems enabled by Navitas' GaNFast™ technology. SHINRY is active in on-board power supplies and strategic supplier to Honda, Hyundai, BYD, Geely, XPENG, BAIC and other automobile manufacturers. The joint lab accelerates development projects, with GaN technology combining with system-design skills and engineering talent to enable higher high power density, lightweight, efficient designs that translate to faster charging and extended range, with faster time-to-market. Navitas' own dedicated EV system Design Center, located in Shanghai will provide comprehensive technical support for the joint lab. Navitas will not only supply SHINRY with power devices, but will also engage in system-level R&D from the initial stages of product specification and design, through to test platforms and customized packaging solutions. The result will be more efficient, higher power density, more reliable, and cost-effective power systems for NEVs.

Joint Innovation Application Center for PD fast charging and and CO2-saving Solutions
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Learn more:
infineon.com
  • Industry News
  • 2024-01-25

Infineon Technologies announced its joint Innovation Application Center in Shenzhen with Anker Innovations, a company which is very active in charging technology. With the center already fully operating, it is paving the way for more energy-efficient and CO2-saving charging solutions that support decarbonization. Driven by the growing consumer demand for faster charging solutions due to an increasing usage of mobile devices, laptops and other battery-powered devices, the idea of establishing an Anker-Infineon Innovation Application Center dated back to 2021. After two years of preparation, this Innovation Application Center now serves as application hub for local partners to develop power-delivery (PD) fast charging solutions with higher power density, mainly based on Infineon's next-generation Hybrid Flyback (HFB) controller product family and the CoolGaN IPS for fast chargers above 100W. With the Innovation Application Center also intend to shorten the application cycle and accelerate the time to market for future products. Beyond charging solutions, the joint lab is focusing on a more diversified range of consumer applications using semiconductors based on wide-bandgap materials such as GaN.

Head of Sales for Passives and Electromechanical Components
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Learn more:
we-online.com
  • People
  • 2024-01-25

Würth Elektronik eiSos combines sales for the product groups 'passive and electromechanical components' into a single management structure. The Head of Sales in the new structure is Heiko Arnold. He was previously responsible for the sales of passive components in Germany, has now also taken over responsibility for the sales of electromechanical components. Heiko Arnold has been with Würth Elektronik eiSos for 24 years and looks back over more than 20 years of national and international management experience in sales. He points out: "We always see Sales and Customer Service in its entirety."

Compact SOT-223-3 600V MOSFETs for Smaller, Lower Profile Designs
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Learn more:
rohm.com
  • Product Release
  • 2024-01-24

ROHM Semiconductor announced a lineup of compact 600V Super Junction MOSFETs, the R6004END4 / R6003KND4 / R6006KND4 / R6002JND4 / R6003JND4. These devices are well-suited for small lighting power supplies, pumps, and motors. Compared to the conventional TO-252 package (6.60mm × 10.00mm × 2.30mm), ROHM's products reduce area and thickness by 31% and 27%, contributing to smaller, lower profile applications. At the same time, the same footprint as the TO-252 package can be used, enabling mounting on existing circuit boards without modification. Offering distinctive features, three of the models are optimized for compact power supplies. The R6004END4, characterized by low noise, is suitable for applications where noise is a concern, while the R6003KND4 and R6006KND4, capable of high-speed switching, are designed for sets requiring low loss, high efficiency operation. The R6002JND4 and R6003JND4 utilize proprietary PrestoMOS technology to achieve significantly lower switching losses by speeding up reverse recovery time (trr) to typically 40ns or, respectively, 42ns, making them well-suited for motor-equipped devices. These devices' gate capacities QGS at 15V are specified to be 7nC and, respectively, 8nC.

100V MOSFET in Double-Sided Cooling DFN 5x6 Package for almost 200A
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Learn more:
aosmd.com
  • Product Release
  • 2024-01-24

Alpha and Omega Semiconductor announced the AONA66916, which is a 100V MOSFET packaged in a top and bottom side cooling DFN 5 x 6 package. This package keeps the semiconductor products cooler. Typically, when using the standard DFN 5x6 package, the bottom contact is the main contributor for cooling, and most of the heat generated by the Power MOSFETs will be transferred to the PCB. This increases the PCB thermal management design considerations to meet system requirements. AOS' top and bottom cooling DFN 5x6 package enables heat transfer between the exposed top contact and heat sink due to its large surface contact area construction. This allows the device to achieve a low thermal resistance (Rthc-top max) of 0.5°C / W with results being transferred to the PCB board, enabling significant thermal performance improvements. The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS' standard DFN 5x6 package, eliminating the need to modify existing PCB layouts. AONA66916 has a maximum RDS(on) rating of 3.4mOhms and operates with a maximum junction temperature of 175°C. Its continuous drain current is specified to be 197A at 25°C.

New Headquarters and Manufacturing Center in Chandler, AZ
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Learn more:
sarasmicro.com
  • Industry News
  • 2024-01-24

Saras Micro Devices has opened its new headquarters and manufacturing facility in Chandler, Arizona. The decision to open the manufacturing center in Arizona is part of Saras' longer-term strategy to support its growth in the high-performance computing artificial intelligence /machine learning sectors and capitalize on the rapidly expanding semiconductor ecosystem in the region. The company is relocating its headquarters from Atlanta, Georgia, where its Research & Development Center will remain. The move involves a planned investment of over $50 million in the Chandler facility covering about 10,000 m2 of clean room, manufacturing, and administrative space. Saras will employ approximately 50 people in the near term, which will be primarily composed of engineering talent. By the close of 2025, both the site and staff will undergo significant expansion, with a projected growth to more than 12.000 m2, inclusive of a larger clean room of about 12,000 m2. The proximity of the new headquarters to other key semiconductor ecosystem partners, coupled with Arizona's cost-effective operations and investment in talent development, uniquely positions Saras to capitalize on these strategic advantages while contributing to a robust domestic semiconductor industry.

SiC FET in D2PAK for 750V EV Designs
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Learn more:
qorvo.com
  • Product Release
  • 2024-01-24

Qorvo unveiled an automotive-qualified SiC FET offering an RDS(on) of 9mΩ in a compact D2PAK-7L package. This 750V SiC FET is the first in a new family of pin-compatible SiC FETs from Qorvo with RDS(on) options up to 60mΩ, making them well suited for electric vehicle applications, including on-board chargers, DC/DC converters and PTC heater modules. The UJ4SC075009B7S features a 9mΩ typical RDS(on) at 25°C needed for reducing conduction losses and maximizing efficiency in high voltage, multi-kilowatt automotive applications. Its surface-mount package enables automated assembly flows. This 750V family complements Qorvo's existing 1200V and 1700V automotive SiC FETs in D2PAK packaging to form a complete portfolio addressing EV applications that span 400V and 800V battery architectures. These fourth generation SiC FETs leverage Qorvo's circuit configuration, in which a SiC JFET is co-packaged with a Si MOSFET to produce a device with the efficiency advantages of wide bandgap switch technology and the simpler gate drive of silicon MOSFETs. The key features of the UJ4SC075009B7S include a threshold voltage VG(th) of typically 4.5V allowing 0 to 15V drive, a body diode operating with a VFSD of 1.1V, a reverse recovery Qrr of 338nC and a gate charge QG of 75nC. The AECQ101-qualified device operates at temperatures up to 175°C.

Measurement Instruments in Europe
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Learn more:
distrelec.biz
  • Industry News
  • 2024-01-23

Distrelec announced the introduction of KPS test and measurement instruments for sale throughout Europe. KPS is a manufacturer of electrical measurement instruments for professional installers, electricians and technicians. The Distrelec portfolio now includes a DCM clamp meter that is manufactured in Europe. KPS keeps their EMEA stock in the North of Spain in order to enable fast deliveries to Distrelec, which is a trading brand of RS Group.

150mm and 200mm SiC Wafer Supply Secured
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Learn more:
infineon.com
  • Industry News
  • 2024-01-23

Infineon Technologies and Wolfspeed announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon's general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and EV applications and energy storage systems. "As the demand for silicon carbide devices continues to increase, we are following a multi-source strategy to secure access to a high-quality, global and long-term supply base of 150mm and 200mm SiC wafers," said Jochen Hanebeck, CEO of Infineon Technologies. Furthermore, Infineon has formalized an agreement with silicon carbide supplier SK Siltron CSS earlier this year. Under the agreement, SK Siltron CSS will provide Infineon with competitive and high-quality 150-millimeter SiC wafers, supporting the production of SiC semiconductors. In a subsequent phase, SK Siltron CSS will play an important role in assisting Infineon's transition to a 200-millimeter wafer diameter. SK Siltron CSS partners with global semiconductor manufacturers by supplying compound semiconductor wafer solutions. SK Siltron CSS is a subsidiary of South Korea-based SK Siltron, a part of the SK Group.

Power Semiconductor Modules for EVs and PHEVs
  • Product Release
  • 2024-01-23

Mitsubishi Electric Corporation announced the coming release of six J3-Series power semiconductor modules for various electric vehicles (xEV), featuring either a silicon carbide metal-oxide semiconductor field-effect transistor (SiC-MOSFET) or a RC-IGBT (Si), with compact designs and scalability for use in the inverters of EVs and PHEVs. All six J3-Series products will be available for sample shipments by the end of this quarter. In the xEV sector, power semiconductor modules are used widely in power conversion devices such as inverters for xEV drive motors. In addition to extending the cruising range of xEVs, compact, high-power, high-efficiency modules are needed to further downsize batteries and inverters. But due to the high safety standards set for xEVs, power semiconductors used in drive motors must be more reliable than those used in general industrial applications. Development of these SiC products was partially supported by Japan's New Energy and Industrial Technology Development Organization (NEDO).

Head of Asia Operations
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Learn more:
schurter.com
  • People
  • 2024-01-17

Guanghua Yang is the new Managing Director Asia & Vice President at SCHURTER, responsible for all activities of SCHURTER in Asia, including Sales, Marketing, Operations and R&D. Guanghua Yang has more than 30 years of experience, most of which he gained in technology companies in the field of electronic components. Prior to his appointment as Managing Director Asia & Vice President in the SCHURTER Group, he was General Manager & Vice President for Asia at C&K based in Shanghai, China. Earlier, he held other executive positions in sales and marketing. He holds a Bachelor of Science degree and an MBA degree from Tsinghua University.

AC/DC Frontend Modules with PFC
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Learn more:
gaia-converter.com
  • Product Release
  • 2024-01-17

GAIA Converter's AC/DC Power-Factor Corrected front-end modules are compatible with common airborne AC input bus voltages and variable frequencies, while being particularly suited for use in centralized power architectures in conjunction with PoL or isolated DC modules. All of the modules meet the stringent requirements of DO-160, ABD-100, and Mil-Std-704 specifications. GAIA's AC/DC front-end modules have a soft-start, active current limitation, short circuit protection, and inhibit function. The soft-start/active current limitation prevents inrush current during start-up. The short circuit protection safeguards the module against short circuits by shutting down and restoring to normal when the overload is removed. The front end series operates under 50W with two isolated low voltage outputs. Series above 150W provide non-isolated high voltage output.

MIL-COTS DC/DC Front-End Filters
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Learn more:
pduke.com
  • Product Release
  • 2024-01-17

P-DUKE has developed the MCF series of MIL-COTS DC/DC front-end filters, meeting the requirements of MIL-STD 1275E (28V DC electrical systems in military vehicles) and MIL-STD 461 (electromagnetic interference control for subsystems and equipment). These filters accept 9-36VDC input voltage, making them suitable for with 28V or 24V bus systems offering up to 250W output power. The devices are also applicable to heavy industrial and rolling stock applications. The MCF series features active input over-voltage protection, clamping over-voltages for up to 50ms to a safe level of 40V, and absorbing +/-250V spikes. With additional MLCCs, the internal EMI filter meets MIL-STD 461G limits. It also includes various active protection functions for advanced protection of the DC/DC converter module. The MCF filter module is fully integrated also meet environmental MIL-STD 810F specifications for shock and vibration and have an operating temperature range of -40°C to 105°C (optionally -55°C).

Automation1 XA4 1- or 2-Axis PWM Servo Drive
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Learn more:
aerotech.com
  • Product Release
  • 2024-01-16

For precision motion control in industrial and research systems Aerotech introduced the XA4 1- or 2-Axis HyperWire Multi-Axis PWM Servo Drives. These dual- and single-axis drives enable machine builders to experience Automation1 precision on all of their systems. The simplified dual-axis XA4 brings control to multiple axes of motion in the same machine footprint. Built on Automation1 motion control technology, the XA4 communicates to Automation1 PC- and drive-based controller products over the HyperWire motion bus, supports multiple feedback device types and includes on-board memory. The amplifiers control brushless AC, brush DC, voice coil and stepper motor types at up to 340VDC operating voltage and 20A peak current capability.

MOSFET Relays Extend Capacity and Operating Temperature
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Learn more:
omron.com
  • Product Release
  • 2024-01-16

Omron Electronic Components has expanded its MOSFET relay line-up to offer higher operating temperature and enhanced capacity in a high-current six-pin DIP format. Omron's G3VM-63BR and G3VM-63ER extend the company's 60V DIP6 MOSFET relay range up to 0.7A continuous load current. Operating from -40 to 110 deg C, these MOSFET relays contribute to much smaller and denser equipment than equivalent mechanical devices. Power consumption on the input is lower compared to all electromechanical relays, but especially reed relays, further contributing to energy-saving equipment. Maximum resistance with output ON is typically 0.3Ω (0.1Ω. with connection C), whilst typical capacitance between output terminals is specified as 520pF. Their maximum trigger LED forward current is 2mA, whilst turn ON time and OFF times are 2ms and 3ms respectively. For factory automation applications, the models have NC contacts allowing status output to linked devices including power OFF status. The relays can also be used alongside the NO contact type, enabling switching control of multiple loads with just one input control. Applications in factory automation include PLCs machine tools, inverters, robot controllers, temperature control together with fire, gas or smoke alarm systems. Further uses for the G3VM-63ER extend to sensor signal transfer and output signal switching - for example with gas detection and similar alarm applications.

Addition to the Line Card: Rugged Connectors
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Learn more:
avnet.com
  • Industry News
  • 2024-01-16

Avnet Abacus will be selling the portfolio of rugged DEUTSCH connectors from TE Connectivity. The DEUTSCH family of environmentally sealed electrical connectors has been a solution for industrial and commercial vehicles and other applications for more than 40 years, especially where dirt, moisture, salt spray and vibration can otherwise contaminate or damage electrical connections. It includes the HD and DT ranges of robust-circular and rugged-rectangular connectors, respectively, especially designed for industrial and commercial vehicle applications.

Automotive Step-down Switching Regulators save Board Space
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Learn more:
ablic.com
  • Product Release
  • 2024-01-16

ABLIC now offers the S-19954/5 Series of automotive step-down switching regulators operating at 5.5V with a 1A output and housed in HSNT-8(1616)B packages (1.6 x 1.6 x t0.41mm3). The device enables an efficiency of up to 95% when delivering an output current of 1A at output voltages of 0.8 to 3.3V from an input voltage between 2.7 and 5.5V. In addition, while the circuit configuration of conventional switching regulators required five or more external components, the S-19954/5 Series has an integrated feedback resistance circuit and phase compensation circuit to set the output voltage, which makes it possible to configure an application circuit using just one small coil and two capacitors. These characteristics allow the S-19954/5 Series to result in a 45% reduction compared to conventional products. The S-19954/5 Series is also equipped with a power good function for output voltage monitoring. Furthermore, the S-19954/5 Series is also PPAP (Production Part Approval Process) capable and planned for compliance with Grade 1 of the AEC-Q100 quality standard for automotive ICs. Typical applications are secondary power supplies for automotive devices as well as camera modules and other automotive applications.

R&D Manager at Swedish GaN-on-SiC Semiconduductor Manufacturer
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Learn more:
swegan.se
  • People
  • 2024-01-16

Anders Lundskog is the new R&D manager at SweGaN, a European semiconductor manufacturer that develops and produces custom-made Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers. Anders Lundskog has a background in process development for GaN materials at Infineon and system engineering from Saab, He holds a Doctor of Philosophy (Ph.D.), Materials Science, and Master of Science (MSc), Applied Physics and Electrical Engineering, from Linköping University of Technology. Spurred by significant interest in volume orders from major customers, in 2023 SweGaN announced the construction of a new production facility in Linköping Sweden to embrace global demand - with prognosis for production is Q1 2024. SweGaN's strategy is closely aligned with the accelerated global demands for GaN-on-SiC epiwafers used in 5G telecommunications infrastructure, defense radars, satellite communications and high voltage power switches.

Partnership in Power Products
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Learn more:
acalbfi.com
  • Industry News
  • 2024-01-13

Acal BFi now partners with Delta Electronics. The collaboration between Acal BFi and Delta Electronics combines their expertise and resources for providing solutions to develop power optimised applications, reduce costs, and achieve sustainable solutions. Delta Electronics core competence is in high-efficiency power electronics. Under this partnership, Acal BFi and Delta Electronics will leverage their respective strengths and capabilities to offer customers a suite of power technology solutions along with industry knowledge, and the ability to deliver tailor-made solutions in areas such as renewable energy, factory automation, machine automation, medical equipment.

Overtemperature Detection Solution for EV Li-ion Battery Packs
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Learn more:
littelfuse.com
  • Product Release
  • 2024-01-11

With its TTape™ solution Littelfuse introduces an overtemperature detection platform designed to transform the management of Li-ion battery systems. TTape helps vehicle systems manage premature cell aging effectively while reducing the risks associated with thermal runaway incidents. It is well-suited for a wide range of applications, including automotive EV/HEVs, commercial vehicles, and Energy Storage Systems (ESS). Its distributed temperature monitoring capabilities enable detection of localized cell overheating, thereby improving battery life and enhancing the safety of battery installations. With a single TTape device, multiple cells can be monitored, thus alerting the BMS sooner in case of overtemperature scenarios with a response time of less than one second. Calibration isn't necessary because TTape can directly integrate with existing BMS. The TTape Distributed Temperature Monitoring Platform is available in tape and reel or box packaging, depending on the length required.

Renesas to Acquire Transphorm: Expanding its Power Portfolio with GaN Technology
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Learn more:
renesas.com
  • Industry News
  • 2024-01-11

Renesas Electronics and Transphorm announced that they have entered into a definitive agreement pursuant to which a subsidiary of Renesas will acquire all outstanding shares of Transphorm's common stock. The transaction values Transphorm at approximately $339 million. The acquisition will provide Renesas with in-house GaN technology, which is described by Renesas to be "a key next-generation material for power semiconductors, expanding its reach into fast-growing markets such as EVs, computing (data centers, AI, infrastructure), renewable energy, industrial power conversion and fast chargers/adapters". Renesas claims that demand for GaN is predicted to grow by more than 50 percent annually. Renesas will implement Transphorm's auto-qualified GaN technology to develop new enhanced power solution offerings, such as X-in-1 powertrain solutions for EVs, along with computing, energy, industrial and consumer applications. The board of directors of Transphorm has unanimously approved the definitive agreement with respect to the transaction and recommended that Transphorm stockholders adopt such definitive agreement and approve the merger. The transaction is expected to close in the second half of calendar year 2024, subject to Transphorm stockholder approval, required regulatory clearances and the satisfaction of other customary closing conditions. In other news Renesas had already announced the establishment of an in-house SiC production line, supported by a 10 year SiC wafer supply agreement.

APEC 2024 Provides Childcare During the Conference and Exhibition
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Learn more:
apec-conf.org
  • Event News
  • 2024-01-10

Onsite at APEC 2024, day-long childcare for children of attendees will be available during the conference and exhibition. In order to use these services attendees must sign up for them by Jan. 29, 2024. In order to do so the Applied Power Electronics Conference (APEC) has partnered with KiddieCorp which will provide on-site childcare services from 8:00 a.m. to 5:00 p.m., from Tuesday to Thursday (Feb. 27-29). Conveniently located at the Hyatt Regency, Long Beach, the services will enable APEC-registered parents to attend the conference and exhibition in the Long Beach Convention Center while their children are cared for next door. The KiddeCorp team is prepared to closely monitor and entertain kids aged 3-12 years with numerous activities designed to ensure they have age-appropriate fun. KiddieCorp employees are trained in first aid, CPR and emergency response preparedness, so parents can have peace of mind while navigating the exhibit floor, attending conference sessions or participating in the Spouse and Guest program events. "Providing childcare will encourage power electronics professionals to bring their families to APEC 2024 knowing their children will be cared for and entertained while they attend sessions and other activities," said Tim McDonald, APEC 2024 General Chair. "This service, combined with the Spouse and Guest Hospitality program offering excursions to Catalina and whale-watching, will provide a memorable experience in Long Beach for the entire family."

STMicroelectronics Announces new Organization
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Learn more:
st.com
  • Industry News
  • 2024-01-10

STMicroelectronics moves from three to two product groups, AMPS and MDRF. The Analog, Power & Discrete, MEMS and Sensors Group (APMS) will be led by Marco Cassis, ST President and member of the Executive Committee, and the Microcontrollers, Digital ICs and RF products group (MDRF) will be led by Remi El-Ouazzane, ST President and member of the Executive Committee. The APMS Product Group will include all ST analog products, including Smart Power solutions for automotive as well as all ST Power & Discrete product lines including Silicon Carbide products complemented by MEMS and Sensors. APMS will include two Reportable Segments: Analog products, MEMS and Sensors (AM&S); Power and discrete products (P&D). The MDRF Product Group will include all ST digital ICs and microcontrollers, including automotive microcontrollers but also RF, ADAS, Infotainment ICs. MDRF will include two Reportable Segments: Microcontrollers (MCU) as well as Digital ICs and RF Products (D&RF). Concurrent with this new organization Marco Monti, ST President of the former Automotive and Discrete Product Group, will leave the company. To complement the existing Sales & Marketing organization, a new application marketing organization by end market will be implemented across all ST Regions. This will provide ST customers with end-to-end system solutions based on the company's product and technology portfolio. The application marketing organization will cover the following four end markets: Automotive / Industrial Power and Energy / Industrial Automation, IoT and AI / Personal Electronics, Communication Equipment and Computer Peripherals. The current regional Sales & Marketing organization remains unchanged.

Acquisition of 1500 VDC Converter Technology and Team
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Learn more:
danfoss.com
  • Industry News
  • 2024-01-10

Danfoss Drives has announced the acquisition of the ACE300 product and the takeover of the product team from Finland-based company Ampner to extend the electrification portfolio with a dedicated 1500 VDC power converter. The product will be integrated within Danfoss Drives' portfolio of Electrification Solutions with primary focus on Smart Grids and energy storage. Mika Kulju, President of the Danfoss Drives business, says: "With 2030 climate targets becoming ever more imminent, decarbonization via electrification is accelerating in multiple sectors. There is a growing trend in all focus application areas where 1500 V DC is starting to play a key role. This is a big step for Danfoss Drives in ensuring a complete electrification offering, thus securing the right solutions for our customers in their electrification projects."

GaN FETs Enable 75 - 231 Ampere Laser Diode Control in Nanoseconds for Lidar
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Learn more:
epc-co.com
  • Product Release
  • 2024-01-09

EPC launches three laser driver boards dubbed EPC9179, EPC9181 and EPC9180 containing pulse current laser drivers of 75 A, 125 A, and 231 A, showcasing EPC's AEC-Q101-qualified GaN FETs. These FETs (EPC2252, EPC2204A, and EPC2218A) are 30% smaller and said to be more cost-effective than their predecessors. Designed for both long and short-range automotive lidar systems, these boards expedite solution evaluation with varied input and output options. All boards share identical functionality, differing only in peak current and pulse width. Utilizing a resonant discharge power stage, they employ a ground-referenced GaN FET driven by LMG1020 gate driver. The GaN FET's ultrafast switching enables rapid discharge of a charged capacitor through the load's stray inductance, enabling peak discharge currents of tens to hundreds of amps within nanoseconds. The PCB is designed to minimize power loops and common source inductance while offering mounting flexibility for laser diodes or alternative loads. To enhance user-friendliness, all boards ship with EPC9989 interposer PCBs, featuring various footprints to accommodate a variety of laser diodes or other loads. Customers can choose one that meets their needs to evaluate the GaN solutions. The EPC9179/81/80 boards are triggered from 3.3V logic or differential logic signals such as LVDS. For single-ended inputs, the boards can operate with input voltages down to 2.5V or 1.8V with a simple modification. EPC provides full schematics, BOM, PCB layout files and a quick start guide on its website.

Collaboration on Magnetic Components for Converters
  • Industry News
  • 2024-01-09

ITG Electronics has announced a collaboration with Renesas Electronics to develop a generation of magnetic components for 54V/48V to 12V converters. The effort specifically targets applications in the artificial intelligence (AI) and data center power conversion sectors. The collaboration's latest initiative involves 48V onboard power delivery solutions. The solutions – called Renesas P/N RAA228006/RAA226054 and ITG P/N SLA694719C-2R2MHF by the two companies – can deliver 1,000 W per phase. ITG P/N SLA694719C-2R2MHF is rated 0.65mOhm and achieves an elevated current rating of 42 A. Compared to conventional 750W transformers, ITG's enhanced version provides a 46% reduction in transformer DC resistance (DCR), resulting in substantially reduced overall power loss.

Professional Test & Measurement Solutions at APEC
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Learn more:
itechate.com
  • Industry News
  • 2024-01-09

APEC 2024 will be held in Long Beach, California on February 25-29, 2024. Professional power test solution provider-ITECH Electronics, will show on APEC 2024 with their power electronics testing instruments and solutions, we cordially invite you to stop by ITECH booth No.1659. ITECH will show all series of T&M instrument products. ITECH new upgraded AC source products such as IT7800, IT7900 and IT7900P will appear at the show, help you challenge MW level test. And you will see our star product IT6000C Bi-directional DC power supply, which adopts the third generation SiC-base technology and integrates the source and sink function in one unit. Also, we will show another explosive product IT-M series, featuring "compact structure" and "high power density", which give users a wide range of choices to meet the diverse testing demands. The IT2800 SMU, winner of three T&M awards in 2023, will also make its debut at APEC. ITECH has brought over 1000 models products to global market, always focusing on innovation, owning 140+ patents and products have been awarded by top international media. ITECH is always stepping forward with their state-of-the-art testing technology. Meet ITECH on APEC 2024!

EC-Q200 compliant Planar Signal BMS Transformer for High Voltage Applications
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Learn more:
bourns.com
  • Product Release
  • 2024-01-09

Meeting the need for planar technology that can provide reliable and safe communication in a growing group of high voltage electric vehicle (EV) and other high energy storage systems, Bourns' AEC-Q200 compliant SM91806 Planar Signal BMS Transformer meets basic electric insulation requirements per IEC 60664-1, IEC 61558-1 and IEC 62368-1 standards. Planar-style signal transformers have been introduced to increase design flexibility and robustness. They are also known to deliver cost efficiency and reliability advantages over conventional wire wound transformer designs due to their multilayer PCB isolation and full automation. Offering these benefits and more, Bourns' planar signal BMS transformer features a working voltage up to 1000 VDC, superior clearance/creepage distance features and complies with Overvoltage Category II. It also provides a partial discharge level up to 1200 V for ESS usage.

Industry Veteran now CEO
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Learn more:
q-p-t.com
  • People
  • 2024-01-08

QPT has appointed Rupert Baines as its CEO with effect from 1 April 2024. He is a veteran of the semiconductor industry with C-level roles including CEO of UltraSoC (sold to Siemens) and CMO of Codasip. QPT is active in developing next generation GaN-based motor drives.

Power Conversion Company buys Provider of Transformers, Inductors and PD Equipment
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Learn more:
astrodynetdi.com
  • Industry News
  • 2024-01-08

Astrodyne has acquired Powertronix, a provider of toroidal transformers, AC and DC inductors and power distribution equipment. Powertronix provides power transformers, specialty transformers, power solutions, and AC and DC inductors for highly demanding OEMs in the medical, industrial, and semiconductor fabrication equipment markets, worldwide. Powertronix is particularly adept at guiding customers through complex qualification processes and developing special solutions that meet the safety requirements of highly regulated applications, such as robotic-assisted surgery. Powertronix will remain headquartered in Foster City, California and will continue to use the Powertronix brand. The terms of the transaction were not disclosed.


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Substrates for Organic Field Effect Transistors (OFETs)How efficient are new materials? Does changing the...11828Industry NewsSubstrates for Organic Field Effect Transistors (OFETs)How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion. Customized designs enable the optimal measurement of semiconductors and conductors. Organic semiconductors are key components in organic electronics and photovoltaics. They are used to make flexible electronic devices and printed solar cells. Typical for this class of materials are low temperature processes as well as large area deposition and patterning using various coating and printing techniques. The active semiconductor materials significantly determine the performance of the entire system. Therefore, an easy to handle and reliable electronic characterization of conductivity, carrier mobility, contact resistance and on/off current ratio of these semiconductors is an essential requirement for material and process developers. Fraunhofer IPMS develops and manufactures silicon substrates with single transistor structures in bottom-gate architecture, which are used for the fabrication of organic field-effect transistors (OFETs) or for the characterization of electrical material parameters of conductive materials, e.g. for organic photovoltaics. Substrates for organic field-effect transistors (OFET) for the development of high-tech materials.27.03.2024 14:00:00Marnews_2024-04-01_9.jpg\images\news_2024-04-01_9.jpghttps://www.ipms.fraunhofer.de/en/press-media/press/2024/material-characterization-of-printed-electronics.htmlipms.fraunhofer.de
Thermal Management Expo Europe Unveils Business Opportunities for High-Tech IndustriesThermal Management Expo North America is a unique,...11839Event NewsThermal Management Expo Europe Unveils Business Opportunities for High-Tech IndustriesThermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials. No other event provides the opportunity for professionals working across sectors like Automotive, Aerospace & Defense, Electronics, Energy, Telecoms/5G, and Medical to delve into the latest thermal innovations and solutions. Attendees can tap into the advantages of cross-sector networking and in-person engagements with the latest thermal materials, components, and technologies available in the market. Co-located with Ceramics Expo, this event is scheduled for April 29 – May 1, 2024 at Suburban Collection Showplace, Novi, Michigan, USA. Thermal Management Expo promises to showcase the latest systems, materials, and technologies to address thermal management challenges across several high-tech industries. Global market leading suppliers and manufacturers including Alloy Enterprises, Burger Group, Henkel, Huber, Linseis, Parker Hannifin, TCLAD, Thermtest and Stirweld, will be showcasing their innovative solutions. In addition to the exhibition, the free-to-attend conference will feature sessions led by technical experts from prominent companies like Intergalatic, Heraeus, Blueshift, Diabatix, Neural Concept, ZF Group and more. These sessions will provide insights into thermal management systems and design, covering topics such as supply chain optimization, EV thermal management, data center cooling, thermal design and AI, thermal simulation, microelectronics and semiconductors.26.03.2024 16:30:00Marnews_2024-04-01_20.jpg\images\news_2024-04-01_20.jpghttps://register.visitcloud.com/survey/1zvv3hrcg7n3t?utm_source=engineering_update&utm_medium=socials&utm_campaign=tme24_visprom_partnersthermalmanagementexpo.com
Digital WE Days: Expert Knowledge OnlineThe transfer of expertise is a fundamental element...11820Event NewsDigital WE Days: Expert Knowledge OnlineThe transfer of expertise is a fundamental element of Würth Elektronik's service concept. This includes in-depth expert presentations in digital format. As part of Digital WE Days, experts from Würth Elektronik and its partner companies will be presenting on important topics like intelligent power and control systems, EMC, electromechanics, wireless power, optoelectronics, and PCBs. "Last year, more than 4,300 participants took advantage of our online service offerings," says Alexander Gerfer, CTO at Würth Elektronik eiSos. "This shows that we are in touch with the times with our Digital WE Days. We are continuing this successful concept this year." From April 22 to 25, 2024, experts from Würth Elektronik, Rohde & Schwarz, onsemi, Infineon, Texas Instruments, Cambridge GaN Devices, Silent Solutions, as well as Wired & Wireless Technologies, will provide for a varied and high-caliber presentation program. A 30-minute presentation is followed by an interactive Q&A session lasting around a quarter of an hour, which further deepens the knowledge imparted in the expert presentation. "We know the current market and technology trends as well as our customers," Gerfer continues. "On this basis, we've once again put together an interesting and contemporary presentation program this year – from practitioners for practitioners." Digital WE Days 2024 is a free service from Würth Elektronik. All presentations can be booked individually. Registration for the virtual conference is now open. 26.03.2024 06:00:00Marnews_2024-04-01_1.jpg\images\news_2024-04-01_1.jpghttps://www.we-online.com/en/news-center/press?d=digital-we-days-2024we-online.com
Exhibition spreading from Coil-Winding to e-MobilityTaking place from May 14-16 2024, this CWIEME Berl...11827Event NewsExhibition spreading from Coil-Winding to e-MobilityTaking place from May 14-16 2024, this CWIEME Berlin exhibition will see leading professionals come together to discuss and showcase innovative products from the coil winding, transformer, generator, electric motor manufacturing and e-mobility sectors. For 2024, the event has secured many industry professionals to participate in sessions and talks that will discuss latest innovations, technologies and key issues in the electrical engineering industry. Confirmed speakers include representatives from The International Copper Association, Syensqo, S&P Global Mobility, Siemens Energy, Thyssenkrupp Steel Europe, Hitachi Energy, SGB-SMIT GmbH, STILRIDE, Mckinsey Center for Future Mobility and Ford Europe. The central stage will cover a host of topics such as innovation in transformers oils, driving sustainability in the manufacturing and energy sectors with a deep dive into eco-friendly practices in the steel industry, and a panel discussion on what the future holds for rare earth materials. The e-mobility stage will host talks including a keynote speech on decarbonisation in the automotive sector, a session on the importance of reliability for electric vehicle (EV) infrastructure, a panel discussion on the emerging trends, a talk on innovations and advancements in new motor technologies, and a session on how the automotive industry can remain competitive in the age of electrification.25.03.2024 13:00:00Marnews_2024-04-01_8.jpg\images\news_2024-04-01_8.jpghttps://berlin.cwiemeevents.com/homeberlin.cwiemeevents.com
Successful Funding of GaN Technology CompanyCambridge/UK-based QPT, a company which is active ...11825Industry NewsSuccessful Funding of GaN Technology CompanyCambridge/UK-based QPT, a company which is active in developing highly efficient GaN-based electric motor controls, has announced that its Crowdcube funding round has just passed the one million pound milestone. Rupert Baines, QPT's new CEO, said, "QPT has a … combination of an amazing technology that can cut the power consumption of electric motors by 10% thereby providing a way to actively help reduce climate change and a management team of veterans of the GaN industry." QPT's qGaN technology is a solution for the issues of overheating and RF interference that currently limit the speeds that GaN can be driven at. "Now GaN transistors can be run at much higher speeds than any other rival technology – 20 times faster than SiC for example", Rupert Baines adds. "Our solution is smaller with a significantly lower system cost and saves more energy than rivals according to our studies. I am really excited to be heading a company with a real roadmap to make the world a better place."25.03.2024 11:00:00Marnews_2024-04-01_6.jpg\images\news_2024-04-01_6.jpghttps://www.q-p-t.com/q-p-t.com
Polyimide Coated Magnet Wires for >800 VElectrical breakdown of high-temperature insulatio...11836Product ReleasePolyimide Coated Magnet Wires for >800 VElectrical breakdown of high-temperature insulation materials can be prevented by using thermoplastic Polyimide, TPI. This polymer can be extrusion-coated as other polymers, but AURUM&reg;, TPI reduces electrical and magnetic losses. With 245 °C AURUM claims to have the highest T<sub>g</sub> of any commercially available Thermoplastic, and its insulation performance especially at temperatures above 150 °C is stated to beat any other know insulation. AURUM reduces electrical and magnetic losses with a comparative tracking index (CTI) of > 600 volts. Thermoplastic Polyimide (TPI) produced by Mitsui Chemicals of Japan, and sold by BEIGLO GmbH is known for its thermal stability, high-temperature resistance, and electrical insulation properties. TPI coated magnet wires are a suitable choice for high-voltage applications (800 V and above).21.03.2024 13:30:00Marnews_2024-04-01_17.jpg\images\news_2024-04-01_17.jpghttps://www.bieglo.com/applications-of-thermoplastic-polyimide-aurum/bieglo.com
Automotive N-Channel MOSFETs for 48 V ApplicationsToshiba has launched two automotive N-channel powe...11835Product ReleaseAutomotive N-Channel MOSFETs for 48 V ApplicationsToshiba has launched two automotive N-channel power MOSFET devices to meet the growing demand for 48 V batteries and systems within automotive applications including inverters, semiconductor relays, load switches, motor drives and more. The 80V XPQR8308QB and 100V XPQ1R00AQB are based upon Toshiba's U-MOS X-H process. This gives low levels of on-resistance with the XPQR8308QB measuring less than 0,83 m&#8486; while the XPQ1R00AQB does not exceed 1,03 m&#8486;. The devices are rated for I<sub>D</sub> values of 350 A (XPQR8308QB) and 300 A (XPQ1R00AQB) continuously with pulsed values (I<sub>DP</sub>) of 1050 A and 900 A respectively. Supporting these values, the L-TOGL&trade; package adopts a thick copper clip-based leadframe structure that thermally and electrically connects the MOSFET die to the package leads. This reduces the package resistance by approximately 70% and channel-to-case thermal impedance by 50% compared with the TO-220SM(W) package. Together, the process and clip reduce losses and heat generation while creating a very thermally efficient solution. Furthermore, the L-TOGL package uses compliant gull-wing leads which reduce mounting stress and improve the reliability of solder joints. Both devices are AEC-Q101 qualified for automotive applications. Toshiba offers to ship devices grouped to within 0.4V based upon their gate threshold voltage.21.03.2024 12:30:00Marnews_2024-04-01_16.jpg\images\news_2024-04-01_16.jpghttps://toshiba.semicon-storage.com/eu/company/news/2024/03/mosfet-20240321-1.htmltoshiba.semicon-storage.com
Reference Design for Qi2 Wireless Charging ImplementationAs major charger manufacturers, including those in...11834Product ReleaseReference Design for Qi2 Wireless Charging ImplementationAs major charger manufacturers, including those in the automotive industry, are working to implement Qi&reg; v2.0 (Qi2) standards, Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) with support for magnetic alignment between the transmitter and the receiver. The DSC's flexible software architecture enables the support of a combination of MPP and Extended Power Profile (EPP) of Qi 2.0 with one controller. Utilizing the Qi2 reference design helps minimize customer risk in certifying their final product, which is required to pass through the Qi certification process. As it integrates several of Microchip's automotive-qualified parts, the dual-pad charger also meets automotive standards for reliability and safety and supports Autosar. An integrated CryptoAuthentication&trade; IC provides security to meet the stringent authentication requirement of Qi standards. The reference design is hardware reconfigurable and capable of supporting most transmitter topologies.21.03.2024 11:30:00Marnews_2024-04-01_15.jpg\images\news_2024-04-01_15.jpghttps://www.microchip.com/en-us/about/news-releases/products/microchip-technology-releases-qi-v2-0-standards-compliant-dspic-basedmicrochip.com
DC/DC Converter for 500 W with High ReliabilityThe MGDS-500 Series from Gaia feature a full range...11832Product ReleaseDC/DC Converter for 500 W with High ReliabilityThe MGDS-500 Series from Gaia feature a full range of high density, wide input range DC/DC power modules designed for aerospace, military and high-end industrial applications. With 500 W output power, the MGDM-500 Series is particularly suitable for ultra compact power supply design. Standard models are available with wide input voltage ranges of 9-36V<sub>DC</sub> and 16-80V<sub>DC</sub>, and provide output voltages of 12, 15, 24, 28, and 48 V<sub>DC</sub>. Over the entire 500 W output power range the MGDM-500, which is integrated into a half-brick package, operates with an efficiency of up to 91%. Its Galvanic isolation is 1500 V<sub>DC</sub>, while the switching frequency is 300 kHz. Trim adjustment is possible from 90% to 110%, and the external synchronization range is specified 270 to 330 kHz. The synchronization function allows more than one converter to operate with an external source frequency. All modules incorporate LC network filters to minimize reflected input current ripple and output voltage ripple. The modules have totally independent functions including input under voltage lock-out, output overvoltage protection, output current limitation protection, and temperature protection. Additionally, a soft-start function allows current limitation and eliminates inrush current during start-up.21.03.2024 09:30:00Marnews_2024-04-01_13.jpg\images\news_2024-04-01_13.jpghttps://www.gaia-converter.com/products/mgdm-500/gaia-converter.com
Akquisition of Industrial Drive Technology CompanySiemens has signed an agreement to acquire the ind...11823Industry NewsAkquisition of Industrial Drive Technology CompanySiemens has signed an agreement to acquire the industrial drive technology (IDT) business of ebm-papst. The business, which employs around 650 people, includes intelligent, integrated mechatronic systems in the protective extra-low voltage range and innovative motion control systems. These systems are used in free-range driverless transport systems. The transaction is to be completed by mid-2025, subject to the necessary foreign trade and merger control approvals. The IDT business of ebm-papst is located in St. Georgen, Germany and Lauf an der Pegnitz, Germany, as well as in Oradea, Romania.21.03.2024 09:00:00Marnews_2024-04-01_4.jpg\images\news_2024-04-01_4.jpghttps://press.siemens.com/global/en/pressrelease/siemens-acquire-industrial-drive-technology-business-ebm-papstsiemens.com
Industrial AC/DC Power SuppliesTDK Corporation introduced its ZWS-C series of 10,...11830Product ReleaseIndustrial AC/DC Power SuppliesTDK Corporation introduced its ZWS-C series of 10, 15, 30 and 50 W rated industrial AC/DC power supplies. The products meet EN55011/EN55032-B conducted and radiated EMI in either a Class I or Class II (double insulated) construction, without the need for external filtering or shielding. With electrolytic capacitor lifetimes of up to 15 years, the ZWS-C can be used in factory automation, robotics, semiconductor fabrication manufacturing and test and measurement equipment. Available output voltages are 5 V, 12 V, 15 V, 24 V as well as 48 V for the ZWS50-C model only. The ZWS10-C and the ZWS15-C models measure 63.5 x 45.7 x 22.1 mm<sup>3</sup> (L x W x H), the ZWS30-C 76.2 x 50.8 x 24.2mm<sup>3</sup>, and the ZWS50-C 76.2 x 50.8 x 26.7 mm<sup>3</sup>. The operating temperature with convection cooling and standard mounting is -10 oC to 70 oC derating linearly to 50% load above 50 to 70 oC. With an external airflow of 0.8 m/s, the power supplies can operate at full load. No load power consumption is typically less than 0.3 W. The power supplies have a 3 kVac input to output, 2 kVac input to ground and 750 Vac output to ground (Class I) isolation. All models are certified to the IEC/UL/CSA/EN62368-1 for AV, information and communication equipment standard and EN60335-1 for household electrical equipment.21.03.2024 07:30:00Marnews_2024-04-01_11.jpg\images\news_2024-04-01_11.jpghttps://www.emea.lambda.tdk.com/uk/news/article/19889lambda.tdk.com
Paving the Way to use Diamonds in UWBG SemiconductorsHeraeus is making a multi-million-euro investment ...11821Industry NewsPaving the Way to use Diamonds in UWBG SemiconductorsHeraeus is making a multi-million-euro investment in Compound Semiconductor (Xiamen) Technology Co. (CSMH), a China-headquartered material supplier of premium industrial diamond. This strategic partnership aims to drive innovations in the semiconductor industry by leveraging diamond's unique thermal conductivity and electrical insulation properties. Heraeus signed an investment agreement with CSMH, and the deal is expected to close in several weeks. As part of the agreement, Heraeus will hold a stake in the company and receive a seat on the board of directors. Single-crystal diamond is ultra-wideband gap (UWBG) semiconductor material with the highest known thermal conductivity, surpassing existing thermal solutions such as copper by several times. Typical silicon has a thermal conductivity around 140 W/(m-K), copper is about 400 W/(m-K), and diamond has a much higher thermal conductivity up to 2200 W/(m-K). This allows heat to be dissipated more efficiently, enabling high-performance components to endure with maximum efficiency. In addition to its superior heat dissipation properties, diamond also withstands extremely high voltages without causing an electric breakdown. This is critical for advancing miniaturization, efficiency, and robustness in power electronics. CSMH's core business includes the production of polycrystalline and large-sized monocrystalline diamonds, which are particularly important for high-end applications in the semiconductor industry.20.03.2024 07:00:00Marnews_2024-04-01_2.jpg\images\news_2024-04-01_2.jpghttps://www.heraeus-group.com/en/news-and-stories/investment-in-csmh/heraeus-group.com
Conference on Topics around Electric Drives ProductionThe Electric Drives Production Conference (E|DPC) ...11826Event NewsConference on Topics around Electric Drives ProductionThe Electric Drives Production Conference (E|DPC) 2024 is a platform for the exchange of developers, researchers and users of electric drives. Now the call for papers is open to present the latest technical expertise in front of professionals from science and industry. The E|DPC will take place as a hybrid event from November 26 to 27, 2024 at the marinaforum Regensburg and online. Key topics include electric machine design, power electronics and control methods, new materials and semi-finished products, magnet materials and processing, manufacturing technologies for soft magnetic materials, winding technologies, insulation technologies, assembly and handling technologies, electric drive production systems, production of electrical actuators, industry 4.0 applications in electric drives production, sustainability in product lifecycle, new applications for electric drives, electromobility, electric drive specific testing, accompanying economic research, additive manufacturing, energy transfer for electric vehicles and interconnecting technologies.19.03.2024 12:00:00Marnews_2024-04-01_7.jpg\images\news_2024-04-01_7.jpghttps://www.edpc.eu/call-for-papersedpc.eu
GaN for Low-cost E-Bikes, Drones, and RoboticsEPC now offers the EPC9193, a 3-phase BLDC motor d...11831Product ReleaseGaN for Low-cost E-Bikes, Drones, and RoboticsEPC now offers the EPC9193, a 3-phase BLDC motor drive inverter using the EPC2619 eGaN FET. The EPC9193 operates with a input DC voltage ranging from 14 V and 65 V and has two configurations – a standard unit and a high current version: While the EPC9193 standard reference design uses a single FET for each switch position for delivering up to 30 Arms maximum output current, a high current configuration version of the reference design, the EPC9193HC, uses two paralleled FETs per switch position with the ability to deliver up to 60 A<sub>pk</sub> (42 A<sub>rms</sub>) maximum output current. Both versions of the EPC9193 contain all the necessary critical function circuits to support a complete motor drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions. The EPC9193 boards measure 130 mm x 100 mm (including connector). Major benefits of a GaN-based motor drive are exhibited with these reference design boards, including lower distortion for lower acoustic noise, lower current ripple for reduced magnetic loss, and lower torque ripple for improved precision. The extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight. EPC provides full demonstration kits, which include interface boards that connect the inverter board to the controller board development tool for fast prototyping that reduce design cycle times.19.03.2024 08:30:00Marnews_2024-04-01_12.jpg\images\news_2024-04-01_12.jpghttps://epc-co.com/epc/about-epc/events-and-news/news/artmid/1627/articleid/3164/gan-for-low-cost-e-bikes-drones-and-roboticsepc-co.com
Trade Show in Kuala Lumpur, Malaysia: Doubling ParticipationWith the Southeast Asia semiconductor sector attra...11822Event NewsTrade Show in Kuala Lumpur, Malaysia: Doubling ParticipationWith the Southeast Asia semiconductor sector attracting growing worldwide investments as more regions diversify their supply chains, the stage is set for SEMICON Southeast Asia 2024 as visionaries and experts gather May 28-30, 2024 at MITEC in Kuala Lumpur, Malaysia for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development. Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 will feature more than 500 exhibiting companies and more than 1,000 booths, doubling participation from last year's exhibition and conference. The exponential expansion underscores the rising interest in Southeast Asia's semiconductor sector and the increasing importance of SEMICON Southeast Asia, the region's premier global electronics manufacturing and supply chain event, in bringing industry stakeholders together to pursue new innovation and growth opportunities. For example, there will regional pavilions from semiconductor regions such as China, Europe, Malaysia, Netherlands, Korea, Singapore, Taiwan and Southeast Asia. Several forums will focus on market and industry trends, sustainability, chiplet and heterogeneous integration, advanced product testing and more. In industry gala night will enable the attendees to connect and to expand their business network.19.03.2024 08:00:00Marnews_2024-04-01_3.jpg\images\news_2024-04-01_3.jpghttps://www.semiconsea.org/semiconsea.org
Primary LDO Family for Automotive ApplicationsROHM has developed 45 V rated 500 mA output primar...11837Product ReleasePrimary LDO Family for Automotive ApplicationsROHM has developed 45 V rated 500 mA output primary LDO regulators, the BD9xxM5-C series. These devices are suitable for supplying power to automotive electronic components such as ECUs that operate from vehicle batteries. The BD9xxM5-C incorporates original QuiCur&trade; high-speed load response technology that is stated to deliver excellent response characteristics to load current fluctuations. For example, the LDO can maintain output to within 100 mV of set voltage even as the load changes between 0 and 500 mA in 1 µs (Rise time/Fall time). Furthermore, low 9.5 µA (typ.) current consumption contributes to lower power consumption in automotive applications. These products will be available in four packages, ranging from the compact HTSOP-J8 to the high heat dissipation TO252 (TO252-3/TO252-5) and HRP5 types. This allows users to select the most suitable package for each use case. The BD9xxM5-C meets the basic requirements for automotive products, including 150 °C operation and qualification under the AEC-Q100 automotive reliability standard. The lineup will be expanded to comprise a total of 18 models, (including the TO252-3, TO252-5, and HRP5 packages) by FY2024.14.03.2024 14:30:00Marnews_2024-04-01_18.jpg\images\news_2024-04-01_18.jpghttps://www.rohm.com/news-detail?news-title=2024-03-14_news_ldo&defaultGroupId=falserohm.com
Trade Show about EMC Components, Testing and ShieldingThe EMV achieved an impressive response in Cologne...11824Event NewsTrade Show about EMC Components, Testing and ShieldingThe EMV achieved an impressive response in Cologne from March 12 - 14, 2024. The trade fair, accompanied by a scientific conference with workshops, featured 111 national and international exhibitors from 20 countries. Key players such as Rohde & Schwarz, Frankonia and EMC Test NRW as well as 21 companies, taking part in the EMV for the first time, were also present. More than 2,500 trade visitors – including the editorial team of Bodo's Power Systems – took the opportunity to find out about the industry's entire range of topics: from filters and filter components to EMC testing and shielding including its latest developments. A lively exchange of specialist knowledge was also high on the agenda in Cologne. Current trends this time around included EMC in electromobility, smart technologies, power electronics and the use of artificial intelligence in EMC. Parallel to the trade fair, the EMV Conference offered an extensive program with 49 conference lectures, 24 workshops and poster presentations held for the first time. The event demonstrated the growing importance of EMC in an increasingly networked world. In view of the growing number of potential sources of interference and even more complex systems, it has become clear that awareness of EMC issues is steadily rising. More than 700 conference bookings illustrated the high level of interest in the event. The next EMV event will take place from 25 - 27.3.2025 in Stuttgart.14.03.2024 10:00:00Marnews_2024-04-01_5.jpg\images\news_2024-04-01_5.jpghttps://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/finalreport24.htmlemv.mesago.com
Oscilloscope Days EventRohde & Schwarz has announced that its Oscilloscop...11808Event NewsOscilloscope Days EventRohde & Schwarz has announced that its Oscilloscope Days educational event will return for two days, April 17 to 18, 2024. Experts from Rohde & Schwarz and partner companies will present the latest updates on fundamentals and test features for engineers using next-generation oscilloscopes, covering topics such as power electronics and EMC, as well as signal and power integrity. The Oscilloscope Days event will be hosted online over two days and will deliver insights into the accurate measurement of digital signals and power electronics for purposes including product design, development, debugging and compliance testing. Rohde & Schwarz application engineers, together with experts from long-time event partners Würth Elektronik and PE-Systems, will present measurement challenges and techniques. There will be eight online sessions of up to 30 minutes each over the two mornings, with time for questions and answers after each session. Each session will be presented in English and will include cases based on real applications. Registrants can select the sessions they wish to attend.13.03.2024 12:00:00Marnews_2024-03-15_8.jpg\images\news_2024-03-15_8.jpghttps://www.rohde-schwarz.com/de/unternehmen/news-und-presse/all-news/rohde-schwarz-hosts-next-edition-of-popular-oscilloscope-days-event-in-april-2024-pressemitteilungen-detailseite_229356-1476672.htmlrohde-schwarz.com
200 V MOSFETs stated to set a new Industry BenchmarkInfineon claims that motor drive applications are ...11833Product Release200 V MOSFETs stated to set a new Industry BenchmarkInfineon claims that motor drive applications are taking a leap forward with the launch of the company's OptiMOS&trade; 6 200 V MOSFET product family. The new portfolio is designed to deliver high performance in applications such as e-scooters, micro-EVs, and E-forklifts. The improved conduction losses and switching behavior for these MOSFETs reduce the electromagnetic interference (EMI) and switching losses e. g. in applications like servers, telecom, energy storage systems, audio and solar. Additionally, the combination of a wide safe operating area (SOA) and "industry-leading R <sub>DSon</sub>" fits to static switching applications such as  battery management systems. With the introduction of the OptiMOS 6 200 V product family, Infineon claims to set "a new industry benchmark with increased power density, efficiency, and system reliability". Compared to its predecessor, OptiMOS 3, OptiMOS 6 200 V features a 42 percent lower R <sub>DSon</sub> and a diode behaviour softness, which is more than three times that of the OptiMOS 3. Combined with up to 89 percent reduction in Q <sub>RRtyp</sub>, the switching and EMI behaviors are significantly improved. The technology also features improvements in parasitic capacitance linearity (C <sub>oss</sub> and C <sub>rss</sub>), which reduces oscillation during switching and lowers voltage overshoot. A tighter V <sub>GSth</sub> spread and lower transconductance aid in MOSFET paralleling and current sharing, leading to more uniform temperatures and reducing the number of paralleled MOSFETs.13.03.2024 10:30:00Marnews_2024-04-01_14.jpg\images\news_2024-04-01_14.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202403-076.htmlinfineon.com
Resettable Thermal Cutoff DevicesBourns announced some miniature resettable thermal...11829Product ReleaseResettable Thermal Cutoff DevicesBourns announced some miniature resettable thermal cutoff (TCO) device series, also known as mini-breakers, that are designed to control abnormal, excessive current virtually instantaneously, up to rated limits. The Model NX Series offers higher current-carrying capabilities combined with a very low-profile package at a height of 0.94 mm and body width of 2.8 mm. These features make this series an ideal overtemperature and overcurrent protection solution for lithium polymer and prismatic cells in high energy density, smaller batteries such as next-generation notebook PC and tablet battery cells, as well as handheld and wearable electronics. With the same footprint as the company's model NR series the model NX series can carry 40 percent more current. The new Model NX Series has current capabilities from 12 A to 20 A at 60 °C and is available with or without welding projections. These TCO devices are available with four trip temperature options of 77 °C, 82 °C, 85 °C and 90 °C - all of which operate within a ±5 °C tolerance. The Model NX Series also is designed with a high-rated corrosion resistant bimetal mechanism that delivers enhanced endurance in humid environments compared to standard TCO devices.12.03.2024 06:30:00Marnews_2024-04-01_10.jpg\images\news_2024-04-01_10.jpghttps://www.bourns.com/news/press-releases/pr/2024/03/12/bourns'-latest-miniature-resettable-thermal-cutoff-(tco)-devices-feature-higher-current-carrying-capabilities-to-protect-today's-high-energy-density-batteriesbourns.com
Automotive-grade Super-Junction MOSFETsAutomotive-grade 600 V/650 V super-junction MOSFET...11838Product ReleaseAutomotive-grade Super-Junction MOSFETsAutomotive-grade 600 V/650 V super-junction MOSFETs in STPOWER MDmesh DM9 AG series are claimed to deliver superior efficiency and ruggedness for on-board chargers (OBCs) and DC/DC converter applications in both hard- and soft-switching topologies. Compared to the previous generation, the latest MDmesh DM9 technology ensures a tighter gate-source threshold voltage (V<sub>GSth</sub>) spread that results in sharper switching for lower turn-on and turn-off losses. In addition, body-diode reverse recovery is improved, leveraging a new optimized process that also increases the MOSFETs' overall ruggedness. The diode's low reverse-recovery charge (Q<sub>rr</sub>) and fast recovery time (t<sub>rr</sub>) make the MDmesh DM9 AG series well-suited for phase-shift zero-voltage switching topologies that demanding high efficiency. The first device in the STPOWER MDmesh DM9 AG series from STMicroelectronics is the STH60N099DM9-2AG, a 27A AEC-Q101 qualified N-channel 600 V device in H2PAK-2, with 76 m&#8486; typical R<sub>DSon</sub>. ST will expand the family to provide a full range of devices, covering a broad range of current ratings and R<sub>DSon</sub> from 23 m&#8486; to 150 m&#8486;.11.03.2024 15:30:00Marnews_2024-04-01_19.jpg\images\news_2024-04-01_19.jpghttps://newsroom.st.com/media-center/press-item.html/n4613.htmlst.com
GaN and SiC Technologies to Enable Next-Gen AI Power DeliveryNavitas Semiconductor has announced their AI data ...11809Product ReleaseGaN and SiC Technologies to Enable Next-Gen AI Power DeliveryNavitas Semiconductor has announced their AI data center technology roadmap for up to 3x power increase to support similar exponential growth in AI power demands expected in just the next 12-18 months. To meet this exponential power increase, Navitas is developing server power platforms which rapidly increase from 3kW to up to 10kW. In August 2023, Navitas introduced a 3.2kW data center power platform utilizing latest GaN technology enabling over 1638.7W/cm3 and over 96.5% efficiency. Now, Navitas is releasing a 4.5kW platform enabled by a combination of GaN and SiC to push densities over 2131.1W/cm<sup>3</sup> and efficiencies over 97%. Navitas also announces its plans to introduce an 8-10kW power platform by the end of 2024 to support 2025 AI power requirements. The platform will utilize newer GaN and SiC technologies and further advances in architecture to set all-new industry standards in power density, efficiency and time-to-market. Navitas is already engaged with major data-center customers, with full platform launch anticipated in Q4 ’24, completing this 3x increase in power demands in only 12-18 months.11.03.2024 06:30:00Marnews_2024-03-15_9.jpg\images\news_2024-03-15_9.jpghttps://navitassemi.com/navitas-gan-and-sic-technologies-to-enable-next-gen-ai-power-delivery/navitassemi.com
1200-V IGBTs on 300 mm WafersHitachi Energy increases its power semiconductor c...11802Industry News1200-V IGBTs on 300 mm WafersHitachi Energy increases its power semiconductor capacity by introducing the 300 mm wafer. The development enables more complex structures in 1200 V insulated gate bipolar transistors. Applications for IGBT include variable frequency drives (VFD), uninterruptible power supply (UPS) systems, electric cars, trains and air conditioners, among others. The larger wafer offers numerous benefits, including the potential to yield over double (2.4 times) the number of functioning integrated circuits per wafer as compared to the existing 200 mm wafer, leading to significant cost savings. It utilizes the latest fine pattern trench IGBT design, resulting in energy-efficient power conversion and control and minimizing power losses during operations. Semiconductor experts at Hitachi Energy achieved this milestone through close collaboration with a cross-functional team, including Product Management, Business Development, Research & Development, and a chip foundry partner. 06.03.2024 07:00:00Marnews_2024-03-15_2.jpg\images\news_2024-03-15_2.jpghttps://www.hitachienergy.com/news/features/2024/03/hitachi-energy-advances-its-semiconductor-technology-with-first-300-mm-wafer-for-igbthitachienergy.com
Silicon Carbide Technology drives DecarbonizationThe Infineon CoolSiC&trade; MOSFET 650 V and 1200 ...11813Product ReleaseSilicon Carbide Technology drives DecarbonizationThe Infineon CoolSiC&trade; MOSFET 650 V and 1200 V Generation 2 improve MOSFET key performance figures such as stored energies and charges by up to 20 percent compared to the previous generation without compromising quality and reliability levels leading to higher overall energy efficiency and further contributing to decarbonization. CoolSiC MOSFET Generation 2 (G2) technology continues to leverage performance capabilities of silicon carbide by enabling lower energy loss that turns into higher efficiency during power conversion. This provides strong benefits to customers for various power semiconductor applications such as photovoltaics, energy storage, DC EV charging, motor drives and industrial power supplies. A DC fast charging station for electric vehicles which is equipped with CoolSiC G2 allows for up to 10 percent less power loss compared to previous generations, while enabling higher charging capacity without compromising form factors. Traction inverters based on CoolSiC G2 devices can further increase electric vehicle ranges. In the area of renewable energies, solar inverters designed with CoolSiC G2 make smaller sizes possible while maintaining a high power output, resulting in a lower cost per watt.05.03.2024 10:30:00Marnews_2024-03-15_13.jpg\images\news_2024-03-15_13.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFGIP202403-073.htmlinfineon.com
Energy Harvesting Workshop in ItalyA Workshop named EnerHarv 2024 is said “to bring t...11803Event NewsEnergy Harvesting Workshop in ItalyA Workshop named EnerHarv 2024 is said “to bring together experts from around the world working on all technical areas relevant to energy harvesting, power management and its IoT applications”. This non-profit workshop, organized and sponsored by the Power Sources Manufacturers Association (PSMA), will be held in Perugia, Italy from June 26 to 28, 2024. The event will be hosted by the Noise in Physical Systems (NiPS Lab), Dept. of Physics & Geology of the University of Perugia (UNIPG). EnerHarv’s vision is “to create a focal point for experts and users of energy harvesting and related technologies to share knowledge, best practices, roadmaps, experiences and provide opportunities for collaboration to increase the uptake of such technologies”. The workshop is targeted at a broad audience from industry and academia working on materials and devices for energy harvesting and storage, low-power sensors and circuits, micro power management, and their applications in powering IoT devices for health and environmental monitoring, assisted living, and monitoring of equipment and buildings. It will comprise presentations (by invitation only), demos, poster, panels sessions and time for networking activities. There is an open call for demonstrations and posters. 05.03.2024 08:00:00Marnews_2024-03-15_3.jpg\images\news_2024-03-15_3.jpghttps://www.enerharv.com/enerharv.com
Going for Mass Production: Funding Round to Support Growth for GaN SolutionsWise-integration, a French company active in digit...11807Industry NewsGoing for Mass Production: Funding Round to Support Growth for GaN SolutionsWise-integration, a French company active in digital control of gallium nitride and GaN ICs for power supplies, has secure financing of 15 million Euros. The Series B round was led by imec.xpand with participation from other investors. The round will fuel mass production and commercial deployment of the company’s flagship products, WiseGan and WiseWare, its “disruptive digital-control technology”, and its support for clients globally as they adopt these solutions. It included the five investors from the previous funding and three new investors. Since its launch in 2020, the fabless company has been known as an innovator in the power electronics industry, building a portfolio of more than 10 patent families. WiseGan encompasses GaN power integrated circuits designed to maximize the benefits of GaN technology. WiseWare is a 32-bit, MCU- based, AC/DC digital controller optimized for GaN-based power supply architectures, which is said to offer simplified system design, a lower bill of materials and improved power density and efficiency. This combination enables the development of technologies facilitating chargers that are up to 3x smaller, 3x more efficient, and 3x lighter, catering to power requirements from 30 W to 7 kW. The company’s target markets include consumer electronics to industrial applications to electric vehicles. 01.03.2024 12:00:00Marnews_2024-03-15_7.jpg\images\news_2024-03-15_7.jpghttps://wise-integration.com/wise-integration-raises-e15-million-in-series-b-funding-round-to-support-international-growth-for-its-innovative-gan-solutions/wise-integration.com
PoE ASFETs and EMC-optimized MOSFETsNexperia announced the release of several MOSFETs ...11814Product ReleasePoE ASFETs and EMC-optimized MOSFETsNexperia announced the release of several MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets. This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance. PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging. A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in <sub>RDS(on)</sub>.  These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example. EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower R<sub>DS(on)</sub> (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count. Nexperia has optimized its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.27.02.2024 11:30:00Febnews_2024-03-15_14.jpg\images\news_2024-03-15_14.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-broadens-its-range-of-discrete-FET-solutions-at-APEC-2024nexperia.com
Collaboration to Accelerate Automotive Electrification Arrow Electronics and its engineering services com...11806Industry NewsCollaboration to Accelerate Automotive Electrification Arrow Electronics and its engineering services company, eInfochips, are working with Infineon Technologies to help eInfochip’s customers accelerate the development of electric vehicle (EV) chargers. Development of EV chargers, especially DC “fast chargers,” is becoming increasingly challenging to equipment manufacturers due to several factors, such as lack of prior experience, stringent functional safety and reliability requirements, and a fledgling support network. The collaboration between Arrow and Infineon aims to help innovators navigate these challenges while accelerating time-to-market. As part of the collaboration, Arrow’s High Power Center of Excellence has developed a 30 kW DC fast charger reference platform. This includes Infineon’s 1200V CoolSiC easy power modules and also hardware design, embedded firmware, bi-directional charging support and energy metering functionality. 26.02.2024 11:00:00Febnews_2024-03-15_6.jpg\images\news_2024-03-15_6.jpghttps://news.fiveyearsout.com/news-releases/news-details/2024/Arrow-Electronics-and-Infineon-Collaborate-to-Accelerate-Automotive-Electrification/default.aspxfiveyearsout.com
Joint Solution for BLDC MotorsAmberSemi and ST Microelectronics have jointly dev...11804Industry NewsJoint Solution for BLDC MotorsAmberSemi and ST Microelectronics have jointly developed a reference design for brushless motors by using AmberSemi’s AC Direct DC Enabler Power Conversion Technology and ST’s STM32 MCU devices. The reference design takes a direct AC input through AmberSemi’s patented AC Direct DC Enabler technology and powers the ST microcontroller, gate drivers and Hall sensors for brushless motor applications. Compared to typical brushless DC motor-control design, AmberSemi’s off-line solution provides up to 5 W of regulated output, which is enough to drive today's requirement of control logic and sensors, with additional headroom for expanded intelligent functionality. The Enabler offers selectable output voltages determined by internal, configurable register settings or with a simple external voltage-divider feedback circuit. Through the integrated SPI communication port and coupled with an SPI-equipped MCU the designer can set alarm bits, protection thresholds, monitor status bits for over-current, over/under voltage, over-temperature and interrupt signals on the Enabler. 26.02.2024 09:00:00Febnews_2024-03-15_4.jpg\images\news_2024-03-15_4.jpghttps://ambersi.com/ambersemi-showcases-its-power-products-with-st-embedded-solutions/ambersi.com
IGBT based Intelligent Power Modulesonsemi announced the availability of its 1200V SPM...11810Product ReleaseIGBT based Intelligent Power Modulesonsemi announced the availability of its 1200V SPM31 Intelligent Power Modules (IPMs) featuring the latest generation Field Stop 7 (FS7) Insulated Gate Bipolar Transistor (IGBT) technology. The SPM31 IPMs deliver higher efficiency, smaller footprint and higher power density resulting in lower total system cost. Given the greater efficiency realized using optimized IGBTs, these IPMs are ideal for three-phase inverter drive applications such as heat pumps, commercial HVAC systems, servo motors, and industrial pumps and fans. The SPM31 IPMs control the power flow to the inverter compressor and fans in heat pumps and air conditioning systems by adjusting the frequency and voltage of the power supplied to three-phase motors for maximum efficiency. For example, onsemi’s 25A-rated SPM31 using FS7 IGBT technology can decrease power losses by up to 10% and increase in power density up to 9%, compared to our previous generation products. With the transition to electrification and heightened efficiency mandates, these modules help manufacturers drastically improve system design while increasing efficiency in heating and cooling applications. With the improved performance, our SPM31 IPM family featuring FS7 enables high efficiency with reduced energy losses, further reducing harmful emissions globally.26.02.2024 07:30:00Febnews_2024-03-15_10.jpg\images\news_2024-03-15_10.jpghttps://www.onsemi.com/company/news-media/press-announcements/en/onsemi-introduces-7th-gen-igbt-based-intelligent-power-modules-to-reduce-energy-consumption-in-heating-and-coolingonsemi.com
Series of Supercapacitor Modules With the Supercapacitor modules of the SCM series ...11819Product ReleaseSeries of Supercapacitor Modules With the Supercapacitor modules of the SCM series from KYOCERA AVX, Rutronik offers robust components for industrial applications that require high peak performance. The SCM series is suitable for high-current or industrial applications, including renewable energy generation, grid-connected storage, or the buffering of power peaks. Thanks to active balancing, the capacitor modules have a stable voltage level in the individual cells installed in the module. They operate individually or in combination with batteries or accumulators. Either they supply energy as a backup or support providing power peaks together with batteries or accumulators. In this case, they often have a positive effect on the service life of the battery or accumulator. Due to the convincing characteristics of the individual capacitors used, the SCM modules achieve their special pulse load capacity. The combination of very high capacitance and very low internal resistance (ESR) enables a high power density and high efficiency. The modules are also characterized by a high mechanical load capacity and can withstand high currents, frequent charging and discharging cycles, and strong vibrations. They are designed for operating temperatures from -40 °C to +65 °C and can handle several million cycles, depending on the application. In addition, the modules are lead-free, RoHS-compliant, and meet the UL 810A standard.22.02.2024 16:30:00Febnews_2024-03-15_19.jpg\images\news_2024-03-15_19.jpghttps://www.rutronik24.com/kyocera-avx.htmlrutronik24.com
Additional Manufacturing Capacity for wBMS SemiconductorsAnalog Devices (ADI) has made a special arrangemen...11801Industry NewsAdditional Manufacturing Capacity for wBMS SemiconductorsAnalog Devices (ADI) has made a special arrangement with TSMC to supply long-term wafer capacity through Japan Advanced Semiconductor Manufacturing (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. Building on ADI’s more than 30-year partnership with TSMC, this adds another option for ADI to secure additional capacity of fine-pitch technology nodes to serve critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL) applications.22.02.2024 14:00:00Febnews_2024-03-01_9.jpg\images\news_2024-03-01_9.jpghttps://www.analog.com/en/newsroom/press-releases/2024/2-22-2024-adi-strengthens-capacity-resiliency-through-expanded-partnership-tsmc.htmlanalog.com
PWM Control, 700V GaN FET, X-Cap discharge, ACF Driver and UHV Start-up Regulator in Single ChipSilanna Semiconductor has expanded its CO<sub>2</s...11816Product ReleasePWM Control, 700V GaN FET, X-Cap discharge, ACF Driver and UHV Start-up Regulator in Single ChipSilanna Semiconductor has expanded its CO<sub>2</sub> Smart Power Family&trade; of AC/DC and DC/DC converter technologies with the launch of an active clamp flyback (ACF) controller that integrates adaptive digital PWM control with ultra-high-voltage (UHV) components comprising a 700 V primary GaN FET, X capacitor (X-Cap) discharge circuit, active clamp driver and start-up regulator. Silanna’s CO<sub>2</sub> Smart Power technologies help engineers by simplifying design and improving performance while addressing environmental sustainability goals through more efficient energy use. Well-suited for high-efficiency and high-power-density power supplies, USB-PD/QC AC/DC power adapters and battery charging applications, the SZ1200 integrated ACF controller combines the ease of design of a simple flyback controller with all the benefits of ACF. These include recycling of the leakage inductance energy of the flyback transformer and limiting primary FET drain voltage spikes during turn-off events. Delivering above 93% efficiency at low line, the SZ1200 offers consistent efficiency across the universal input voltage range (90 - 265 Vac) and various loading conditions of up to 150W single-port and multi-port USB-PD applications. Silanna’s OptiMode&trade; digital control architecture adjusts operation mode on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation and other key power supply parameters as line voltage and load vary. Very low no-load power consumption for the most stringent USB-PD applications further minimizes energy use during system stand-by. 22.02.2024 13:30:00Febnews_2024-03-15_16.jpg\images\news_2024-03-15_16.jpghttps://powerdensity.com/2024/02/22/silanna-semiconductor-takes-acf-integration-to-the-next-level-with-their-new-sz1200/powerdensity.com
Start-Ups present Energy and Mobility SolutionsIn order to demonstrate the impact of start-ups, T...11805Event NewsStart-Ups present Energy and Mobility SolutionsIn order to demonstrate the impact of start-ups, The smarter E Europe, Europe’s largest alliance of exhibitions for the energy industry, provides them a platform of their own: the start-up area. In hall C5, across 2,500 square meters, around 150 start-ups will have the opportunity to present their pioneering energy and mobility solutions to a wide expert audience, and to connect with established companies. The smarter E Europe and its four exhibitions (Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe) will take place from June 19–21, 2024, at the Messe München fairgrounds. More than 2,800 exhibitors and over 115,000 visitors from all around the world are expected to attend. The event will take place across 19 exhibition halls and an outdoor exhibition area.22.02.2024 10:00:00Febnews_2024-03-15_5.jpg\images\news_2024-03-15_5.jpghttps://www.thesmartere.de/press-release/start-ups-at-tse-2024?lang=enthesmartere.de
Two Backend Fabs sold – one in the Philippines, one in KoreaInfineon Technologies will sell two backend manufa...11785Industry NewsTwo Backend Fabs sold – one in the Philippines, one in KoreaInfineon Technologies will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE Technology, a provider of independent semiconductor manufacturing services in assembly and test. The plants currently run under the entity names Infineon Technologies Manufacturing Ltd. – Philippine Branch (Cavite) and Infineon Technologies Power Semitech Co., Ltd. (Cheonan) and will be acquired by ASE Inc. and ASE Korea Inc. respectively. Post the transaction, ASE will assume operations with current employees, and further develop both sites to support multiple customers. As such, ASE and Infineon have also concluded long-term supply agreements under which Infineon will continue to receive previously established services as well as services for new products to support its customers and fulfill existing commitments. Infineon Technologies Power Semitech is a backend manufacturing site with around 300 employees. The fab is located in Cheonan, South Korea, about 60 miles south of Seoul. Infineon Technologies Cavite, is a backend manufacturing site with more than 900 employees. It is located in one of the fastest growing and most industrialized provinces in the Philippines. The transaction is expected to close towards the end of the second calendar quarter of 2024, when all pending closing conditions will have been fulfilled.22.02.2024 08:00:00Febnews_2024-03-01_3.jpg\images\news_2024-03-01_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202402-061.htmlinfineon.com
Magnetically Shielded Flat Wire Power Inductors Sumida introduced two series of AEC-Q200 qualified...11817Product ReleaseMagnetically Shielded Flat Wire Power Inductors Sumida introduced two series of AEC-Q200 qualified power inductors, the DPQ3535/T150 and DPQ5050/T150. These inductors are magnetically shielded and have a pin-type base for surface mounting on printed circuit boards. High surface area flat-wire windings minimize internal resistance at high frequencies and allow space savings and higher current ratings. The DPQ3535/T150 series offers a range of inductance values from 3.3 µH to 22 µH. Maximum saturation current ranges from 28 to 152 amps at 150°C. The larger DPQ5050/T150 is of similar design, with an inductance value of 10 µH and a saturation current of 112 amps at 20 °C. The absolute maximum voltage across the inductor is 500Vdc for each. Operating temperature is -40 °C to +150 °C (including the device’s self-temperature rise). The flat-wire inductor is encased in ferrite and mounted on an insulating base. Circuit connectivity is by two robust flat, tinned copper pins. Two additional pins provide additional mounting stability. Size for the DPQ3535/T150 is (HWD) 33x38.7x38.2 mm. The DPQ5050/T150 measures 44x53.5x53.3 mm. Applications include use as a buck/boost inductor for Onboard Chargers (OBC) in electric vehicles (xEV), DC-DC converters, point-of-load converters, LED drivers, class D audio amplifiers, and other general high-performance power applications.21.02.2024 14:30:00Febnews_2024-03-15_17.jpg\images\news_2024-03-15_17.jpghttps://products.sumida.com/ProductsInfo/ProductGuide/PowerInductors/sumida.com
The Battery Show EuropeThe Battery Show Europe and Electric & Hybrid Vehi...11783Event NewsThe Battery Show EuropeThe Battery Show Europe and Electric & Hybrid Vehicle Technology Expo return to the Messe Stuttgart, Germany on 18-20 June, 2024. Bringing together 19,000 + engineers, executives, managers, R&D experts, manufacturing professionals, quality control experts, buyers, thought leaders and professionals from across the advanced battery and H/EV supply chain, this is an event that you can't miss! Explore 800+ advanced battery and EV manufacturing suppliers representing the entire supply chain from raw materials through end of life, featuring some stellar industry names such as Donaldson Filtration Solutions, Keyence, Siemens and Lyric Germany. Expand new ideas on increasing efficiencies and lowering costs at The Battery Show Europe Conference and Open Tech Forum. With 37+ hours of educational content, exploring the latest hot topics such as next-gen materials, advances in battery tech and sustainability, recycling and end of life options, this is the place to place to broaden your understanding of the advanced battery and H/EV industry. That's not all, we're also giving you the opportunity to learn about the latest market innovations and cutting-edge solutions during live product showcases from top-industry suppliers on the expo floor, as well as the chance to network with thousands of industry peers and form new relationships over drinks and light bites at our free-to-attend hosted networking receptions. Register today to attend the leading advanced battery and H/EV technology tradeshow and conference in Europe!21.02.2024 06:00:00Febnews_2024-03-01_1.png\images\news_2024-03-01_1.pnghttps://register.thebatteryshow.eu/10igTWthebatteryshow.eu
Higher Power Density with 100 V GaN Power StagesTexas Instruments introduced two power conversion ...11799Product ReleaseHigher Power Density with 100 V GaN Power StagesTexas Instruments introduced two power conversion device portfolios to help engineers achieve more power in smaller spaces. According to TI these devices are "providing the highest power density at a lower cost". TI's 100 V integrated GaN power stages, LMG2100R044 and LMG3100R017, feature thermally enhanced dual-side cooled package technology to simplify thermal designs and "achieve the highest power density in mid-voltage applications at more than 1.5 kW/in<sup>3</sup>", which equals about 91,5 W/cm<sup>3</sup>. TI claims that its 1.5 W isolated DC/DC modules with integrated transformers are "the industry's smallest and most power-dense, helping engineers shrink the isolated bias power-supply size in automotive and industrial systems by over 89 %". The devices allow designers to accomplish a system efficiency of 98% or higher given the lower output capacitance and lower gate-drive losses. A key enabler of the thermal performance in the 100 V GaN portfolio is the thermally enhanced dual-side cooled package. There is also an automotive-qualified solution available in this small package.20.02.2024 13:30:00Febnews_2024-03-01_18.jpg\images\news_2024-03-01_18.jpghttps://news.ti.com/2024-02-20-New-portfolios-from-TI-push-the-limits-of-power-design-further,-help-engineers-achieve-industry-leading-power-densityti.com
Seminars about Sensor and Measurement TopicsThe AMA Association for Sensors and Measurement (A...11790Event NewsSeminars about Sensor and Measurement TopicsThe AMA Association for Sensors and Measurement (AMA) has published its seminar program for 2024, which includes a variety of seminars in German language on various topics, including ultrasonic measurement technology, optical spectroscopy, displacement measurement, industrial image processing and the discussion on "Chat-GPT - hype or hysteria". The seminars are offered online or as face-to-face events and are under scientific direction. They offer in-depth knowledge about sensors, sensor systems, their functions and possible applications. Participants are given the opportunity to choose the right sensors for their application and evaluate their advantages and disadvantages. The seminars are said to offer deep insights into specialist topics in sensor and measurement technology. The AMA seminars aim to provide participants with manufacturer-independent knowledge and to inform them about the current state of sensor and measurement technology. They are aimed at experts from the fields of design/development, research, production and sales.20.02.2024 13:00:00Febnews_2024-03-01_8.jpg\images\news_2024-03-01_8.jpghttps://www.ama-sensorik.de/presse/ama-pressemitteilungen-2024/ama-sensorik.de
Battery Exhibition and ConferenceThe cooperation between ees Europe, an exhibition ...11787Event NewsBattery Exhibition and ConferenceThe cooperation between ees Europe, an exhibition for batteries and energy storage systems and InterBattery, a battery exhibition in South Korea, enters its second round this year. The InterBattery Europe Showcase will once again provide visitors of ees Europe with an additional exhibition area where they can network with companies from South Korea. The Battery Day Europe conference complements the presentations in the exhibition area. This year, the conference will provide comprehensive insights into the world of EV batteries, covering everything from the latest legislation, how to secure battery materials as well as groundbreaking technologies and business trends. Special attention will be given to the German-Korean cooperation in the ReLioS network for innovative approaches to battery recycling. The conference will also shine a light on EV battery production technologies. ees Europe takes place from June 19–21, 2024 as part of The smarter E Europe, Europe's largest alliance of exhibitions for the energy industry, at Messe München in Munich. More than 115,000 visitors from all over the world and over 2,800 exhibitors – more than 1,000 of whom are battery and energy storage system suppliers – are expected to attend. The InterBattery Europe Showcase exhibition area is expected to host around 200 companies – including companies such as Samsung SDI, LG Energy Solution and SK On. Last year, this additional exhibition space presented 72 companies, 62 of which were South Korean.20.02.2024 10:00:00Febnews_2024-03-01_5.jpg\images\news_2024-03-01_5.jpghttps://www.ees-europe.com/press-release/interbattery-showcase-2024?ref=m646dffd6bfeb497a66427d25-t1709163862-cee539beaees-europe.com
Power Converters run on Vibrational EnergyUniversity of California San Diego and CEA-Leti (l...11786Industry NewsPower Converters run on Vibrational EnergyUniversity of California San Diego and CEA-Leti (located in Grenoble/France) scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density. This power topology, which extends beyond existing topologies, blends the advantages of piezoelectric converters with capacitive-based DC/DC converters. The power converters developed by the team are much smaller than the huge, bulky inductors currently used for this role. The devices could eventually be used for any type of DC/DC conversation, in everything from smart phones, to computers, to server farms and AR/VR headsets. The results were presented in the paper, "An Integrated Dual-side Series/Parallel Piezoelectric Resonator-based 20-to-2.2V DC/DC Converter Achieving a 310% Loss Reduction", at ISSCC 2024. The paper explains that a hybrid DSPPR converter exploits integrated circuits' ability to offer sophisticated power stages in a small area compared to discrete designs, and enables efficient device operation at voltage conversion ratios (VCR) of less than 0.1.20.02.2024 09:00:00Febnews_2024-03-01_4.jpg\images\news_2024-03-01_4.jpghttps://www.leti-cea.com/cea-tech/leti/english/Pages/What's-On/Press%20release/ISSCC-2024-papers.aspxleti-cea.com
Plug-and-Play Gate Driver for High-Voltage SiC Power ModulesTo help developers implement SiC solutions and fas...11793Product ReleasePlug-and-Play Gate Driver for High-Voltage SiC Power ModulesTo help developers implement SiC solutions and fast-track the development process, Microchip Technology has developed the 3.3 kV XIFM plug-and-play mSiC gate driver with patented Augmented Switching technology, which is designed to work out-of-the-box with preconfigured module settings. To speed time to market, the complex development work of designing, testing and qualifying a gate driver circuit design is already completed with this plug-and-play solution. The XIFM digital gate driver is a compact solution that features digital control, an integrated power supply and a robust fiber-optic interface that improves noise immunity. This gate driver has preconfigured "turn-on/off" gate drive profiles that are tailored to optimize module performance. It incorporates 10.2 kV primary-to-secondary reinforced isolation with built-in monitoring and protection functions including temperature and DC link monitoring, Undervoltage Lockout (UVLO), Overvoltage Lockout (OVLO), short-circuit/overcurrent protection (DESAT) and Negative Temperature Coefficient (NTC). This gate driver also complies with EN 50155, a key specification for railway applications.20.02.2024 07:30:00Febnews_2024-03-01_12.jpg\images\news_2024-03-01_12.jpghttps://www.microchip.com/en-us/about/news-releases/products/microchip-expands-msic-solutions-with-3-3-kv-xifm-gate-drivermicrochip.com
New EMEA Headquarters for DistributorMouser Electronics has opened its new EMEA headqua...11784Industry NewsNew EMEA Headquarters for DistributorMouser Electronics has opened its new EMEA headquarters in Munich. The opening took place in the presence of distinguished guests from customers, manufacturers, members of the media, TTI and local support companies. The new office, which is located relatively close to the Olympic stadium and directly above a subway station, is already in operation: People from 23 nations work there. Mark Burr-Lonnon, Senior Vice President Global Service provided a look at the company history from $ 21 million of sales in 2008 to far more than $ 1 billion in 2023 – and all of this just in Europe. While Europe participated less than 10 % to Mouser's worldwide sales in 2008 it contributed almost exactly one third to Mouser's worldwide turnover in 2023. And this is why Mark Burr-Lonnon invited all guests to participate in an office tour after enjoying a piece of a Mouser celebration cake, that he cut in person.20.02.2024 07:00:00Febnews_2024-03-01_2.jpg\images\news_2024-03-01_2.jpghttps://eu.mouser.com/eu.mouser.com
Compact MOSFET Modules for Efficiencies of up to 98%SemiQ added a product to its QSiC family. The QSiC...11796Product ReleaseCompact MOSFET Modules for Efficiencies of up to 98%SemiQ added a product to its QSiC family. The QSiC 1200 V SiC MOSFET modules in full-bridge configurations deliver near zero switching loss, significantly improving efficiency, reducing heat dissipation, and allowing the use of smaller heatsinks. With a high breakdown voltage exceeding 1400 V, the QSiC modules in full-bridge configurations withstand high-temperature operation at T<sub>j</sub> = 175 °C with minimal R<sub>DS(on)</sub> shift across the entire temperature spectrum. Using high-performance ceramics, SemiQ's modules are well-suited for demanding applications that require bidirectional power flow or a broader range of control, such as solar inverters, drives and chargers for Electric Vehicles DC/DC converters and power supplies. In solar inverter applications, SemiQ's technology allows reaching an efficiency of up to 98 % - as well as more compact designs. It helps reduce heat loss, improve thermal stability, and enhance reliability, backed by over 54 million hours of HTRB/H3TRB testing. The 1200 V MOSFETs also maximize efficiency gains in DC/DC converters while enhancing reliability and minimizing power dissipation. To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level, and all parts have undergone testing surpassing 1400V.19.02.2024 10:30:00Febnews_2024-03-01_15.jpg\images\news_2024-03-01_15.jpghttps://semiq.com/highly-efficient-compact-mosfet-modules-in-full-bridge-configurations-for-solar-inverter-and-ev-charging/semiq.com
Distribution Agreement expanded to USA, Australia & New ZealandPulsiv of Cambridge (UK) and Astute Electronics of...11789Industry NewsDistribution Agreement expanded to USA, Australia & New ZealandPulsiv of Cambridge (UK) and Astute Electronics of Stevenage (UK) have expanded their distribution agreement to include USA, Australia and New Zealand. Astute Electronics was founded 35 years ago "to bridge the gap between broadline and independent distribution in the European supply chain". Still privately owned, the business now operates across five continents. Using a patented switching technique, Pulsiv has developed an special method for converting AC to DC that delivers a combination of benefits in power electronics designs. This technology has extended the range of conventional flyback topologies to replace expensive LLC solutions, while achieving "an unrivalled efficiency profile". Pulsiv offers Osmium microcontrollers which implement these switching techniques, AC/DC front-end circuit configurations that include a Pulsiv OSMIUM microcontroller and supporting components for a complete AC/DC front-end design as well as evaluation boards and reference designs.16.02.2024 12:00:00Febnews_2024-03-01_7.jpg\images\news_2024-03-01_7.jpghttps://pulsiv.co.uk/news/pulsiv-and-astute-electronics-expand-distribution-agreement/pulsiv.co.uk
Automotive-Grade 3-Phase SiC MOSFET Power ModulesInventchip announced the release of an automotive-...11815Product ReleaseAutomotive-Grade 3-Phase SiC MOSFET Power ModulesInventchip announced the release of an automotive-grade 3-phase SiC MOSFET transfer-molded power module IVTM12080TA2Z. The module is 1200V 80m&ohm; in a compact, topside-cooling through-hole package with a plastic surface size of 23mm x 42mm. Compared with a discrete TO-247 solution, the module saves about 30% PCB space, and the more important thing is that the SiC MOSFET dies are arranged in a much more compact way, which reduces over all stray-inductance of power loops. The reduction of the stray inductance reduces MOSFET Vds overshoot, Vgs ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with the TO-247 solution with external electrical isolation assembly, the module with high performance ceramic lowers junction-to-heatsink thermal resistance by over 50% for the same 80m 1200V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The package has a minimum 5mm creepage from terminals to the package’s heatsink mounting surface, which can safely work for both 400V and 800V systems without isolation reinforce. For production, with isolated top-side cooling, the module solution eliminates any external isolation process and reduces system assembly time and cost. It also minimizes human assembly errors and improves product reliability. 15.02.2024 12:30:00Febnews_2024-03-15_15.jpg\images\news_2024-03-15_15.jpghttps://www.inventchip.com.cn/en/inventchip.com
Distributor stocks MOSFET Family with now higher Power EfficiencyRutronik integrates the StrongIRFET&trade; 2 MOSFE...11797Product ReleaseDistributor stocks MOSFET Family with now higher Power EfficiencyRutronik integrates the StrongIRFET&trade; 2 MOSFETs from Infineon into its product portfolio. This generation provides a higher power efficiency, which leads to improved overall system performance. Due to a higher current load tolerance, several parallel connected components are no longer necessary. That saves space on the PCB and reduces costs. The transistors are in stock and available in different housing variants such as TO-220; TO-220 FullPAK, D2PAK, D2PAK 7-pin, DPAK, and TOLL. Compared to the previous StrongIRFET components in the 40 V to 100 V range, the technology offers up to 40 percent better on-resistance and up to 60 percent lower nominal gate charge. In addition, higher rated currents enable improved current carrying capacity and the new generation is suitable for both high and low switching frequencies. Standard pinouts enable simple drop-in replacement. The MOSFETs are 100 percent safety-tested, RoHS-compliant, halogen-free following IEC61249-2-21 product validation, and meet the JEDEC standard. They can be used in a wide range of applications, e.g. for UPS, battery management, or motor drives.15.02.2024 11:30:00Febnews_2024-03-01_16.jpg\images\news_2024-03-01_16.jpghttps://www.rutronik24.com/rutronik24.com
Semiconductor Company to buy PCB Design CompanyRenesas intends to acquire Altium by way of a Sche...11788Industry NewsSemiconductor Company to buy PCB Design CompanyRenesas intends to acquire Altium by way of a Scheme of Arrangement. The acquisition is said to enable "two industry leaders to join forces and establish an integrated and open electronics system design and lifecycle management platform that allows for collaboration across component, subsystem, and system-level design".  Together, Renesas and Altium, aim to build an integrated and open electronics system design and lifecycle management platform that unifies the steps from component selection and evaluation to simulation and PCB physical design at a system level. The acquisition brings together Altium's cloud platform capabilities with Renesas' semiconductor portfolio. The combination will also enable integration with third-party vendors across the ecosystem to execute all electronic design steps seamlessly on the cloud. The electronics system design and lifecycle management platform will deliver integration and standardization of various electronic design data and functions and enhanced component lifecycle management, while enabling seamless digital iteration of design processes to increase overall productivity. This is said to bring "significantly faster innovation" and to "lower barriers to entry for system designers by reducing development resources and inefficiencies". Altium's history began in 1985 from Australia as one of the world's first printed-circuit board (PCB) design tool providers. The transaction has been unanimously approved by the boards of directors of both companies and is expected to close in the second half of 2024. Altium will continue to be led by CEO Aram Mirkazemi as a wholly-owned subsidiary of Renesas.15.02.2024 11:00:00Febnews_2024-03-01_6.jpg\images\news_2024-03-01_6.jpghttps://www.renesas.com/us/en/about/press-room/renesas-acquire-pcb-design-software-leader-altium-make-electronics-design-accessible-broader-marketrenesas.com
Schottky Barrier Diodes with short Reverse Recovery TimeROHM has developed 100 V breakdown Schottky barrie...11794Product ReleaseSchottky Barrier Diodes with short Reverse Recovery TimeROHM has developed 100 V breakdown Schottky barrier diodes (SBDs) that deliver a short reverse recovery time (t<sub>rr</sub>) of 15ns for power supply and protection circuits in automotive, industrial, and consumer applications. Although numerous types of diodes exist, highly efficient SBDs are increasingly being used inside a variety of applications. Particularly SBDs with a trench MOS structure that provide lower V<sub>F</sub> than planar types enable higher efficiency in rectification applications. One drawback of trench MOS structures, however, is that they typically feature worse trr than planar topologies – resulting in higher power loss when used for switching. In response, ROHM developed a series utilizing a proprietary trench MOS structure that simultaneously reduces both V<sub>F</sub> and I<sub>R</sub> (which are in a trade-off relationship) while also achieving a short t<sub>rr</sub>. Expanding on the four existing conventional SBD lineups optimized for a variety of requirements, the YQ series is ROHM's first to adopt a trench MOS structure. The design reduces t<sub>rr</sub> losses by approximately 37 % and overall switching losses by around 26 % over general trench-type MOS products. As such, the devices are are well-suited for sets requiring high-speed switching, such as drive circuits for automotive LED headlamps and DC-DC converters in xEVs that are prone to generate heat.15.02.2024 08:30:00Febnews_2024-03-01_13.jpg\images\news_2024-03-01_13.jpghttps://www.rohm.com/news-detail?news-title=2024-02-15_news_sbd&defaultGroupId=falserohm.com
Power Supplies for Industrial ApplicationsCOSEL has announced the launch of the PDA series o...11811Product ReleasePower Supplies for Industrial ApplicationsCOSEL has announced the launch of the PDA series of AC/DC power supplies with further enhanced reliability for industrial applications. The PDA series uses a quasi-resonant topology with a limited number of components, resulting in higher reliability. It is 100% form, fit and function backwards compatible with the PBA series, which is retiring after 20 years of powering high volume applications worldwide. The first models introduced are the 15W PDA15F, the 30W PDA30F and the 50W PDA50F, with other versions to follow. The PDA series is designed for use in a wide range of applications and can operate over a wide temperature range from -20 to +70 degrees C. The power supplies are UL/EN62368-1 certified. Designed for worldwide applications, the PDA series has an input voltage range of 85VAC to 264VAC single phase and meets safety standards with an input voltage range of 100-240VAC (50/60Hz). The 15W PDA15F, the 30W PDA30F and the 50W PDA50F are available in three output voltages, 5V, 12V and 24V with corresponding output currents. The output voltage can be adjusted by a built-in potentiometer.15.02.2024 08:30:00Febnews_2024-03-15_11.jpg\images\news_2024-03-15_11.jpghttps://www.coseleurope.eu/news-item-1588-enhanced-reliability-power-supplies-for-industrialcoseleurope.eu
DC-DC Converter Designed for the ‘NewSpace’ MarketVPT announces the addition of the VSC100-2800S to ...11818Product ReleaseDC-DC Converter Designed for the ‘NewSpace’ MarketVPT announces the addition of the VSC100-2800S to the VSC Series of space COTS DC-DC converters. Designed for the “NewSpace” market, the VSC Series complements VPT’s hermetic hybrid SV / SVL Series of rad hard products available on DLA SMDs. The VSC Series is intended for use in commercial rad tolerant satellite applications and NASA Class D missions where the balance of cost and guaranteed performance is critical. The VSC100-2800S features output voltages of +3.3 V / 66W, +5 V / 100W, +12 V / 100W, and +15 V / 100W, as well as a wide input voltage range. Sensitive semiconductors are RLAT to 40 krad (Si) per MIL-STD-883 Method 1019 and guaranteed to 30 krad (Si) TID. Converters are characterized to LET > 42 MeV/mg/cm<sup>2</sup> for catastrophic events and LET > to 30 MeV/mg/cmysup>2</sup> for SET and SEFI. Our proprietary packaging creates a dual-side heatsinking option with very low outgassing. VPT’s Vice President of Engineering, Leonard Leslie, stated, “We are pleased to introduce the VSC100-2800S as the newest addition to our VSC Series. Drawing on VPT’s extensive expertise in the development of radiation-hardened DC-DC converters, the VSC Series ensures the optimal level of radiation performance for low Earth orbit (LEO) applications, all while maintaining an exceptionally competitive cost.” 14.02.2024 15:30:00Febnews_2024-03-15_18.jpg\images\news_2024-03-15_18.jpghttps://www.vptpower.com/press-releases/vpt-introduces-vsc100-2800s-space-cots-dc-dc-converters/vptpower.com
Electrolytic Polymer Hybrid PerformancePanasonic introduces the ZV Series Electrolytic Po...11812Product ReleaseElectrolytic Polymer Hybrid PerformancePanasonic introduces the ZV Series Electrolytic Polymer Hybrid capacitor. Achieving a maximum Ripple Current (3.3~4.6 Arms) approximately 50% higher than comparable case-sizes from competitors, the ZV Series ensures performance in demanding applications. While comparable capacitors usually come up with a ESR of around 16 m&ohm, at 35V, the ZV series has a significantly lower ESR of 12 m&ohm; at this voltage – and thus enhances efficiency and reliability in electronic systems. This capacitor is AEC-Q200 compliant, enforcing stringent quality control standards, particularly crucial for the automotive industry. It boasts high-temperature endurance, one of the industry's highest ratings at 4000 hours at 135°C and 125°C. With a focus on durability, the ZV Series offers vibration-proof variants capable of withstanding shocks up to 30G, making it a reliable choice. The ZV Series finds its applications in various "under the hood" scenarios, including water pumps, oil pumps, cooling fans, high-current DC to DC converters, and ADAS applications. It is also suitable for use in inverter power supplies for robotics, cooling fans, solar power systems, and more, covering the DC side of both inverter and rectifier circuits.14.02.2024 09:30:00Febnews_2024-03-15_12.jpg\images\news_2024-03-15_12.jpghttps://industry.panasonic.eu/company/newsroom/enhanced-electrolytic-polymer-hybrid-performance-panasonic-industry-unveils-zv-seriesindustry.panasonic.eu
How to Design the Compensation Circuit for a Flyback ConverterWürth Elektronik has published its Application Not...11798Product ReleaseHow to Design the Compensation Circuit for a Flyback ConverterWürth Elektronik has published its Application Note "Compensating the feedback loop of a current-controlled flyback converter with optocoupler". The guide is aimed at developers looking to use a DC/DC flyback converter to achieve greater stability and reliability in power supply design. It might also be useful for those who use optocouplers for galvanic isolation of the feedback path. Applications include primary and auxiliary power supplies for home appliances, battery chargers for smartphones and tablets, as well as LED lighting. This Application Note also provides assistance with power supplies for desktop and laptop computers, industrial power supplies and auxiliary supplies in motor drives, or for Power-over-Ethernet (PoE). AppNote ANP113 explains in detail how the feedback loop can be compensated using a current-controlled flyback converter with optocoupler, and which aspects require special attention. The CTR (current transfer ratio) influences the control loop of the compensation circuit and therefore must be carefully considered in the design stage. ANP113 places particular emphasis on design constraints imposed by the optocoupler parameters and on the related solutions. The validation results of a 30 W flyback converter prototype are also included in the AppNote.13.02.2024 12:30:00Febnews_2024-03-01_17.jpg\images\news_2024-03-01_17.jpghttps://www.we-online.com/en/news-center/press?d=anp113we-online.com
Automotive-Grade SiC MOSFET Half Bridge SMPD ModulesInventchip Technology has added two automotive-gra...11792Product ReleaseAutomotive-Grade SiC MOSFET Half Bridge SMPD ModulesInventchip Technology has added two automotive-grade SiC MOSFET half bridge SMPD modules named IVSM12080HA2Z and IVSM06025HA2Z. The modules are specified 1200 V/80 m&#8486; and 650 V/25 m&#8486;. SMPD is a compact, topside-cooling surface-mounted package with a plastic surface size of 25 mm x 23 mm. Compared with TO-247, the SMPD saves over 25 % PCB space, and the more important thing is that the SMPD reduces the half-bridge stray-inductance of power loop by around 40 %. The reduction of the stray inductance reduces MOSFET V<sub>DS</sub> overshoot, V<sub>GS</sub> ringing, switching loss and EMI noise. It helps engineers to solve the critical design issues and achieve a high density and reliable power conversion design. Compared with TO-247 with external electrical isolation assembly, SMPD with traditional AL<sub>2</sub>O<sub>3</sub> and SiN lowers junction-to-heatsink thermal resistance by over 20 % and 50 % respectively for the same 25 m&#8486;/1200 V SiC MOSFET die. It eases the thermal design and increases the power handling potential. A NTC is also integrated in the SMPD package. It senses the DBC temperature directly and offers more accurate module temperature sensing for reliable thermal protection. The SMPD package has a minimum 4 mm creepage from terminals to the package's heatsink mounting surface, which can safely work for both 400 V and 800 V systems without isolation reinforce. Both modules are AEC Q101 and AQG 324 certified.13.02.2024 07:30:00Febnews_2024-03-01_11.jpg\images\news_2024-03-01_11.jpghttps://www.inventchip.com.cn/en/inventchip.com
Joint Efforts for Magnetic Component SolutionsITG Electronics has collaborated with STMicroelect...11800Product ReleaseJoint Efforts for Magnetic Component SolutionsITG Electronics has collaborated with STMicroelectronics (ST) in developing magnetic component solutions for 54 V/48 V to 12 V converter applications. ST's patented 54 V/48 V to 12 V stacked buck converter features an on-board solution with a quarter brick space using the PM6780 dual digital multiphase controller, the STPRDC02A high-voltage full-bridge driver, and ITG's L101353A-3R6MHF non-coupling dual inductors. This magnetics design collaboration is named Stacked buck converter with unified coupled inductor. Combined with ST's PM6780 and STPRDC02A, ITG's L101456A-1R4MHF can elevate the overall power rating of ST's 48 V solution to 1500 W. This product combination is claimed to "provide the industry's highest power density rating for 48 V solutions". The on-board stacked buck converter 48 V conversion system offers cost savings, form factor flexibility, and a customizable design compared to power-module designs.12.02.2024 14:30:00Febnews_2024-03-01_19.jpg\images\news_2024-03-01_19.jpghttps://itg-electronics.com/en/series/908itg-electronics.com
100 V bi-directional GaN IC for 48 V/60 V BMS ApplicationsInnoscience Technology has launched another 100 V ...11795Product Release100 V bi-directional GaN IC for 48 V/60 V BMS ApplicationsInnoscience Technology has launched another 100 V bi-directional member of the company's VGaN IC family. The first family of VGaN devices rated 40 V with an on-resistance range between 1.2 mOhm and 12 mOhm have been successfully deployed in the USB OVP of several mobile phones. The 100 V VGaN (INV100FQ030A) can be employed to achieve high efficiency in 48 V or 60 V battery management systems (BMS), as well as for high-side load switch applications in bidirectional converters, switching circuits in power systems, and other fields. Such device it is usable in applications such as home batteries, portable charging stations, e-scooters, e-bikes etc. One VGaN replaces two back-to-back Si MOSFETs; they are connected with a common drain to achieve bidirectional switching of battery charging and discharging, further reducing on-resistance and loss significantly with respect to traditional Silicon solution. BOM count, PCB space and costs are also reduced accordingly. The INV100FQ030A 100V VGaN IC supports two-way pass-through, two-way cut-off and no-reverse-recovery modes of operation. Devices feature a low gate charge of 90 nC, a dynamic on-resistance of 3.2 mOhm and a package size of 4 mm x 6 mm. These 100 V GaN series products are in mass production in En-FCQFN (exposed top side cooling) and FCQFN packaging.12.02.2024 09:30:00Febnews_2024-03-01_14.jpg\images\news_2024-03-01_14.jpghttps://www.innoscience.com/site/details/711?el=mdnavinnoscience.com
Miniature Inductor in C0402 Package for all Market ApplicationsDelevan's C0402 miniature RF inductor is integrate...11775Product ReleaseMiniature Inductor in C0402 Package for all Market ApplicationsDelevan's C0402 miniature RF inductor is integrated in a package which is claimed to be "ultra-small". A high reliability 0402 version of the C0402, for use in critical applications, is also available. The C0402 is manufactured and tested in the USA by an AS9100D certified company. It's offered in inductance ranges of 1.0nH to 120nH and features Self Resonant Frequencies, which provide stable inductor performance into the multi GHz range. Designed with a high-temperature ceramic core and magnet wire the C0402 inductor is rated for an operating temperature range of - 40°C to +125°C and is AEC-Q200 Grade 1 compliant. The C0402 is available with Gold terminations for use with epoxy bonded or solderable applications.09.02.2024 08:30:00Febnews_2024-02-15_9.jpg\images\news_2024-02-15_9.jpghttps://www.delevan.com/en/products/power-inductorsdelevan.com
Energy Balance Calculator for enhanced battery life optimizationNexperia announced the release of the Energy Balan...11779Product ReleaseEnergy Balance Calculator for enhanced battery life optimizationNexperia announced the release of the Energy Balance Calculator, which is a web-based tool designed to assist battery management engineers in maximizing the battery life of their applications. The calculator facilitates the integration of Nexperia's Energy Harvesting PMICs into their systems by providing engineers with precise data for informed decision-making. At the core of Nexperia's Energy Harvesting PMICs is the Maximum Power Point Tracking (MPPT) algorithm, enabling efficient energy harvest from the environment for various consumer electronics and IoT devices. To utilize these PMICs at their full potential, the calculator works with real-world technical parameters. It calculates the energy delivered to the load and the energy compensation. Thus, offering insights into potential battery life extension or achieving energy autonomy. Engineers can furthermore visualize system efficiency and precision through an efficiency curve provided by the tool.08.02.2024 12:30:00Febnews_2024-02-15_13.jpg\images\news_2024-02-15_13.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-introduces-Energy-Balance-Calculator-for-enhanced-battery-life-optimization-nexperia.com
Isolated Power Module with 84 % Efficiency and ProtectionThe MagI<sup>3</sup>C-FISM power modules from Würt...11774Product ReleaseIsolated Power Module with 84 % Efficiency and ProtectionThe MagI<sup>3</sup>C-FISM power modules from Würth Elektronik are now complemented by the WPME-FISM 'Fixed Isolated SIP/SMT Module' SMT-8 with 3.3V to 5V, rated for 1W POUT. The DC/DC voltage converter with fixed output voltage and integrated switching power stage, transformer, as well as input and output capacitance, is 100% pin-to-pin compatible with the previous MagI<sup>3</sup>C-FISM, however, it offers improved properties – the efficiency goes up to 84 percent, the ambient temperature range is now specified with 105°C and the isolation voltage is 3kV (for 60 seconds). Like some of its predecessors, this power module has continuous short-circuit protection. The MagI<sup>3</sup>C FISM power modules do not require any external components for operation. Applications for the module include supplying voltages for interfaces and microcontrollers in test and measurement technology or industrial electronics. It serves as simple functional isolation for overvoltage protection. For example, it prevents ground loops and shifts as well as interference in the signal path or sensor systems. The entire product range is UL 62368-1 recognized. The low level of conducted and radiated electromagnetic interference complies with the EN55032 Class B / CISPR-32 standard.07.02.2024 07:30:00Febnews_2024-02-15_8.jpg\images\news_2024-02-15_8.jpghttps://www.we-online.com/en/news-center/press?d=fism-smtwe-online.com
Cooperation for sustainable SiC ProductionESK-SIC, a company which is active in silicon carb...11769Industry NewsCooperation for sustainable SiC ProductionESK-SIC, a company which is active in silicon carbide (SiC) materials, and Kyocera have started a strategic partnership with the goal to develop "innovative solutions for the sustainable production of silicon carbide and the associated end products". By-products and end-of-life ceramics will be recycled using RECOSiC technology in order to produce raw materials that are specifically tailored to various end applications. Compared to currently available SiC raw materials on the market in terms of material science aspects, while minimising the carbon footprint of the process, the RECOSiC recycling technology is said to bring a technological upgrade. The partnership between ESK-SIC and Kyocera aims to improve the efficiency and sustainability of the entire silicon carbide value chain. This will involve developing new manufacturing technologies, optimising production processes, researching innovative applications and establishing circular economy principles for the recycling of SiC materials.06.02.2024 08:00:00Febnews_2024-02-15_3.jpg\images\news_2024-02-15_3.jpghttps://www.kyocera-fineceramics.de/en/news/kyocera-fineceramics-europe-gmbh-and-esk-sic-gmbh-cooperatekyocera-fineceramics.de
Automotive qualified -60V P-channel MOSFETsToshiba Electronics announces the availability of ...11777Product ReleaseAutomotive qualified -60V P-channel MOSFETsToshiba Electronics announces the availability of XPH8R316MC and XPH13016MC, two more -60V P-channel MOSFETs based upon their U-MOS VI process. The devices are tailored for use in automotive applications such as load switches, semiconductor relays and motor drives. The AEC-Q101 qualified components are housed in an SOP Advance (WF) package - a surface mount style with a wettable flank terminal structure facilitating automated optical inspection (AOI) of the solder joints. The copper connectivity within the package reduces package resistance, improves efficiency and reduces heat build-up. The XPH8R316MC is rated for -90A continuous drain current (I<sub>D</sub>) and the XPH13016MC is rated for an I<sub>D</sub> of -60A. The pulsed drain current (I<sub>DP</sub>) is double these values, -180A and -120A, respectively. Both devices are rated for a drain-source voltage (V<sub>DSS</sub>) of -60V and are capable of operating at channel temperatures (T<sub>ch</sub>) up to 175ºC. The maximum drain-source on-resistance (R<sub>DS(ON)</sub>) of the XPH8R316MC is 8.3m&#8486;. For the XPH13016MC, the value is 12.9m&#8486;.05.02.2024 10:30:00Febnews_2024-02-15_11.jpg\images\news_2024-02-15_11.jpghttps://toshiba.semicon-storage.com/eu/company/news/2024/02/mosfet-20240205-1.htmltoshiba.semicon-storage.com
Call for PapersPCIM Asia is calling for papers. The event will ta...11768Event NewsCall for PapersPCIM Asia is calling for papers. The event will take place from 28–30.8.2024 in Shenzhen, China. As a platform connecting the academia and industry, the speakers can gain direct feedback from both sides. Within this framework the organizer encourage people to present their research. The organizer, Messe Frankfurt, expects "over 600 qualified audiences, mainly R&D engineers" for PCIM Asia. Three special awards (the Best Paper Award, the Young Engineer Award and the University Scientist Award) will be given out to some presenters. In parallel to the conference there will be an exhibition with more than 200 exhibitors. The official deadline for abstract submissions is the 4th of March, 2024.05.02.2024 07:00:00Febnews_2024-02-15_2.jpg\images\news_2024-02-15_2.jpghttps://pcimasia-expo.cn.messefrankfurt.com/shenzhen/en/programme-events/pcim-asia-conference/call-for-paper.htmlpcimasia-expo.cn
Acquisition: Electronic Inks added to Advanced Materials PortfolioHeraeus Electronics has acquired the PriElex elect...11767Industry NewsAcquisition: Electronic Inks added to Advanced Materials PortfolioHeraeus Electronics has acquired the PriElex electronics inks business line from Kayaku Advanced Materials. PriElex is known for its expertise in electronics inks. By joining forces with Heraeus Electronics the acquisition is expected to enhance Heraeus' position and provide customers with an even broader range of solutions for thick film applications. Partners and customers of both Heraeus Electronics and PriElex can expect a smooth transition and ongoing support throughout the integration process. Furthermore, customers can be assured of uninterrupted service and access to a broader portfolio of advanced solutions.01.02.2024 06:00:00Febnews_2024-02-15_1.jpg\images\news_2024-02-15_1.jpghttps://www.heraeus.com/en/het/products_and_solutions_het/thick_film_materials/prielex/prielex_1.htmlheraeus.com
Surface-Mount Resettable Fuse Rated to 240VACBel Fuse announced "the industry's only surface mo...11761Product ReleaseSurface-Mount Resettable Fuse Rated to 240VACBel Fuse announced "the industry's only surface mount, PPTC resettable fuse, line-volt-rated to 240VAC". Designed to protect against electrical overloads and short circuits, Bel 0ZAF resettable fuses provide circuit protection for a variety of applications in the IoT, industrial, and medical sectors. These fuses are crucial for use in safeguarding industrial controls, test and measurement equipment, robotics, and safety systems, and deliver the reliability and durability required by these advanced technologies. Their soldered surface mount design not only offers cost efficiency for PC mount assembly, but also accelerates design and production timelines by eliminating the need for through-hole mounting. Bel 0ZAF fuses are UL recognized components and IEC certified.31.01.2024 11:30:00Jannews_2024-02-01_16.jpg\images\news_2024-02-01_16.jpghttps://www.belfuse.com/circuit-protectionbelfuse.com
Low Power High Voltage DiodesDean Technology (DTI) has introduced a series of h...11791Product ReleaseLow Power High Voltage DiodesDean Technology (DTI) has introduced a series of high voltage diodes. This so-called VDRM Series is an axial-leaded, high voltage diode line that offers industry standard performance and high reliability. VDRM units range from 2.5 to 16 kV, 50 to 125 mA, and have a maximum reverse recovery time of 200 ns. These diodes are best suited for low to medium power, small form-factor applications. Further, VDRM diodes offer a miniature package size and are compliant to the RoHS directive. In addition to the new VDRM Series, DTI also offers a large catalog of diodes for many different high voltage needs.31.01.2024 06:30:00Jannews_2024-03-01_10.jpg\images\news_2024-03-01_10.jpghttps://www.deantechnology.com/new-low-power-high-voltage-diodes/deantechnology.com
Offline Flyback Switcher IC with Zero-Voltage Switching (ZVS) for 95 % EfficiencyPower Integrations has released the InnoSwitch5-Pr...11765Product ReleaseOffline Flyback Switcher IC with Zero-Voltage Switching (ZVS) for 95 % EfficiencyPower Integrations has released the InnoSwitch5-Pro family of high-efficiency, programmable flyback switcher ICs. The single-chip switcher achieves over 95 percent efficiency with a novel secondary-side control scheme which achieves zero-voltage switching (ZVS) without a dedicated and costly additional high-voltage switch. The IC, which features a 750V or a 900V PowiGaN primary switch, primary-side controller, FluxLink isolated feedback and secondary controller with an I<sup>2</sup>C interface, is intended for single- or multi-port USB PD adapters. Applications are notebooks, high-end cellphones and other portable consumer products, including designs that require the USB PD EPR (Extended Power Range) protocol. For example, the company has demonstrated 140W / 28V USB PD adapters in 68,8 cm<sup>3</sup> using 106 components. InnoSwitch5-Pro flyback switcher ICs feature lossless input line voltage sensing on the secondary side for adaptive DCM/CCM and ZVS control to maximize efficiency and simplify design across line and load. The ICs also feature a post-production tolerance offset to facilitate accurate output constant-current (CC) control of better than two percent to support the UFCS protocol. An efficiency of more than 95 percent allows designers to eliminate heat sinks, spreaders and potting materials for thermal management.30.01.2024 15:30:00Jannews_2024-02-01_20.jpg\images\news_2024-02-01_20.jpghttps://investors.power.com/news/news-details/2024/Power-Integrations-Introduces-InnoSwitch5-Offline-Flyback-Switcher-IC/default.aspxpower.com
Over-voltage protection: SMD Varistors with high Surge Current CapabilityTDK presents two varistor series in SMD design. Th...11782Product ReleaseOver-voltage protection: SMD Varistors with high Surge Current CapabilityTDK presents two varistor series in SMD design. The types of both series are available for a wide range of operating voltages from 175V<sub>RMS</sub> to 460V<sub>RMS</sub>, corresponding to 225V<sub>DC</sub> to 615V<sub>DC</sub>. While the B72210M series of surge devices, which are equivalent to S14 leaded disk varistors, offers a surge current capability of 6000A, the B72214M series types, which are equivalent to S20 leaded disk varistors, have a high surge current capability of 10,000A. All types are designed for a high operating temperature of a maximum of +125 °C and extremely damp heat environment (85% relative humidity at +85 °C). The SMD high surge series is qualified to AEC-Q200. In terms of designs, all types are available in a horizontal as well as vertical version. The horizontal version of the B72210M series has dimensions of 22 x 15 x 11 mm<sup>3</sup>, while the B72214M series has dimensions of 27 x 18 x 11 mm<sup>3</sup>, (L x W x H). The vertical types have dimensions of 15 x 10 x 20 mm<sup>3</sup> and 18 x 10 x 25.5 mm<sup>3</sup>, respectively. Typical applications of SMD surge protection components are on-board chargers, power supplies, frequency converters, photovoltaic systems and household appliances.30.01.2024 15:30:00Jannews_2024-02-15_16.jpg\images\news_2024-02-15_16.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/tdk-offers-varistors-in-smd-design-with-high-surge-current-capability/3219634tdk-electronics.tdk.com
Dual-Channel High-Side Switches with Protection for Automotive ApplicationsDiodes has introduced its first automotive-complia...11780Product ReleaseDual-Channel High-Side Switches with Protection for Automotive ApplicationsDiodes has introduced its first automotive-compliant (according to AEC-Q100), dual-channel, high-side power switches - the ZXMS82090S14PQ, ZXMS82120S14PQ, and ZXMS82180S14PQ - as an expansion of its IntelliFET self-protected MOSFET portfolio. These intelligent switches are said to "deliver high power within a compact footprint while also providing robust protection and diagnostic capabilities". The series is designed for driving 12V automotive loads, such as LEDs, bulbs, actuators, and motors in automotive body control and lighting systems. The trio all feature a dual 41V-rated n-channel MOSFET array with onboard circuitry that protects against short circuits, manages inrush currents, and safeguards against overvoltage conditions including load dumps. In addition, the switches provide overtemperature protection with auto-restart, plus protection against electrostatic discharge damage. Loss of ground and reverse polarity protection can also be implemented with the aid of a few external components. A dedicated current sense pin provides analog current monitoring of the outputs and fault indication for short-to-battery, short-to-ground, and open-load detection. These devices provide smaller footprint alternatives to relays, fuses, and discrete circuits. Supplied in a SO-14EP package they are also form, fit, and functional equivalents for existing power switch devices, where customers need improved product supply.30.01.2024 13:30:00Jannews_2024-02-15_14.jpg\images\news_2024-02-15_14.jpghttps://www.diodes.com/about/news/press-releases/dual-channel-high-side-switches-from-diodes-incorporated-provide-robust-protection-for-automotive-applications/diodes.com
Dedicated Website: Alternative Energy Resource Hub with Trusted Products for Design EngineersOn a dedicated website Mouser Electronics now prov...11778Product ReleaseDedicated Website: Alternative Energy Resource Hub with Trusted Products for Design EngineersOn a dedicated website Mouser Electronics now provides engineers with key information to solve today's design challenges through its dedicated alternative energy resource centre, featuring a comprehensive selection of content, products and solutions. Readers will discover uses of renewable power, insights into commercial and industrial electric vehicles, and learn how energy storage systems will be key for the transition to renewable energy. The content offers perspectives on the alternative energy landscape, providing a deeper look into policy changes, energy harvesting practices and energy storage installation parameters. The resource centre is a collection of articles, blogs, and videos.30.01.2024 11:30:00Jannews_2024-02-15_12.jpg\images\news_2024-02-15_12.jpghttps://resources.mouser.com/alternative-energymouser.com
More Discrete Semiconductors on the LinecardTTI Europe has become an authorized distributor of...11746Industry NewsMore Discrete Semiconductors on the LinecardTTI Europe has become an authorized distributor of Panjit semiconductors. Doing so TTI adds a range of diodes, MOSFETs, protection devices, IGBTs, SiC devices, and ICs to its linecard. Panjit has manufactured semiconductor discrete components, including diodes, Transient Voltage Suppressors (TVS) and transistors for more than 30 years. The company has a wide range of MOSFET, IGBT, FRED, Schottky, ESD Array and SiC devices, bipolar junction transistors, bridges and more, which are suited for markets such as data centres, industrial control, automotive, electric vehicles and 5G. On the picture you see – from left to right: Markus Walz, Business Development Manager TTI Europe; Alla Zoubar-Bloch, Sales Manager Central and Northern Europe, Panjit; Karen Lee, Managing Director Europe, Panjit; Joerg Frodl, Director Product Marketing Europe Passives & Discretes TTI Europe.29.01.2024 07:00:00Jannews_2024-02-01_1.jpg\images\news_2024-02-01_1.jpghttps://www.ttieurope.com/content/ttieurope/en/about-tti/news-center/corporate-news/press-releases/2024/january/pr-01292024-tti-europe-distributor-panjit-semiconductors.htmlttieurope.com
Joint Lab for NEV Developments with GaN and SiC TechnologyNavitas Semiconductor and SHINRY announced the ope...11750Industry NewsJoint Lab for NEV Developments with GaN and SiC TechnologyNavitas Semiconductor and SHINRY announced the opening of a joint R&D power laboratory to accelerate the development of New-Energy Vehicle (NEV) power systems enabled by Navitas' GaNFast&trade; technology. SHINRY is active in on-board power supplies and strategic supplier to Honda, Hyundai, BYD, Geely, XPENG, BAIC and other automobile manufacturers. The joint lab accelerates development projects, with GaN technology combining with system-design skills and engineering talent to enable higher high power density, lightweight, efficient designs that translate to faster charging and extended range, with faster time-to-market. Navitas' own dedicated EV system Design Center, located in Shanghai will provide comprehensive technical support for the joint lab. Navitas will not only supply SHINRY with power devices, but will also engage in system-level R&D from the initial stages of product specification and design, through to test platforms and customized packaging solutions. The result will be more efficient, higher power density, more reliable, and cost-effective power systems for NEVs.25.01.2024 11:00:00Jannews_2024-02-01_5.jpg\images\news_2024-02-01_5.jpghttps://navitassemi.com/navitas-and-shinry-accelerate-new-energy-vehicle-developments-with-next-gen-power-semiconductors/navitassemi.com
Joint Innovation Application Center for PD fast charging and and CO2-saving SolutionsInfineon Technologies announced its joint Innovati...11772Industry NewsJoint Innovation Application Center for PD fast charging and and CO<sub>2</sub>-saving SolutionsInfineon Technologies announced its joint Innovation Application Center in Shenzhen with Anker Innovations, a company which is very active in charging technology. With the center already fully operating, it is paving the way for more energy-efficient and CO<sub>2</sub>-saving charging solutions that support decarbonization. Driven by the growing consumer demand for faster charging solutions due to an increasing usage of mobile devices, laptops and other battery-powered devices, the idea of establishing an Anker-Infineon Innovation Application Center dated back to 2021. After two years of preparation, this Innovation Application Center now serves as application hub for local partners to develop power-delivery (PD) fast charging solutions with higher power density, mainly based on Infineon's next-generation Hybrid Flyback (HFB) controller product family and the CoolGaN IPS for fast chargers above 100W. With the Innovation Application Center also intend to shorten the application cycle and accelerate the time to market for future products. Beyond charging solutions, the joint lab is focusing on a more diversified range of consumer applications using semiconductors based on wide-bandgap materials such as GaN.25.01.2024 11:00:00Jannews_2024-02-15_6.jpg\images\news_2024-02-15_6.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202401-050.htmlinfineon.com
Head of Sales for Passives and Electromechanical ComponentsWürth Elektronik eiSos combines sales for the prod...11749PeopleHead of Sales for Passives and Electromechanical ComponentsWürth Elektronik eiSos combines sales for the product groups 'passive and electromechanical components' into a single management structure. The Head of Sales in the new structure is Heiko Arnold. He was previously responsible for the sales of passive components in Germany, has now also taken over responsibility for the sales of electromechanical components. Heiko Arnold has been with Würth Elektronik eiSos for 24 years and looks back over more than 20 years of national and international management experience in sales. He points out: "We always see Sales and Customer Service in its entirety."25.01.2024 10:00:00Jannews_2024-02-01_4.jpg\images\news_2024-02-01_4.jpghttps://www.we-online.com/en/news-center/press?d=head-of-saleswe-online.com
Compact SOT-223-3 600V MOSFETs for Smaller, Lower Profile DesignsROHM Semiconductor announced a lineup of compact 6...11762Product ReleaseCompact SOT-223-3 600V MOSFETs for Smaller, Lower Profile DesignsROHM Semiconductor announced a lineup of compact 600V Super Junction MOSFETs, the R6004END4 / R6003KND4 / R6006KND4 / R6002JND4 / R6003JND4. These devices are well-suited for small lighting power supplies, pumps, and motors. Compared to the conventional TO-252 package (6.60mm × 10.00mm × 2.30mm), ROHM's products reduce area and thickness by 31% and 27%, contributing to smaller, lower profile applications. At the same time, the same footprint as the TO-252 package can be used, enabling mounting on existing circuit boards without modification. Offering distinctive features, three of the models are optimized for compact power supplies. The R6004END4, characterized by low noise, is suitable for applications where noise is a concern, while the R6003KND4 and R6006KND4, capable of high-speed switching, are designed for sets requiring low loss, high efficiency operation. The R6002JND4 and R6003JND4 utilize proprietary PrestoMOS technology to achieve significantly lower switching losses by speeding up reverse recovery time (trr) to typically 40ns or, respectively, 42ns, making them well-suited for motor-equipped devices. These devices' gate capacities QGS at 15V are specified to be 7nC and, respectively, 8nC.24.01.2024 12:30:00Jannews_2024-02-01_17.jpg\images\news_2024-02-01_17.jpghttps://www.rohm.com/news-detail?news-title=2024-01-24_news_sjmos&defaultGroupId=falserohm.com
100V MOSFET in Double-Sided Cooling DFN 5x6 Package for almost 200AAlpha and Omega Semiconductor announced the AONA66...11760Product Release100V MOSFET in Double-Sided Cooling DFN 5x6 Package for almost 200AAlpha and Omega Semiconductor announced the AONA66916, which is a 100V MOSFET packaged in a top and bottom side cooling DFN 5 x 6 package. This package keeps the semiconductor products cooler. Typically, when using the standard DFN 5x6 package, the bottom contact is the main contributor for cooling, and most of the heat generated by the Power MOSFETs will be transferred to the PCB. This increases the PCB thermal management design considerations to meet system requirements. AOS' top and bottom cooling DFN 5x6 package enables heat transfer between the exposed top contact and heat sink due to its large surface contact area construction. This allows the device to achieve a low thermal resistance (Rthc-top max) of 0.5°C / W with results being transferred to the PCB board, enabling significant thermal performance improvements. The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS' standard DFN 5x6 package, eliminating the need to modify existing PCB layouts. AONA66916 has a maximum R<sub>DS(on)</sub> rating of 3.4mOhms and operates with a maximum junction temperature of 175°C. Its continuous drain current is specified to be 197A at 25°C.24.01.2024 10:30:00Jannews_2024-02-01_15.jpg\images\news_2024-02-01_15.jpghttps://aosmd.com/sites/default/files/2024-01/AONA66916_PR.pdfaosmd.com
New Headquarters and Manufacturing Center in Chandler, AZSaras Micro Devices has opened its new headquarter...11771Industry NewsNew Headquarters and Manufacturing Center in Chandler, AZSaras Micro Devices has opened its new headquarters and manufacturing facility in Chandler, Arizona. The decision to open the manufacturing center in Arizona is part of Saras' longer-term strategy to support its growth in the high-performance computing artificial intelligence /machine learning sectors and capitalize on the rapidly expanding semiconductor ecosystem in the region. The company is relocating its headquarters from Atlanta, Georgia, where its Research & Development Center will remain. The move involves a planned investment of over $50 million in the Chandler facility covering about 10,000 m<sup>2</sup> of clean room, manufacturing, and administrative space. Saras will employ approximately 50 people in the near term, which will be primarily composed of engineering talent. By the close of 2025, both the site and staff will undergo significant expansion, with a projected growth to more than 12.000 m<sup>2</sup>, inclusive of a larger clean room of about 12,000 m<sup>2</sup>. The proximity of the new headquarters to other key semiconductor ecosystem partners, coupled with Arizona's cost-effective operations and investment in talent development, uniquely positions Saras to capitalize on these strategic advantages while contributing to a robust domestic semiconductor industry.24.01.2024 10:00:00Jannews_2024-02-15_5.jpg\images\news_2024-02-15_5.jpghttps://www.sarasmicro.com/2024/01/25/saras-micro-devices-celebrates-grand-opening-of-new-headquarters-and-manufacturing-center-of-excellence-in-chandler-arizona/sarasmicro.com
SiC FET in D2PAK for 750V EV DesignsQorvo unveiled an automotive-qualified SiC FET off...11757Product ReleaseSiC FET in D2PAK for 750V EV DesignsQorvo unveiled an automotive-qualified SiC FET offering an R<sub>DS(on)</sub> of 9m&#8486; in a compact D2PAK-7L package. This 750V SiC FET is the first in a new family of pin-compatible SiC FETs from Qorvo with R<sub>DS(on)</sub> options up to 60m&#8486;, making them well suited for electric vehicle applications, including on-board chargers, DC/DC converters and PTC heater modules. The UJ4SC075009B7S features a 9m&#8486; typical R<sub>DS(on)</sub> at 25°C needed for reducing conduction losses and maximizing efficiency in high voltage, multi-kilowatt automotive applications. Its surface-mount package enables automated assembly flows. This 750V family complements Qorvo's existing 1200V and 1700V automotive SiC FETs in D2PAK packaging to form a complete portfolio addressing EV applications that span 400V and 800V battery architectures. These fourth generation SiC FETs leverage Qorvo's circuit configuration, in which a SiC JFET is co-packaged with a Si MOSFET to produce a device with the efficiency advantages of wide bandgap switch technology and the simpler gate drive of silicon MOSFETs. The key features of the UJ4SC075009B7S include a threshold voltage V<sub>G(th)</sub> of typically 4.5V allowing 0 to 15V drive, a body diode operating with a V<sub>FSD</sub> of 1.1V, a reverse recovery Q<sub>rr</sub> of 338nC and a gate charge Q<sub>G</sub> of 75nC. The AECQ101-qualified device operates at temperatures up to 175°C.24.01.2024 07:30:00Jannews_2024-02-01_12.jpg\images\news_2024-02-01_12.jpghttps://www.qorvo.com/newsroom/news/2024/qorvo-boosts-performance-in-750v-ev-designs-with-industry-leading-sic-fet-in-d2pakqorvo.com
Measurement Instruments in EuropeDistrelec announced the introduction of KPS test a...11755Industry NewsMeasurement Instruments in EuropeDistrelec announced the introduction of KPS test and measurement instruments for sale throughout Europe. KPS is a manufacturer of electrical measurement instruments for professional installers, electricians and technicians. The Distrelec portfolio now includes a DCM clamp meter that is manufactured in Europe. KPS keeps their EMEA stock in the North of Spain in order to enable fast deliveries to Distrelec, which is a trading brand of RS Group.23.01.2024 16:00:00Jannews_2024-02-01_10.jpg\images\news_2024-02-01_10.jpghttps://www.distrelec.biz/en/distrelec.biz
150mm and 200mm SiC Wafer Supply SecuredInfineon Technologies and Wolfspeed announced the ...11748Industry News150mm and 200mm SiC Wafer Supply SecuredInfineon Technologies and Wolfspeed announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon's general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and EV applications and energy storage systems. "As the demand for silicon carbide devices continues to increase, we are following a multi-source strategy to secure access to a high-quality, global and long-term supply base of 150mm and 200mm SiC wafers," said Jochen Hanebeck, CEO of Infineon Technologies. Furthermore, Infineon has formalized an agreement with silicon carbide supplier SK Siltron CSS earlier this year. Under the agreement, SK Siltron CSS will provide Infineon with competitive and high-quality 150-millimeter SiC wafers, supporting the production of SiC semiconductors. In a subsequent phase, SK Siltron CSS will play an important role in assisting Infineon's transition to a 200-millimeter wafer diameter. SK Siltron CSS partners with global semiconductor manufacturers by supplying compound semiconductor wafer solutions. SK Siltron CSS is a subsidiary of South Korea-based SK Siltron, a part of the SK Group.23.01.2024 09:00:00Jannews_2024-02-01_3.jpg\images\news_2024-02-01_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202401-049.htmlinfineon.com
Power Semiconductor Modules for EVs and PHEVsMitsubishi Electric Corporation announced the comi...11758Product ReleasePower Semiconductor Modules for EVs and PHEVsMitsubishi Electric Corporation announced the coming release of six J3-Series power semiconductor modules for various electric vehicles (xEV), featuring either a silicon carbide metal-oxide semiconductor field-effect transistor (SiC-MOSFET) or a RC-IGBT (Si), with compact designs and scalability for use in the inverters of EVs and PHEVs. All six J3-Series products will be available for sample shipments by the end of this quarter. In the xEV sector, power semiconductor modules are used widely in power conversion devices such as inverters for xEV drive motors. In addition to extending the cruising range of xEVs, compact, high-power, high-efficiency modules are needed to further downsize batteries and inverters. But due to the high safety standards set for xEVs, power semiconductors used in drive motors must be more reliable than those used in general industrial applications. Development of these SiC products was partially supported by Japan's New Energy and Industrial Technology Development Organization (NEDO).23.01.2024 08:30:00Jannews_2024-02-01_13.jpg\images\news_2024-02-01_13.jpghttps://www.mitsubishielectric.com/news/2024/0123.htmlmitsubishielectric.com
Head of Asia OperationsGuanghua Yang is the new Managing Director Asia & ...11754PeopleHead of Asia OperationsGuanghua Yang is the new Managing Director Asia & Vice President at SCHURTER, responsible for all activities of SCHURTER in Asia, including Sales, Marketing, Operations and R&D. Guanghua Yang has more than 30 years of experience, most of which he gained in technology companies in the field of electronic components. Prior to his appointment as Managing Director Asia & Vice President in the SCHURTER Group, he was General Manager & Vice President for Asia at C&K based in Shanghai, China. Earlier, he held other executive positions in sales and marketing. He holds a Bachelor of Science degree and an MBA degree from Tsinghua University.17.01.2024 15:00:00Jannews_2024-02-01_9.jpg\images\news_2024-02-01_9.jpghttps://www.schurter.com/en/news/new-head-of-asia-at-schurterschurter.com
AC/DC Frontend Modules with PFCGAIA Converter's AC/DC Power-Factor Corrected fron...11763Product ReleaseAC/DC Frontend Modules with PFCGAIA Converter's AC/DC Power-Factor Corrected front-end modules are compatible with common airborne AC input bus voltages and variable frequencies, while being particularly suited for use in centralized power architectures in conjunction with PoL or isolated DC modules. All of the modules meet the stringent requirements of DO-160, ABD-100, and Mil-Std-704 specifications. GAIA's AC/DC front-end modules have a soft-start, active current limitation, short circuit protection, and inhibit function. The soft-start/active current limitation prevents inrush current during start-up. The short circuit protection safeguards the module against short circuits by shutting down and restoring to normal when the overload is removed. The front end series operates under 50W with two isolated low voltage outputs. Series above 150W provide non-isolated high voltage output.17.01.2024 13:30:00Jannews_2024-02-01_18.jpg\images\news_2024-02-01_18.jpghttps://www.gaia-converter.com/product-overview/ac-dc-power-factor-corrected/gaia-converter.com
MIL-COTS DC/DC Front-End FiltersP-DUKE has developed the MCF series of MIL-COTS DC...11756Product ReleaseMIL-COTS DC/DC Front-End FiltersP-DUKE has developed the MCF series of MIL-COTS DC/DC front-end filters, meeting the requirements of MIL-STD 1275E (28V DC electrical systems in military vehicles) and MIL-STD 461 (electromagnetic interference control for subsystems and equipment). These filters accept 9-36VDC input voltage, making them suitable for with 28V or 24V bus systems offering up to 250W output power. The devices are also applicable to heavy industrial and rolling stock applications. The MCF series features active input over-voltage protection, clamping over-voltages for up to 50ms to a safe level of 40V, and absorbing +/-250V spikes. With additional MLCCs, the internal EMI filter meets MIL-STD 461G limits. It also includes various active protection functions for advanced protection of the DC/DC converter module. The MCF filter module is fully integrated also meet environmental MIL-STD 810F specifications for shock and vibration and have an operating temperature range of -40°C to 105°C (optionally -55°C).17.01.2024 06:30:00Jannews_2024-02-01_11.jpg\images\news_2024-02-01_11.jpghttps://www.pduke.com/news_detail28_140.htmpduke.com
Automation1 XA4 1- or 2-Axis PWM Servo DriveFor precision motion control in industrial and res...11766Product ReleaseAutomation1 XA4 1- or 2-Axis PWM Servo DriveFor precision motion control in industrial and research systems Aerotech introduced the XA4 1- or 2-Axis HyperWire Multi-Axis PWM Servo Drives. These dual- and single-axis drives enable machine builders to experience Automation1 precision on all of their systems. The simplified dual-axis XA4 brings control to multiple axes of motion in the same machine footprint. Built on Automation1 motion control technology, the XA4 communicates to Automation1 PC- and drive-based controller products over the HyperWire motion bus, supports multiple feedback device types and includes on-board memory. The amplifiers control brushless AC, brush DC, voice coil and stepper motor types at up to 340V<sub>DC</sub> operating voltage and 20A peak current capability.16.01.2024 16:30:00Jannews_2024-02-01_21.jpg\images\news_2024-02-01_21.jpghttps://www.aerotech.com/press-releases/premier-precision-motion-control-for-less/aerotech.com
MOSFET Relays Extend Capacity and Operating TemperatureOmron Electronic Components has expanded its MOSFE...11781Product ReleaseMOSFET Relays Extend Capacity and Operating TemperatureOmron Electronic Components has expanded its MOSFET relay line-up to offer higher operating temperature and enhanced capacity in a high-current six-pin DIP format. Omron's G3VM-63BR and G3VM-63ER extend the company's 60V DIP6 MOSFET relay range up to 0.7A continuous load current. Operating from -40 to 110 deg C, these MOSFET relays contribute to much smaller and denser equipment than equivalent mechanical devices. Power consumption on the input is lower compared to all electromechanical relays, but especially reed relays, further contributing to energy-saving equipment. Maximum resistance with output ON is typically 0.3&#8486; (0.1&#8486;. with connection C), whilst typical capacitance between output terminals is specified as 520pF. Their maximum trigger LED forward current is 2mA, whilst turn ON time and OFF times are 2ms and 3ms respectively. For factory automation applications, the models have NC contacts allowing status output to linked devices including power OFF status. The relays can also be used alongside the NO contact type, enabling switching control of multiple loads with just one input control. Applications in factory automation include PLCs machine tools, inverters, robot controllers, temperature control together with fire, gas or smoke alarm systems. Further uses for the G3VM-63ER extend to sensor signal transfer and output signal switching - for example with gas detection and similar alarm applications.16.01.2024 14:30:00Jannews_2024-02-15_15.jpg\images\news_2024-02-15_15.jpghttps://components.omron.com/eu-en/products/relays/G3VM-63BR-63ERomron.com
Addition to the Line Card: Rugged ConnectorsAvnet Abacus will be selling the portfolio of rugg...11751Industry NewsAddition to the Line Card: Rugged ConnectorsAvnet Abacus will be selling the portfolio of rugged DEUTSCH connectors from TE Connectivity. The DEUTSCH family of environmentally sealed electrical connectors has been a solution for industrial and commercial vehicles and other applications for more than 40 years, especially where dirt, moisture, salt spray and vibration can otherwise contaminate or damage electrical connections. It includes the HD and DT ranges of robust-circular and rugged-rectangular connectors, respectively, especially designed for industrial and commercial vehicle applications.16.01.2024 12:00:00Jannews_2024-02-01_6.jpg\images\news_2024-02-01_6.jpghttps://my.avnet.com/abacus/about-us/about-avnet-abacus/news/avnet-abacus-gains-distribution-franchise-for-te-rugged-deutsch-connectors//avnet.com
Automotive Step-down Switching Regulators save Board SpaceABLIC now offers the S-19954/5 Series of automotiv...11759Product ReleaseAutomotive Step-down Switching Regulators save Board SpaceABLIC now offers the S-19954/5 Series of automotive step-down switching regulators operating at 5.5V with a 1A output and housed in HSNT-8(1616)B packages (1.6 x 1.6 x t0.41mm<sup>3</sup>). The device enables an efficiency of up to 95% when delivering an output current of 1A at output voltages of 0.8 to 3.3V from an input voltage between 2.7 and 5.5V. In addition, while the circuit configuration of conventional switching regulators required five or more external components, the S-19954/5 Series has an integrated feedback resistance circuit and phase compensation circuit to set the output voltage, which makes it possible to configure an application circuit using just one small coil and two capacitors. These characteristics allow the S-19954/5 Series to result in a 45% reduction compared to conventional products. The S-19954/5 Series is also equipped with a power good function for output voltage monitoring. Furthermore, the S-19954/5 Series is also PPAP (Production Part Approval Process) capable and planned for compliance with Grade 1 of the AEC-Q100 quality standard for automotive ICs. Typical applications are secondary power supplies for automotive devices as well as camera modules and other automotive applications.16.01.2024 09:30:00Jannews_2024-02-01_14.jpg\images\news_2024-02-01_14.jpghttps://www.ablic.com/en/semicon/news/2024/01/16/s-19954-19955/ablic.com
R&D Manager at Swedish GaN-on-SiC Semiconduductor ManufacturerAnders Lundskog is the new R&D manager at SweGaN, ...11747PeopleR&D Manager at Swedish GaN-on-SiC Semiconduductor ManufacturerAnders Lundskog is the new R&D manager at SweGaN, a European semiconductor manufacturer that develops and produces custom-made Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers. Anders Lundskog has a background in process development for GaN materials at Infineon and system engineering from Saab, He holds a Doctor of Philosophy (Ph.D.), Materials Science, and Master of Science (MSc), Applied Physics and Electrical Engineering, from Linköping University of Technology. Spurred by significant interest in volume orders from major customers, in 2023 SweGaN announced the construction of a new production facility in Linköping Sweden to embrace global demand - with prognosis for production is Q1 2024. SweGaN's strategy is closely aligned with the accelerated global demands for GaN-on-SiC epiwafers used in 5G telecommunications infrastructure, defense radars, satellite communications and high voltage power switches.16.01.2024 08:00:00Jannews_2024-02-01_2.jpg\images\news_2024-02-01_2.jpghttps://swegan.se/2966/swegan.se
Partnership in Power ProductsAcal BFi now partners with Delta Electronics. The ...11752Industry NewsPartnership in Power ProductsAcal BFi now partners with Delta Electronics. The collaboration between Acal BFi and Delta Electronics combines their expertise and resources for providing solutions to develop power optimised applications, reduce costs, and achieve sustainable solutions. Delta Electronics core competence is in high-efficiency power electronics. Under this partnership, Acal BFi and Delta Electronics will leverage their respective strengths and capabilities to offer customers a suite of power technology solutions along with industry knowledge, and the ability to deliver tailor-made solutions in areas such as renewable energy, factory automation, machine automation, medical equipment.13.01.2024 13:00:00Jannews_2024-02-01_7.jpg\images\news_2024-02-01_7.jpghttps://www.acalbfi.com/uk/news-and-insights/new-partnership-delta-electronicsacalbfi.com
Overtemperature Detection Solution for EV Li-ion Battery PacksWith its TTape&trade; solution Littelfuse introduc...11764Product ReleaseOvertemperature Detection Solution for EV Li-ion Battery PacksWith its TTape&trade; solution Littelfuse introduces an overtemperature detection platform designed to transform the management of Li-ion battery systems. TTape helps vehicle systems manage premature cell aging effectively while reducing the risks associated with thermal runaway incidents. It is well-suited for a wide range of applications, including automotive EV/HEVs, commercial vehicles, and Energy Storage Systems (ESS). Its distributed temperature monitoring capabilities enable detection of localized cell overheating, thereby improving battery life and enhancing the safety of battery installations. With a single TTape device, multiple cells can be monitored, thus alerting the BMS sooner in case of overtemperature scenarios with a response time of less than one second. Calibration isn't necessary because TTape can directly integrate with existing BMS. The TTape Distributed Temperature Monitoring Platform is available in tape and reel or box packaging, depending on the length required.11.01.2024 14:30:00Jannews_2024-02-01_19.jpg\images\news_2024-02-01_19.jpghttps://www.littelfuse.com/about-us/news/news-releases/2024/littelfuse-unveils-advanced-overtemperature-detection-solution-for-electric-vehicle-li-ion-battery-packs.aspxlittelfuse.com
Renesas to Acquire Transphorm: Expanding its Power Portfolio with GaN TechnologyRenesas Electronics and Transphorm announced that ...11724Industry NewsRenesas to Acquire Transphorm: Expanding its Power Portfolio with GaN TechnologyRenesas Electronics and Transphorm announced that they have entered into a definitive agreement pursuant to which a subsidiary of Renesas will acquire all outstanding shares of Transphorm's common stock. The transaction values Transphorm at approximately $339 million. The acquisition will provide Renesas with in-house GaN technology, which is described by Renesas to be "a key next-generation material for power semiconductors, expanding its reach into fast-growing markets such as EVs, computing (data centers, AI, infrastructure), renewable energy, industrial power conversion and fast chargers/adapters". Renesas claims that demand for GaN is predicted to grow by more than 50 percent annually. Renesas will implement Transphorm's auto-qualified GaN technology to develop new enhanced power solution offerings, such as X-in-1 powertrain solutions for EVs, along with computing, energy, industrial and consumer applications. The board of directors of Transphorm has unanimously approved the definitive agreement with respect to the transaction and recommended that Transphorm stockholders adopt such definitive agreement and approve the merger. The transaction is expected to close in the second half of calendar year 2024, subject to Transphorm stockholder approval, required regulatory clearances and the satisfaction of other customary closing conditions. In other news Renesas had already announced the establishment of an in-house SiC production line, supported by a 10 year SiC wafer supply agreement.11.01.2024 06:00:00Jannews_2024-01-15_1.jpg\images\news_2024-01-15_1.jpghttps://www.renesas.com/us/en/about/press-room/renesas-acquire-transphorm-expand-its-power-portfolio-gan-technologyrenesas.com
APEC 2024 Provides Childcare During the Conference and ExhibitionOnsite at APEC 2024, day-long childcare for childr...11732Event NewsAPEC 2024 Provides Childcare During the Conference and ExhibitionOnsite at APEC 2024, day-long childcare for children of attendees will be available during the conference and exhibition. In order to use these services attendees must sign up for them by Jan. 29, 2024. In order to do so the Applied Power Electronics Conference (APEC) has partnered with KiddieCorp which will provide on-site childcare services from 8:00 a.m. to 5:00 p.m., from Tuesday to Thursday (Feb. 27-29). Conveniently located at the Hyatt Regency, Long Beach, the services will enable APEC-registered parents to attend the conference and exhibition in the Long Beach Convention Center while their children are cared for next door. The KiddeCorp team is prepared to closely monitor and entertain kids aged 3-12 years with numerous activities designed to ensure they have age-appropriate fun. KiddieCorp employees are trained in first aid, CPR and emergency response preparedness, so parents can have peace of mind while navigating the exhibit floor, attending conference sessions or participating in the Spouse and Guest program events. "Providing childcare will encourage power electronics professionals to bring their families to APEC 2024 knowing their children will be cared for and entertained while they attend sessions and other activities," said Tim McDonald, APEC 2024 General Chair. "This service, combined with the Spouse and Guest Hospitality program offering excursions to Catalina and whale-watching, will provide a memorable experience in Long Beach for the entire family."10.01.2024 14:30:00Jannews_2024-01-01_9.jpg\images\news_2024-01-01_9.jpghttps://apec-conf.org/apec-conf.org
STMicroelectronics Announces new OrganizationSTMicroelectronics moves from three to two product...11731Industry NewsSTMicroelectronics Announces new OrganizationSTMicroelectronics moves from three to two product groups, AMPS and MDRF. The Analog, Power & Discrete, MEMS and Sensors Group (APMS) will be led by Marco Cassis, ST President and member of the Executive Committee, and the Microcontrollers, Digital ICs and RF products group (MDRF) will be led by Remi El-Ouazzane, ST President and member of the Executive Committee. The APMS Product Group will include all ST analog products, including Smart Power solutions for automotive as well as all ST Power & Discrete product lines including Silicon Carbide products complemented by MEMS and Sensors. APMS will include two Reportable Segments: Analog products, MEMS and Sensors (AM&S); Power and discrete products (P&D). The MDRF Product Group will include all ST digital ICs and microcontrollers, including automotive microcontrollers but also RF, ADAS, Infotainment ICs. MDRF will include two Reportable Segments: Microcontrollers (MCU) as well as Digital ICs and RF Products (D&RF). Concurrent with this new organization Marco Monti, ST President of the former Automotive and Discrete Product Group, will leave the company. To complement the existing Sales & Marketing organization, a new application marketing organization by end market will be implemented across all ST Regions. This will provide ST customers with end-to-end system solutions based on the company's product and technology portfolio. The application marketing organization will cover the following four end markets: Automotive / Industrial Power and Energy / Industrial Automation, IoT and AI / Personal Electronics, Communication Equipment and Computer Peripherals. The current regional Sales & Marketing organization remains unchanged.10.01.2024 13:30:00Jannews_2024-01-15_8.jpg\images\news_2024-01-15_8.jpghttps://newsroom.st.com/media-center/press-item.html/c3225.htmlst.com
Acquisition of 1500 VDC Converter Technology and TeamDanfoss Drives has announced the acquisition of th...11730Industry NewsAcquisition of 1500 VDC Converter Technology and TeamDanfoss Drives has announced the acquisition of the ACE300 product and the takeover of the product team from Finland-based company Ampner to extend the electrification portfolio with a dedicated 1500 VDC power converter. The product will be integrated within Danfoss Drives' portfolio of Electrification Solutions with primary focus on Smart Grids and energy storage. Mika Kulju, President of the Danfoss Drives business, says: "With 2030 climate targets becoming ever more imminent, decarbonization via electrification is accelerating in multiple sectors. There is a growing trend in all focus application areas where 1500 V DC is starting to play a key role. This is a big step for Danfoss Drives in ensuring a complete electrification offering, thus securing the right solutions for our customers in their electrification projects."10.01.2024 12:30:00Jannews_2024-01-15_7.jpg\images\news_2024-01-15_7.jpghttps://www.danfoss.com/en/about-danfoss/news/dds/danfoss-acquires-1500-VDC-converter-technology-and-extends-electrification-portfolio/danfoss.com
GaN FETs Enable 75 - 231 Ampere Laser Diode Control in Nanoseconds for LidarEPC launches three laser driver boards dubbed EPC9...11741Product ReleaseGaN FETs Enable 75 - 231 Ampere Laser Diode Control in Nanoseconds for LidarEPC launches three laser driver boards dubbed EPC9179, EPC9181 and EPC9180 containing pulse current laser drivers of 75 A, 125 A, and 231 A, showcasing EPC's AEC-Q101-qualified GaN FETs. These FETs (EPC2252, EPC2204A, and EPC2218A) are 30% smaller and said to be more cost-effective than their predecessors. Designed for both long and short-range automotive lidar systems, these boards expedite solution evaluation with varied input and output options. All boards share identical functionality, differing only in peak current and pulse width. Utilizing a resonant discharge power stage, they employ a ground-referenced GaN FET driven by LMG1020 gate driver. The GaN FET's ultrafast switching enables rapid discharge of a charged capacitor through the load's stray inductance, enabling peak discharge currents of tens to hundreds of amps within nanoseconds. The PCB is designed to minimize power loops and common source inductance while offering mounting flexibility for laser diodes or alternative loads. To enhance user-friendliness, all boards ship with EPC9989 interposer PCBs, featuring various footprints to accommodate a variety of laser diodes or other loads. Customers can choose one that meets their needs to evaluate the GaN solutions. The EPC9179/81/80 boards are triggered from 3.3V logic or differential logic signals such as LVDS. For single-ended inputs, the boards can operate with input voltages down to 2.5V or 1.8V with a simple modification. EPC provides full schematics, BOM, PCB layout files and a quick start guide on its website.09.01.2024 14:30:00Jannews_2024-01-15_17.jpg\images\news_2024-01-15_17.jpghttps://epc-co.com/epc/about-epc/events-and-news/news/artmid/1627/articleid/3156/gan-fets-enable-75-231-ampere-laser-diode-control-in-nanoseconds-for-advanced-automotive-autonomyepc-co.com
Collaboration on Magnetic Components for ConvertersITG Electronics has announced a collaboration with...11729Industry NewsCollaboration on Magnetic Components for ConvertersITG Electronics has announced a collaboration with Renesas Electronics to develop a generation of magnetic components for 54V/48V to 12V converters. The effort specifically targets applications in the artificial intelligence (AI) and data center power conversion sectors. The collaboration's latest initiative involves 48V onboard power delivery solutions. The solutions – called Renesas P/N RAA228006/RAA226054 and ITG P/N SLA694719C-2R2MHF by the two companies – can deliver 1,000 W per phase. ITG P/N SLA694719C-2R2MHF is rated 0.65mOhm and achieves an elevated current rating of 42 A. Compared to conventional 750W transformers, ITG's enhanced version provides a 46% reduction in transformer DC resistance (DCR), resulting in substantially reduced overall power loss.09.01.2024 11:30:00Jannews_2024-01-15_6.jpg\images\news_2024-01-15_6.jpghttps://itg-electronics.com/en/series/913itg-electronics.com
Professional Test & Measurement Solutions at APECAPEC 2024 will be held in Long Beach, California o...11725Industry NewsProfessional Test & Measurement Solutions at APECAPEC 2024 will be held in Long Beach, California on February 25-29, 2024. Professional power test solution provider-ITECH Electronics, will show on APEC 2024 with their power electronics testing instruments and solutions, we cordially invite you to stop by ITECH booth No.1659. ITECH will show all series of T&M instrument products. ITECH new upgraded AC source products such as IT7800, IT7900 and IT7900P will appear at the show, help you challenge MW level test. And you will see our star product IT6000C Bi-directional DC power supply, which adopts the third generation SiC-base technology and integrates the source and sink function in one unit. Also, we will show another explosive product IT-M series, featuring "compact structure" and "high power density", which give users a wide range of choices to meet the diverse testing demands. The IT2800 SMU, winner of three T&M awards in 2023, will also make its debut at APEC. ITECH has brought over 1000 models products to global market, always focusing on innovation, owning 140+ patents and products have been awarded by top international media. ITECH is always stepping forward with their state-of-the-art testing technology. Meet ITECH on APEC 2024!09.01.2024 07:00:00Jannews_2024-01-15_2.jpg\images\news_2024-01-15_2.jpghttps://www.itechate.com/en/itechate.com
EC-Q200 compliant Planar Signal BMS Transformer for High Voltage ApplicationsMeeting the need for planar technology that can pr...11773Product ReleaseEC-Q200 compliant Planar Signal BMS Transformer for High Voltage ApplicationsMeeting the need for planar technology that can provide reliable and safe communication in a growing group of high voltage electric vehicle (EV) and other high energy storage systems, Bourns' AEC-Q200 compliant SM91806 Planar Signal BMS Transformer meets basic electric insulation requirements per IEC 60664-1, IEC 61558-1 and IEC 62368-1 standards. Planar-style signal transformers have been introduced to increase design flexibility and robustness. They are also known to deliver cost efficiency and reliability advantages over conventional wire wound transformer designs due to their multilayer PCB isolation and full automation. Offering these benefits and more, Bourns' planar signal BMS transformer features a working voltage up to 1000 V<sub>DC</sub>, superior clearance/creepage distance features and complies with Overvoltage Category II. It also provides a partial discharge level up to 1200 V for ESS usage.09.01.2024 06:30:00Jannews_2024-02-15_7.jpg\images\news_2024-02-15_7.jpghttps://www.bourns.com/news/press-releases/pr/2024/01/09/bourns-engineers-industry's-first-planar-signal-bms-transformerbourns.com
Industry Veteran now CEOQPT has appointed Rupert Baines as its CEO with ef...11753PeopleIndustry Veteran now CEOQPT has appointed Rupert Baines as its CEO with effect from 1 April 2024. He is a veteran of the semiconductor industry with C-level roles including CEO of UltraSoC (sold to Siemens) and CMO of Codasip. QPT is active in developing next generation GaN-based motor drives.08.01.2024 14:00:00Jannews_2024-02-01_8.jpg\images\news_2024-02-01_8.jpghttps://www.q-p-t.com/press-releases/rupert-baines-appointed-ceo-at-qptq-p-t.com
Power Conversion Company buys Provider of Transformers, Inductors and PD EquipmentAstrodyne has acquired Powertronix, a provider of ...11770Industry NewsPower Conversion Company buys Provider of Transformers, Inductors and PD EquipmentAstrodyne has acquired Powertronix, a provider of toroidal transformers, AC and DC inductors and power distribution equipment. Powertronix provides power transformers, specialty transformers, power solutions, and AC and DC inductors for highly demanding OEMs in the medical, industrial, and semiconductor fabrication equipment markets, worldwide. Powertronix is particularly adept at guiding customers through complex qualification processes and developing special solutions that meet the safety requirements of highly regulated applications, such as robotic-assisted surgery. Powertronix will remain headquartered in Foster City, California and will continue to use the Powertronix brand. The terms of the transaction were not disclosed.08.01.2024 09:00:00Jannews_2024-02-15_4.jpg\images\news_2024-02-15_4.jpghttps://www.astrodynetdi.com/news/astrodyne-tdi-expands-portfolio-through-acquisition-of-powertronixastrodynetdi.com